Method of depositing a carbon film on a substrate and products obtained thereby

• US 4,486,286 A
• Filed: 09/28/1982
• Issued: 12/04/1984
• Est. Priority Date: 09/28/1982
• Status: Expired due to Fees

• Current Assignee: TECHNION RESEARCH AND DEVELOPMENT FOUNDATION, LTD.
• Original Assignee: Nerken Research Corporation, TECHNION RESEARCH AND DEVELOPMENT FOUNDATION, LTD.
• Inventors: Nir, Dan, Lewin, Gerhard
• Primary Examiner(s): Demers, Arthur P.
• Application Number:
  US06/425,704
• Time in Patent Office: 798 Days
• Field of Search: 204/192 F, 204/192 C, 204/192 E, 204/192 EC, 428/408
• US Class Current: 204/192.11
• CPC Class Codes: A61F 2310/00574 Coating or prosthesis-covering structure made of carbon, e.g. of pyrocarbon
• CPC Class Codes: A61L 27/303 Carbon
• CPC Class Codes: C23C 14/32 by explosion; by evaporation and subsequent ionisation of the vapours , e.g. ion-platingC23C14/34 - C23C14/48 take precedence
• CPC Class Codes: C23C 16/276 using plasma jets
• CPC Class Codes: C23C 16/277 using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

There is disclosed a method for depositing a diamond or diamond-like carbon film on at least one substrate employing a hydrocarbon gas and at least one gas which preferentially removes by chemical sputtering other forms of carbon, especially graphite from said film to thereby obtain useful carbon film coated products.

Claims

1. A method of forming a diamond-like carbon film on a substrate comprising:

(a) providing a source of carbon ions;

(b) directing carbon ions to a substrate under conditions producing a diamond-like carbon film which may contain other forms of carbon;

(c) providing a source of second ions from a non-hydrocarbon gas in greater than an impurity amount capable of preferentially removing said other forms of carbon by chemical sputtering; and

(d) directing said second ions to said substrate under conditions effective to promote the preferential chemical sputtering of said other forms of carbon in said film.

2. The method of claim 1 wherein said carbon ions and said second ions are simultaneously directed to said substrate.

3. The method of claim 1 wherein said other form of carbon is graphite.

4. The method of claim 1 wherein said second ions are obtained from at least one non-hydrocarbon gas containing at least one element selected from the group consisting of carbon, oxygen, chlorine, fluorine and hydrogen.

5. The method of claim 4 wherein said gases are selected from the group consisting of carbon dioxide, oxygen, carbon monoxide, carbon tetrachloride, carbon tetrafluoride and hydrogen.

6. The method of claim 1 further comprising utilizing a non-reactive gas to stabilize the discharge of said carbon ions and second ions.

7. The method of claim 6 wherein said non-reactive gas is argon.

8. The method of claim 1 further comprising at least one hydrocarbon gas as the source of carbon ions.

9. The method of claim 8 wherein said hydrocarbon gases contain at least 40 atomic percent of carbon.

10. The method of claim 9 wherein said hydrocarbon gases are selected from the group consisting of acetylene and benzene.

11. The method of claim 4 further comprising obtaining said second ions from an oxygen containing gas and adding a hydrogen containing gas in an amount sufficient to limit the absorption of infrared radiation of a one micron film layer at a wavelength of about 9.5 micrometers to a value of no more than about 6 to 8 percent.

12. The method of claim 11 wherein said hydrogen containing gas is selected from hydrogen gas and deuterium.

13. The method of claim 1 wherein acetylene is the source of carbon ions and carbon dioxide is the source of second ions and the pressure ratio of acetylene to carbon dioxide is between about 0.5-5.0:

1 as read on a thermocouple gauge calibrated for air before the discharge is started.

14. The method of claim 13 wherein the ratio of acetylene to carbon dioxide is about 3:

1 in the initial stages of deposition and is thereafter reduced to about 1;

1.

15. The method of claim 1 further comprising heating the substrate to a temperature between about 100°

C. and 200°

C.

16. The method of claim 1 further comprising producing said carbon ions and said second ions in the same radiofrequency discharge with said substrate.

17. The method of claim 16 wherein said substrate is in contact with a radiofrequency electrode.

18. The method of claim 1 further comprising producing said carbon ions and said second ions in at least one ion-producing source.

19. The method of claim 18 wherein said carbon ions and said second ions are produced in separate ion-producing sources to form first and second plasma or ion beams and contacting said beams at the surface of said substrate.

20. The method of claim 18 wherein said carbon ions and said second ions are produced in separate ion-producing sources to form first and second plasma or ion beams and contacting said beams in front of said substrate.

21. The method of claim 19 or 20 wherein one beam is negatively biased with respect to the other beam.

22. The method of claim 18 further comprising producing a plasma beam containing said carbon ions and electrons and applying a magnetic field substantially perpendicular to said plasma beam to thereby remove a portion of said plasma electrons.

23. A substrate having a diamond-like carbon film produced by the process of claim 1.