Strain gauge with reduced creep phenomenon by improved insulation layering

• US 4,511,877 A
• Filed: 02/09/1983
• Issued: 04/16/1985
• Est. Priority Date: 02/18/1982
• Status: Expired due to Term

• Current Assignee: Tokyo Electric Co.
• Original Assignee: Tokyo Electric Co.
• Inventors: Suzuki, Satoshi, Nishikawa, Hisashi, Sakamoto, Koichiro, Takeno, Shozo, Fujisawa, Ikuo, Hirata, Masanobu
• Primary Examiner(s): Envall, Jr., Roy N.
• Assistant Examiner(s): Sears, C. N.
• Application Number:
  US06/465,344
• Time in Patent Office: 797 Days
• Field of Search: 338/2-6, 338/306-308, 73/766, 73/776, 73/862.65
• US Class Current: 338/2
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

A strain sensor includes an insulating resin, e.g. polyimide resin, film formed on a beam body having a strain generating section and a wiring layer having a resistance material, e.g. nickel-chrome, layer formed on the polyimide resin film and a gold layer selectively formed on the nickel-chrome layer. A solid powder, e.g. silicon dioxide, is mixed with the polyimide resin film.

Claims

1. A strain sensor comprising:

a beam body having a strain generating section;

an insulating resin film mixed with solid powder which includes silicon dioxide on said beam body at least over said strain generating section; and

a resistance layer on at least a portion of said insulating resin film.

5. The Strain Sensor according to claim 1 wherein said insulating resin film exhibits heat resistance to at least 100°

C.

6. The strain sensor according to claim 1, wherein said insulating resin film is formed of a material selected from the group consisting of cyclic polybutadiene resin, epoxy resin and epoxy modified resin.

7. The strain sensor according to claim 1, wherein the mean particle diameter of said solid powder is 7 nm to 40 nm.

8. The strain sensor according to claim 1, wherein said solid powder is mixed at 2 to 20% by weight percentage with said insulating resin film.

2. The strain sensor according to claim 2, wherein said solid powder further includes at least one material selected from the group consisting of aluminum trioxide, magnesium oxide, titanium dioxide, boron nitride and molybdenum sulfide.

3. The strain sensor according to claim 2, wherein said insulating resin film is formed of polyimide resin.

4. The strain sensor according to claim 2, wherein said solid powder is mixed at 2 to 20% by weight percentage with said insulating resin film.

9. A strain sensor comprising:

a beam body having a strain generating section;

an insulating resin film mixed with said solid powder having a means particle diameter of 7 nm to 40 nm on said beam body at least over said strain generating section; and

a resistance layer on at least a portion of said insulating resin film.

10. The strain sensor according to claim 9, wherein said insulating resin film is formed of polyimide resin.

11. The strain sensor according to claim 9, wherein said insulating resin film exhibits heat resistance to at least 100°

C.

12. The strain sensor according to claim 9, wherein said insulating resin film is formed of a material selected from the group consisting of cyclic polybutadiene resin, epoxy resin and epoxy modified resin.

13. The strain sensor according to claim 9, wherein the mean particle diameter of said solid powder is 7 nm to 40 nm.

14. A strain sensor comprising:

a beam body having a strain generating section;

an insulating resin film mixed with solid powder on said beam body at least over said strain generating section, said solid powder being 2 to 20% by weight of said insulating resin film; and

a resistance layer on at least a portion of said insulating resin film.

15. The strain sensor according to claim 14, wherein said insulating resin film is formed of polyimide resin.

16. The strain sensor according to claim 14, wherein said insulating resin film exhibits heat resistance to at least 100°

C.

17. The strain sensor according to claim 14, wherein said insulating resin film is formed of a material selected from the group consisting of cyclic polybutadiene resin, epoxy resin and epoxy modified resin.