Process for forming grooves having different depths using a single masking step

• US 4,495,025 A
• Filed: 04/06/1984
• Issued: 01/22/1985
• Est. Priority Date: 04/06/1984
• Status: Expired due to Term

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Haskell, Jacob D.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/597,617
• Time in Patent Office: 291 Days
• Field of Search: 156/648, 156/628, 156/651, 156/652, 156/653, 156/657, 156/659.1, 156/661.1, 156/662, 148/1.5, 148/187, 29/576 W, 29/580, 357/23, 357/47, 357/48, 357/49, 357/50, 357/56, 430/312, 430/313, 430/316, 430/317, 427/88, 427/89, 427/90, 427/93
• US Class Current: 438/427
• CPC Class Codes: H01L 21/3086 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/76229 Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
• CPC Class Codes: H01L 21/76232 of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls H01L21/76229 takes precedence

Abstract

A process for forming grooves of different depths using a single masking step is presented. In the preferred embodiment of the present invention a photoresist material is used as a single masking layer. The grooves of different types are defined in the masking layer such that the image for a first type groove is narrower in width than the image for a second type groove. The grooves are then formed by subsequent etching steps using conventional etching and anisotropic etching techniques. The grooves are etched to different depths by calculating the proper thickness of a protective layer in relationship to the different groove widths which will allow the deeper groove to be etched without affecting the shallower groove.

Claims

1. A process for forming grooves of different depths in a wafer of semiconductor material utilizing a single masking step, said process comprising the steps of:

depositing a first protective layer over the surface of a substrate of said semiconductor material;

depositing a masking layer of photoresist material over the surface of said first protective layer;

optically exposing said masking layer of photoresist material to define within said masking layer of photoresist material images for a first type groove and a second type groove, where said first type groove image is narrower in width than said second type groove image;

developing said masking layer of photoresist material to expose regions of said first protective layer where grooves of said first type and said second type are to be formed;

etching said exposed regions of said first protective layer to expose regions of said substrate where grooves of said first type and said second type are to be formed;

etching said exposed regions of said substrate to form grooves of said first type and said second type, such that said first type groove is narrower in width than said second type groove;

stripping said masking layer of photoresist material from said first protective layer;

depositing a second protective layer of a predetermined thickness over said first protective layer and over said first type groove and said second type groove such that said first type groove is substantially filled in and said second type groove is partially filled in;

anisotropically etching the second protective layer so as to remove said second protective layer from the bottom of said second type groove exposing a region of said substrate thereunder; and

etching said second type groove so as to penetrate to a desired depth the exposed region of said substrate thereunder.

2. A process for forming grooves of different depths in accordance with claim 1, wherein the following step is performed:

filling said second type groove with a filler material.

3. A process for forming grooves of different depths in accordance with claim 1, wherein the following step is performed:

doping the substrate.

4. A process for forming grooves of different depths in accordance with claim 1 wherein the step of etching said second type groove so as to penetrate to a desired depth the region of said substrate thereunder is accomplished by the step of etching said second type groove by an etch which selectively etches said substrate preferentially over said first protective layer.

5. A process for forming grooves of different depths in accordance with claim 1 wherein the step of depositing said first protective layer over the surface of said substrate of said semiconductor material is accomplished by the step of applying a layer of protective material by low pressure chemical vapor deposition.

6. A process for forming grooves of different depths in accordance with claim 1 wherein the step of depositing said second protective layer of a predetermined thickness over said first protective layer and over said first type groove and said second type groove is accomplished by the step of applying a layer of protective material by low pressure chemical vapor deposition.

7. A process for forming grooves of different depths in accordance with claim 5 or 6 wherein the step of applying said layer of protective material by low pressure chemical vapor deposition is accomplished by the step of applying a layer of silicon dioxide by low pressure chemical vapor deposition.

8. A process for forming grooves of different depths in accordance with claim 6 wherein the step of applying said layer of protective material by low pressure chemical vapor deposition is accomplished by the step of applying a layer of polysilicon by low pressure chemical vapor deposition.

9. A process for forming grooves of different depths in accordance with claim 8 further including the step of forming a layer of thermal oxide on the inside surface of said second type groove.

10. A process for forming grooves of different depths in a wafer of semiconductor material utilizing a single masking step, said wafer of semiconductor material having a substrate and an epitaxial layer over said substrate, said process comprising the steps of:

depositing a first protective layer over said epitaxial layer;

depositing a masking layer of photoresist material over the surface of said first protective layer;

optically exposing said masking layer of photoresist material to define within said masking layer of photoresist material images for at least two first type grooves and a second type groove, where said first type groove images are each narrower in width than said second type groove image;

developing said masking layer of photoresist material to expose regions of said first protective layer where grooves of said first type and said second type are to be formed;

etching said exposed regions of said first protective layer to expose regions of said epitaxial layer where grooves of said first type and said second type are to be formed;

etching said exposed regions of said epitaxial layer to form grooves of said first type and said second type, such that one said first type groove is formed in an N-region of said epitaxial layer, another said first type groove is formed in a P-region of said epitaxial layer, said second type groove is formed at an intersection of said N-region and said P-region, and such that said first type grooves are each narrower in width than said second type groove;

stripping said masking layer of photoresist material from said first protective layer;

depositing a second protective layer of a predetermined thickness over said first protective layer and over said first type grooves and said second type groove such that said first type grooves are substantially filled in and said second type groove is partially filled in;

anisotropically etching the second protective layer so as to remove said second protective layer from the bottom of said second type groove exposing thereunder a region of said epitaxial layer; and

etching said second type groove and the exposed region of said epitaxial layer thereunder to such a depth that said second type groove penetrates said substrate.

11. A process for forming grooves of different depths in accordance with claim 10, wherein the following step is performed:

filling said second type groove with a filler material.

12. A process for forming grooves of different depths in accordance with claim 10, wherein the following step is performed:

doping the substrate.

13. A process for forming grooves of different depths in accordance with claim 10, wherein the step of etching said second type groove and the region of said epitaxial layer thereunder to such a depth that said second type groove penetrates said substrate is accomplished by the step of etching said second type groove and the region of said epitaxial layer thereunder by an etch which selectively etches said epitaxial layer and said substrate preferentially over said first protective layer.

14. A process for forming grooves of different depths in accordance with claim 10 wherein the following steps are performed:

implanting an N-type material in the first type groove in the P-region of said epitaxial layer; and

implanting a P-type material in the first type groove in the N-region of said epitaxial layer.

15. A process for forming grooves of different depths in accordance with claim 10 wherein the step of depositing said first protective layer over said epitaxial layer is accomplished by the step of applying a layer of protective material by low pressure chemical vapor deposition.

16. A process for forming grooves of different depths in accordance with claim 10 wherein the step of depositing said second protective layer of a predetermined thickness over said first protective layer and over said first type grooves and said second type groove is accomplished by the step of applying a layer of protective material by low pressure chemical vapor deposition.

17. A process for forming grooves of different depths in accordance with claim 15 or 16 wherein the step of applying said layer of protective material by low pressure chemical vapor deposition is accomplished by the step of applying a layer of silicon dioxide by low pressure chemical vapor deposition.

18. A process for forming grooves of different depths in accordance with claim 16 wherein the step of applying said layer of protective material by low pressure chemical vapor deposition is accomplished by the step of applying a layer of polysilicon by low pressure chemical vapor deposition.

19. A process for forming grooves of different depths in accordance with claim 16 further including the step of forming a layer of thermal oxide on the inside surface of said second type groove.