Polishing method for electrophotographic photoconductive member
First Claim
1. A method of polishing an electrophotographic conductive member, which comprises polishing said member with polishing particles selected from the group consisting of (1) solid organic polishing particles composed of a polysilsesquioxane having, on its silicon atoms, substituents selected from the group consisting of a lower alkyl group having 2 to 5 carbon atoms, an alkoxy group, an aryl group and an aralkyl group;
- (2) a combination of said solid organic polishing particles and solid inorganic polishing particles in a weight ratio of 9;
1 to 1;
9; and
(3) a combination of solid organic polishing particles composed of polymethylsilsesquioxane and solid inorganic polishing particles in a weight ratio of 9;
1 to 1;
9.
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Abstract
A method of polishing an electrophotographic photoconductive member, which comprises polishing said surface with polishing particles selected from the group consisting of solid organic polishing particles composed of a polysilsesquioxane having, on its silicon atoms, substituents selected from a lower alkyl group having 2 to 5 carbon atoms, an alkoxy group, an aryl group and an aralkyl group; a combination of said solid organic polishing particles and solid inorganic polishing particles; and a combination of solid organic polishing particles composed of polymethylsilsesquioxane and solid inorganic polishing particles.
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Citations
11 Claims
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1. A method of polishing an electrophotographic conductive member, which comprises polishing said member with polishing particles selected from the group consisting of (1) solid organic polishing particles composed of a polysilsesquioxane having, on its silicon atoms, substituents selected from the group consisting of a lower alkyl group having 2 to 5 carbon atoms, an alkoxy group, an aryl group and an aralkyl group;
- (2) a combination of said solid organic polishing particles and solid inorganic polishing particles in a weight ratio of 9;
1 to 1;
9; and
(3) a combination of solid organic polishing particles composed of polymethylsilsesquioxane and solid inorganic polishing particles in a weight ratio of 9;
1 to 1;
9. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- (2) a combination of said solid organic polishing particles and solid inorganic polishing particles in a weight ratio of 9;
Specification