Controlled thermal expansion composite and printed circuit board embodying same
First Claim
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1. A composite comprising:
- a resin matrix,a woven thermal expansion coefficient control fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said first group,said first yarns having a positive coefficient of thermal expansion, andsaid second yarns having a negative coefficient of thermal expansion.
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Abstract
A composite characterized by a controlled coefficient of thermal expansion and comprising a thermal coefficient control fabric embedded in a resin matrix and composed of yarns with positive and negative coefficients of thermal expansion. A composite circuit board constructed of the composite and having a coefficient of thermal expansion matched to a particular integrated chip carrier material, such as aluminum oxide.
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Citations
4 Claims
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1. A composite comprising:
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a resin matrix, a woven thermal expansion coefficient control fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said first group, said first yarns having a positive coefficient of thermal expansion, and said second yarns having a negative coefficient of thermal expansion. - View Dependent Claims (2)
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3. A laminated composite comprising:
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a plurality of layers each comprising a resin matrix and a woven thermal expansion coefficient contral fabric embedded in said resin matrix including a first group of generally parallel first and second yarns and a second group of generally parallel first and second yarns extending transverse to the yarns of said first group, said first yarns having a positive coefficient of thermal expansion and said second yarns having a negative coefficient of thermal expansion. - View Dependent Claims (4)
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Specification