Heat sinks for integrated circuit modules
First Claim
1. One-piece heat-sink apparatus for an electronics package the body of which has the general form of a thin elongated rectangular parallelepiped, comprising first, second and third elongated elements integrally connected in series by first and second connection means, all of said elements and connection means being formed of thin sheet metal, said first and second elements being held in substantially parallel spaced alignment with another and with said third element adjacent one side thereof by said connection means, said first connection means holding said first element in a cantilevered relation to one end of said third element at substantially a first distance therefrom, said second connection means holding said second element in a cantilevered relation to said third element at substantially a second distance therefrom which is less than said first distance, said third element being exposed to the ambient environment and being shaped for release thereto of heat conducted to it from the package independently from said first and second elements, said first element being substantially flat and proportioned to about closely and substantially coextensively with one surface of the package, and elongated stiffening means stamped as part of said first connection means and imparting to the cantilevered combination of said first element and said first connection means a stiffening which tends to approach that of the cantilevered combination of said second element and said second connection means, whereby, upon insertion of such a package between said first and second elements they tend to flex cooperatively and allow said first element to clasp itself in close abutting relationship with the nearby surface of the package.
11 Assignments
0 Petitions
Accused Products
Abstract
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accomodate insertion of the package between them and yet adjust themselves into abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members. The two clip members are of configurations exhibiting different stiffness, and are cantilevered from the heat-radiating strip by way of different-length connections, such that these members, once spread widely apart, tend not to maintain the parallelism needed to insure optimum abutments and heat-transfers from a package which has been forcibly wedged between them; that difficulty is corrected by indented stiffening ribbing in the longer cantilevered connection, and that same ribbing is employed to establish a mechanical spacing and thermal isolation from the inner end of an inserted package.
51 Citations
2 Claims
- 1. One-piece heat-sink apparatus for an electronics package the body of which has the general form of a thin elongated rectangular parallelepiped, comprising first, second and third elongated elements integrally connected in series by first and second connection means, all of said elements and connection means being formed of thin sheet metal, said first and second elements being held in substantially parallel spaced alignment with another and with said third element adjacent one side thereof by said connection means, said first connection means holding said first element in a cantilevered relation to one end of said third element at substantially a first distance therefrom, said second connection means holding said second element in a cantilevered relation to said third element at substantially a second distance therefrom which is less than said first distance, said third element being exposed to the ambient environment and being shaped for release thereto of heat conducted to it from the package independently from said first and second elements, said first element being substantially flat and proportioned to about closely and substantially coextensively with one surface of the package, and elongated stiffening means stamped as part of said first connection means and imparting to the cantilevered combination of said first element and said first connection means a stiffening which tends to approach that of the cantilevered combination of said second element and said second connection means, whereby, upon insertion of such a package between said first and second elements they tend to flex cooperatively and allow said first element to clasp itself in close abutting relationship with the nearby surface of the package.
Specification