Temperature-controllable heat valve

• US 4,494,595 A
• Filed: 11/30/1983
• Issued: 01/22/1985
• Est. Priority Date: 11/30/1983
• Status: Expired due to Fees

• Current Assignee: Schmid, Lawrence A.
• Original Assignee: Schmid, Lawrence A.
• Inventors: Schmid, Lawrence A.
• Primary Examiner(s): DAVIS JR, ALBERT
• Application Number:
  US06/556,480
• Time in Patent Office: 419 Days
• Field of Search: 165/32, 165/96, 165/104.22
• US Class Current: 165/274
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/06 Control arrangements therefor
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2013/008 Variable conductance materials; Thermal switches

Abstract

The basic heat pipe principle is extended by providing means for interrupting and modulating the return of liquid condensate to the evaporator end of the heat pipe. This is done by interposing a metallic screen (called the control grid) in the fluid path. This will stop the flow if the pressure drop across the screen is insufficient to overcome the resistance offered by surface tension. Because this surface tension increased as the temperature of the control grid decreases, the resistance of the screen, and hence the strength of the return flow of condensate to the evaporator, can be varied by changing the temperature of the control grid. This control temperature can be considerably lower than the operating temperature of the heat pipe, which means that low-temperature control devices can be used to control high-temperature heat flow.

Claims

1. In the method of transferring heat by the evaporation of a working fluid in an evaporator and the condensing of the resulting vapor in a condenser to form condensate, the direction of heat flow being from the evaporator to the condenser, and the condensate being returned to the evaporator, the improvement for controlling the amount of heat flow comprising the steps of:

interrupting the return flow of condensate to produce droplets of condensate, and

controlling the temperature at the point of droplet production to control the rate of droplet production and, thus, the rate at which condensate is returned to the evaporator.

2. The improvement of claim 1 wherein the interrupting step comprises passing the condensate through a grid having openings therein, and wherein the controlling step comprises controlling the temperature of the grid.

3. The improvement of claim 2 further comprising the step of interposing a layer of valve fluid immediately downstream of the grid, the valve fluid being substantially immiscible with the working fluid and having a boiling temperature higher than the operating temperature of the evaporator, whereby the droplets return through the valve fluid to the evaporator under the action of thermocapillary forces.

4. The improvement of claim 3 wherein the valve fluid is more dense than the working fluid so that, in a gravitational field, buoyancy forces supplement said thermocapillary forces.

5. The improvement of claim 3 comprising the step of permitting the controllable grid temperature to swing above the evaporator temperature to stop the flow of said droplets by reversing the direction of said thermocapillary forces.

6. The improvement of claim 2 further comprising the step of maintaining the controllable grid temperature below the operating temperature of the evaporator.

7. The improvement of claim 6 further comprising the step of maintaining the controllable grid temperature below the operating temperature of the condenser.

8. The improvement of claim 2 wherein the grid is floating so that its temperature is automatically controlled by the respective evaporator and condenser temperatures.

9. In an heat-transferring device of the type in which heat is transferred by the evaporation of a working fluid in an evaporator and the condensing of the resulting vapor in a condenser to form a condensate, the direction of heat flow being from the evaporator to the condenser, and the condensate being returned to the evaporator, the improvement of means for controlling the amount of heat flow comprising:

interrupting means for interrupting the return flow of condensate to produce droplets of condensate; and

temperature-controlling means for controlling the temperature at the point of droplet production to control the rate of droplet production and, thus, the rate at which condensate is returned to the evaporator.

10. The improvement of claim 9 wherein said interrupting means comprises an heat-conducting grid having openings therein for forming the droplets, and wherein said temperature-controlling means comprises means for varying the temperature of the grid.

11. The improvement of claim 10 further comprising a layer of valve fluid disposed immediately downstream of said grid, the valve fluid being substantially immiscible with the working fluid and having a boiling temperature higher than the operating temperature of the evaporator, whereby the droplets return through the valve fluid to the evaporator under the action of thermocapillary forces.

12. The improvement of claim 11 wherein the valve fluid is more dense than the working fluid so that, in a gravitational field, buoyancy forces supplement said thermocapillary forces.

13. The improvement of claim 9 wherein the device is oriented with the condenser above the evaporator whereby the condensate is forced through said grid by gravity.

14. The improvement of claim 9 wherein the device is rotating whereby the condensate is forced through said grid by centrifugal force.

15. The improvement of claim 9 further comprising means for coupling the evaporator, condenser and said temperature-controlling means to respective heat pipes.

16. The improvement of claim 11 further comprising means for confining, and accommodating the varying volume of, said valve fluid and included droplets.

17. The improvement of claim 16 wherein said confining means comprises a fine corrugated mesh which is preferentially wetted by the working fluid.

18. The improvement of claim 9 further comprising means for connecting said device in a thermal amplifier circuit.