Perimeter seal reinforcement holes for plastic LCDs

• US 4,482,213 A
• Filed: 11/23/1982
• Issued: 11/13/1984
• Est. Priority Date: 11/23/1982
• Status: Expired due to Fees

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Sampsell, Jeffrey B., Penz, Perry A., Piliavin, Michael A.
• Primary Examiner(s): Corbin, John K.
• Assistant Examiner(s): Lewis, David
• Application Number:
  US06/444,263
• Time in Patent Office: 721 Days
• Field of Search: 350/334, 350/343, 350/589, 350/590, 206/484, 383/119
• US Class Current: 349/153
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells

Abstract

To increase the perimeter seal strength of plastic LCDs, reinforcement holes are formed in the plastic substrate at the maximum stress points. These holes, which are not in contact with any active area of the device, are filled with glue, so that each pair of holes in the upper and lower substrates forms a tensile connection which directly links the two substrates together at the maximum stress points.

Claims

1. A method for assembling a liquid crystal device, comprising the steps of:

providing first and second flexible substrates, each said substrate being provided with a conductor layer, and an alignment layer over said conductor layer, on a first surface thereof;

providing reinforcement holes near the perimeter of at least one said substrate;

providing glue around the perimeter of said first face of at least one of said substrates; and

gluing said first and second substrates together, so that said glue forms a perimeter seal to define an enclosed cavity between said first substrate and said second substrate, and introducing glue into said reinforcement holes.

2. The method of claim 1, wherein a fill hole is defined in at least one of said substrates, and further comprising the subsequent steps of:

filling said cavity with liquid crystal material, said liquid crystal material being introduced through said fill hole; and

sealing said fill hole.

3. The method of claim 2, wherein each said substrate comprises stretched polyester.

4. The method of claim 1, wherein said first and second substrates are separated at said perimeter glue seal by a spacer.

5. The method of claim 1, wherein a first glue composition is provided around the perimeter of said first face of at least one of said substrates, and a second glue composition is introduced into said reinforcement holes, said second glue composition having a greater tensile strength than said first glue composition.

6. The method of claim 1, wherein said step of providing holes is performed after said step of gluing said substrates together.

7. The method of claim 1, wherein said substrates are rectangular, and wherein reinforcement holes are formed at the corners of said substrates.

8. A liquid crystal device, comprising:

a first substrate comprising a flexible material, said first substrate having a conductor layer, and an alignment layer on said conductor layer, on at least a central portion of a first surface of said substrate;

a second substrate, comprising a flexible material, said first substrate having a conductor layer, and an alignment layer on said conductor layer, on at least a central portion of a first surface of said substrate;

said first and second substrates being joined along the respective primeters thereof by a glue seal, said glue seal extending along substantially the entire perimeter of said first and second substrates, said first and second substrates being joined so that said first surfaces of both said substrates mutually face together and define a cavity therebetween;

a liquid crystal material filling said cavity;

at least one said substrate containing reinforcement holes near the perimeter of said first face thereof, said holes being at least partially filled with hardened glue.

9. The device of claim 8, wherein said holes formed in said respective substrates are not in contact with said liquid crystal material.

10. The device of claim 8, wherein said holes are provided in the perimeter of said substrates at at least the maximum stress portions of said device.

11. The device of claim 8, wherein said reinforcement holes are provided intermittently around the entirely perimeter of each said substrate.