Electrostatic chuck

• US 4,502,094 A
• Filed: 09/10/1982
• Issued: 02/26/1985
• Est. Priority Date: 09/14/1981
• Status: Expired due to Term

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Ward, Rodney, Plummer, Michael J., Lewin, Ian H.
• Primary Examiner(s): EISENZOPF, REINHARD
• Application Number:
  US06/416,723
• Time in Patent Office: 900 Days
• Field of Search: 361/234, 361/145, 269/8, 269/903
• US Class Current: 361/234
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: Y10S 269/903 Work holder for electrical circuit assemblages or wiring systems
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

An electrostatic chuck for holding a simiconductor wafer flat in a charged particle beam machine has thermally conductive portions for supporting the wafer. An electrically conductive member, for example a grid, has parts which extend between the thermally-conductive portions and is separated from the wafer by a dielectric layer. The wafer is clamped against the chuck by the electrostatic force set up across the dielectric layer when a potential difference is applied between the conductive wafer and the conductive member. Heat generated in the wafer by the bombardment of charged particles can be dissipated readily via the thermally conductive portions. The wafer can be electrically contacted at its back surface if the portions are also electrically conductive. To enhance thermal conduction away from the wafer, the conductive portions can protrude from the dielectric layer.

Claims

1. An electrostatic chuck for holding a semiconductor wafer in a fixed plane relative to said chuck, which chuck comprises an electrically conductive member separated from said fixed plane by a layer of dielectric material, means for electrically contacting the wafer, and means for supporting the wafer in said plane, including thermally conductive portions for contacting the wafer, the electrically conductive member comprising parts which extend laterally between said thermally conductive portions, and the dielectric layer extending at least on said parts.

2. An electrostatic chuck as claimed in claim 1, further comprising a thermally conductive support having a periphery in thermal contact with the thermally conductive portions.

3. An electrostatic chuck as claimed in claim 2, characterized in that the thermally conductive portions are pillars having flat end faces which lie in the fixed plane.

4. An electrostatic chuck as claimed in claim 3, characterized in that the electrically conductive member is a grid, the conductive pillars extending through the meshes of said grid.

5. An electrostatic chuck as claimed in claim 3 or 4, characterized in that the support has a perforated central portion which is thinner than the periphery, the thermally conductive pillars being secured in the perforations.

6. An electrostatic chuck as claimed in claim 2, characterized in that the thermally conductive portions comprise a thermally conductive grid, the electrically conductive member having parts which extend between the meshes of said grid.

7. An electrostatic chuck as claimed in claim 6, characterized in that the electrically conductive member comprises a plate which is integral with said parts which extend between the meshes of the grid.

8. An electrostatic chuck as claimed in claim 6 or 7, characterized in that the thermally conductive grid forms the central part of the support and is integral with the periphery of said support.

9. An electrostatic chuck as claimed in claim 2, characterized in that the thermally conductive periphery has a major surface coincident with the fixed plane.

10. An electrostatic chuck as claimed in claim 1, 2 or 3, characterized in that the thermally conductive portions are also electrically conductive and comprise the electrical contact means for the wafer, said thermally conductive members being electrically isolated from the electrically conductive member.

11. An electrostatic chuck as claimed in claim 10, characterized in that the thermally conductive portions are electrically isolated from the electrically conductive member by the layer of dielectric material.

12. An electrostatic chuck as claimed in claim 1, 2 or 9, characterized in that the dielectric material is transparent.

13. An electrostatic chuck as claimed in claim 1, 2 or 9, characterized in that the thermally conductive portions protrude from the dielectric layer so that the dielectric is spaced apart from said fixed plane.