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Controlled thermal expansion composite and printed circuit board embodying same

  • US 4,513,055 A
  • Filed: 11/30/1981
  • Issued: 04/23/1985
  • Est. Priority Date: 11/30/1981
  • Status: Expired due to Term
First Claim
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1. A composite comprising:

  • a resin matrix,a woven thermal expansion coefficient control fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said first group,said first yarns having a positive coefficient of thermal expansion, andsaid second yarns having a negative coefficient of thermal expansion.

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