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Stamping foils and methods

  • US 4,495,232 A
  • Filed: 03/29/1982
  • Issued: 01/22/1985
  • Est. Priority Date: 04/22/1981
  • Status: Expired due to Term
First Claim
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1. A stamping foil for producing electrically conductive circuits on an electrically insulating or poorly conductive substrate;

  • said foil being bondable to said substrate in areas activated by compression with a stamping die or stereotype and comprising an electrically conductive layer having a generally decorative or graphic function and having a thickness of between 10 to 35 microns to achieve the required electrical function(s);

    said foil being endowed with sufficiently low shear strength to permit sharp separation of said activated areas from unactivated areas of the foil following a stamping operation;

    said structure of said conductive layer consisting essentially of fibrous, fibrous-granular or fibrils whose axes are oriented at approximately right angles to the surfaces of said foil and having a diameter between 0.5 and 2 microns; and

    a bonding layer adjacent to said conductive layer;

    said bonding layer being activatable by compression or heating with said stamping die or stereotype;

    whereby said bonding layer effects adhesion of said conductive layer to said substrate in the activated areas.

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