Process for improving adhesion of resist to gold

• US 4,497,890 A
• Filed: 04/08/1983
• Issued: 02/05/1985
• Est. Priority Date: 04/08/1983
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Helbert, John N.
• Primary Examiner(s): Smith, John D.
• Application Number:
  US06/483,088
• Time in Patent Office: 669 Days
• Field of Search: 427/82, 427/240, 427/96, 427/409, 430/327, 430/318, 430/319, 430/296, 430/942, 430/967
• US Class Current: 430/296
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02282 liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• CPC Class Codes: H01L 21/02304 formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
• CPC Class Codes: H01L 21/312 Organic layers, e.g. photoresist H01L21/3105, H01L21/32 take precedence; photoresists per se G03C
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10S 430/143 Electron beam
• CPC Class Codes: Y10S 430/168 X-ray exposure process
• CPC Class Codes: Y10S 438/948 Radiation resist

Abstract

A process is disclosed for improving the adhesion of a polymeric resist to a gold metallization surface. The process includes the use of a chelating silane as an adhesion promoter between the resist and the gold metallization surface. The improved resist adhesion to the gold metallization surface is attributed to a complexation or chemisorption mechanism. The adhesion promoters of interest contain moieties capable of acting as chelating or chemisorption sites on the molecular silane, thus creating layer-to-layer bonding with greater strength than that observed where just Van der Waals interactions occur to the gold surface atoms.

Claims

1. A process for increasing the adhesion of a polymeric resist to a gold metallization surface which comprises the steps of:

applying to the gold metallization surface a layer of chelating silane; and

applying the polymeric resist to the layer of chelating silane.

2. The process of claim 1 wherein the chelating silane is selected from the group consisting of:

2-(diphenylphosphino)ethyltriethoxysilane, trimethylsilylacetamide,

bis[3-triethoxysilyl)propyl]tetrasulphide, and 3-mercaptopropyltriethoxysilane.

3. A process for fabricating a semiconductor device comprising the steps of:

providing a semiconductor substrate;

applying a layer of gold metallization overlying said substrate;

applying to said layer of gold metallization a chelating silane adhesion promoter;

applying a layer of polymeric resist to said chelating silane adhesion promoter;

exposing said layer of polymeric resist to form regions of exposed resist and regions of unexposed resist;

developing said layer of polymeric resist material to remove one of said exposed or unexposed resist regions leaving the other of said exposed or unexposed resist regions as an etch mask; and

etching said layer of gold metallization through openings in said etch mask.

4. The process of claim 3 wherein said chelating silane adhesion promoter is selected from the group consisting of:

2-(diphenylphosphino)ethyltriethoxysilane, trimethylsilylacetamide,

bis[3-(triethoxysilyl)propyl]tetrasulphide, and 3-mercaptopropyltriethoxysilane.

5. The process of claim 3 wherein said step of exposing comprises optically irradiating said layer with actinic radiation through a patterned photomask.

6. The process of claim 3 wherein said step of exposing comprises selectively irradiating said layer with an electron beam.

7. The process of claim 3 wherein said step of exposing comprises selectively irradiating said layer with soft x-rays.

8. The process of claim 3 wherein said polymeric resist has a positive tone.