Stamping foils and methods

• US 4,495,232 A
• Filed: 03/29/1982
• Issued: 01/22/1985
• Est. Priority Date: 04/22/1981
• Status: Expired due to Term

• Current Assignee: Bolta-Werke GmbH
• Original Assignee: Irion & Vosseler Zahlerfabrik
• Inventors: Schindler, Bernd, Kurz, Edmund, Bauser, Herbert, Zerweck, Klaus, Bolch, Thomas, Haller, Andreas, Mager, Theo
• Primary Examiner(s): Herbert, Thomas J.
• Application Number:
  US06/363,068
• Time in Patent Office: 1,030 Days
• Field of Search: 428/901, 428/346, 428/913, 428/343, 428/41, 428/349, 428/332, 428/457, 428/914, 428/42, 428/215, 428/323, 428/347, 156/230, 156/233, 427/96
• US Class Current: 428/40.2
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10S 283/904 Credit card
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10S 428/913 Material designed to be responsive to temperature, light, moisture
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania
• CPC Class Codes: Y10T 428/1405 Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]
• CPC Class Codes: Y10T 428/24967 Absolute thicknesses specified
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/2813 Heat or solvent activated or sealable
• CPC Class Codes: Y10T 428/2817 Heat sealable
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A stamping foil for forming printed circuit patterns on insulating or poorly conductive substrates comprising an electrically conductive layer made of a highly conductive metal, such as copper, which is endowed with a sufficiently low shear strength, even in thicknesses of 10 microns or more, to permit easy and sharp separation of the activated (imprinted) and non-activated portions of the foil. Such a low shear strength may be achieved with fibrous or fibrous-granular crystallite structures, wherein the fibers are oriented approximately at right angles to the surfaces of the foil, and, in addition, by doping agents containing carbon, nitrogen and sulfur. The foil may comprise a bonding layer for bonding the conductive layer to a substrate, or such a bonding layer may be applied to the surface of the conductive layer before the stamping operation. The conductive layer may be either self-supporting, or it may adhere to a carrier tape through an intermediary separating layer. In the latter case, the bonding and separating layers become activated when compressed by a stamping die or stereotype, whereby the conductive layer becomes bonded to the substrate and separated from the carrier tape in the activated areas. The activated and non-activated portions of the foil are then separable by pulling the carrier tape away from the substrate.

Claims

1. A stamping foil for producing electrically conductive circuits on an electrically insulating or poorly conductive substrate;

said foil being bondable to said substrate in areas activated by compression with a stamping die or stereotype and comprising an electrically conductive layer having a generally decorative or graphic function and having a thickness of between 10 to 35 microns to achieve the required electrical function(s);

said foil being endowed with sufficiently low shear strength to permit sharp separation of said activated areas from unactivated areas of the foil following a stamping operation;

said structure of said conductive layer consisting essentially of fibrous, fibrous-granular or fibrils whose axes are oriented at approximately right angles to the surfaces of said foil and having a diameter between 0.5 and 2 microns; and

a bonding layer adjacent to said conductive layer;

said bonding layer being activatable by compression or heating with said stamping die or stereotype;

whereby said bonding layer effects adhesion of said conductive layer to said substrate in the activated areas.

2. The foil of claim 1, wherein said fibrils have diameters in the range between 0.5 microns and 2 microns.

3. The foil of claim 1, wherein said conductive layer comprises copper having a conductivity of at least 25 m/Ohm-mm².

4. The foil of claim 1 wherein said conductive layer comprises traces of a material selected from the group consisting of carbon, nitrogen and sulfur.

5. The foil of claim 1, wherein the bonding layer comprises a substance which is convertible into a glue upon being brought in contact with a suitable solvent or chemical reagent;

said solvent or reagent being contained in microcapsules embedded within the bonding layer; and

being releasable from said microcapsules upon compression or heating with a stamping die or stereotype.

6. The foil of claim 1, wherein said bonding layer comprises a substance which reacts chemically with said substrate and said conductive layer upon application of pressure or heat, thereby effecting adhesion between the conductive layer and the substrate in the activated areas.

7. The foil of claim 1, wherein said bonding layer comprises a melting glue which rapidly solidifies and bonds said conductive layer to said substrate in the activated areas immediately following a hot-stamping operation.

8. The foil of claim 1 or 7, wherein the side of said conductive layer which is not in contact with said bonding layer is attached to a carrier tape by means of a separating layer which has sufficient adhesiveness to bond said tape to said conductive layer prior to stamping and which loses its adhesiveness in areas activated by a stamping operation.

9. The foil of claim 8, wherein said separating layer comprises a melting glue whose freezing point is substantially below the freezing point of the glue in the bonding layer and whose freezing rate is much slower than that of the glue in the bonding layer.

10. The foil of claim 8, wherein said separating layer comprises an elastomer, a thermoplastic material, and a long-chain organic acid.

11. The foil of claim 8, wherein the glue of said separating layer permanently loses its adhesive properties above a certain limiting temperature which is substantially below the hot-stamping temperature of the apparatus in which said foil is to be stamped.

12. The foil of claim 11, wherein said limiting temperature is at least 50°

C. below said hot-stamping temperature.

13. The foil of claim 11, wherein the glue of said separating layer undergoes a chemical transformation above said limiting temperature.

14. The foil of claim 13, wherein said chemical transformation is accompanied by evolution of a gas.

15. The foil of claim 8, wherein the adhesiveness of said separating layer is destroyed or weakened upon introduction of a solvent or chemical reagent in the areas activated by the stamping operation.

16. The foil or claim 15, wherein said solvent or chemical reagent is contained in microcapsules which are embedded in said separating layer and is released from said microcapsules by application of pressure or heat during the stamping operation.

17. The foil of claim 8, wherein said carrier tape comprises a synthetic material.

18. The foil of claim 17, wherein said synthetic material is a polyester, e.g. polyethyleneterephtalate.

19. The foil of claim 8, wherein said carrier tape comprises a regenerated cellulose.

20. The foil of claim 19, wherein said regenerated cellulose is an ethyl cellulose.

21. The foil of claim 1 wherein the surface of said conductive layer facing away from said bonding layer is covered with a layer comprising a soldering flux.

22. The foil of claim 21 wherein said soldering flux comprises a mixture of terpenes.

23. The foil of claim 21, wherein said flux is applied in form of a soldering varnish.