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Heat sinks for integrated circuit modules

  • US 4,508,163 A
  • Filed: 01/18/1983
  • Issued: 04/02/1985
  • Est. Priority Date: 01/18/1983
  • Status: Expired due to Term
First Claim
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1. One-piece heat-sink apparatus for an electronics package the body of which has the general form of a thin elongated rectangular parallelepiped, comprising first, second and third elongated elements integrally connected in series by first and second connection means, all of said elements and connection means being formed of thin sheet metal, said first and second elements being held in substantially parallel spaced alignment with another and with said third element adjacent one side thereof by said connection means, said first connection means holding said first element in a cantilevered relation to one end of said third element at substantially a first distance therefrom, said second connection means holding said second element in a cantilevered relation to said third element at substantially a second distance therefrom which is less than said first distance, said third element being exposed to the ambient environment and being shaped for release thereto of heat conducted to it from the package independently from said first and second elements, said first element being substantially flat and proportioned to about closely and substantially coextensively with one surface of the package, and elongated stiffening means stamped as part of said first connection means and imparting to the cantilevered combination of said first element and said first connection means a stiffening which tends to approach that of the cantilevered combination of said second element and said second connection means, whereby, upon insertion of such a package between said first and second elements they tend to flex cooperatively and allow said first element to clasp itself in close abutting relationship with the nearby surface of the package.

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