Mounting of electronic components on printed circuit boards

• US 4,515,304 A
• Filed: 09/27/1982
• Issued: 05/07/1985
• Est. Priority Date: 09/27/1982
• Status: Expired due to Term

• Current Assignee: Nortel Networks Corporation
• Original Assignee: Northern Telecom Limited (Nortel Networks Corporation)
• Inventors: Berger, Jean P.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/424,031
• Time in Patent Office: 953 Days
• Field of Search: 228/123, 228/180 R, 228/180 A, 228/187, 228/136, 228/248
• US Class Current: 228/136
• CPC Class Codes: H05K 2203/1446 Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3485 Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Mounting of leaded components on one side of a PCB and surface mounting components on the other side of the PCB creates problems. The pressure of the lead ends projecting through the PCB prevents the use of a mask for applying solder paste for the mounting of the surface mounting components. Attaching surface mounting components initially by adhesive prior to wave soldering also causes problems. In the present invention leaded components are inserted and the lead ends crimped. The board is then turned over, solder paste applied by individual applicator nozzles to the lead ends and to solder pads on the circuit pattern. The surface mounting components are then positioned with contact areas aligned with the solder pads and the whole reflow soldered. The process can be repeated for surface mounting components on the same side as the original leaded components, with or without the insertion of further leaded components on the same side as the original surface mounting components.

Claims

1. A method of mounting electronic components on printed circuit boards, comprising;

inserting leaded components on a first side of a circuit board, the leads passing through holes in the circuit board, said first side being uppermost;

clinching the leads on a second side of the circuit board;

turning the circuit board over;

applying solder paste at the ends of the leads and on solder pads at predetermined positions on a circuit pattern on said second side through individual applicator nozzles;

positioning surface mounting components on said second side, contact positions on said components aligned with said solder pads;

reflow soldering to solder both said leads and said surface mounting components to said circuit pattern;

inserting further leaded components in said circuit board, said further components inserted on said second side of said circuit board, the leads passing through holes in the circuit board, said second side being uppermost;

clinching the leads of the further leaded components on the first side of the circuit board;

turning the circuit board over;

applying solder paste to the ends of the leads of the further leaded components through individual applicator nozzles; and

reflow soldering to solder the leads of the further leaded components to a circuit pattern on said first side, the soldering to the circuit pattern on said first side being carried out at a lower temperature than the soldering of leads and components to the circuit pattern on said second side.

2. A method as claimed in claim 1, said reflow soldering being carried out by vapour phase resoldering.

3. A method as claimed in claim 1, said reflow soldering being carried out by infra-red heating.

4. A method as claimed in claim 1, said reflow soldering of the leads of the further leaded components being carried out by vapour phase resoldering.

5. A method as claimed in claim 1, said reflow soldering of the leads of the further leaded coponents being carried out by infra-red heating.

6. A method as claimed in claim 1, including applying said solder paste to the ends of the leads of the further leaded components and on solder pads at predetermined positions on the circuit pattern on the first side;

positioning further surface mounting components on the first side, contact positions on the surface mounting components aligned with said solder pads; and

reflow soldering to solder both the leads of the further leaded components and the further surface mounting components to the circuit pattern on the first side.

7. A method as claimed in claim 6, said reflow soldering of the leads of the further leaded components the further surface mounting components being carried out by vapour phase resoldering.

8. A method as claimed in claim 6, said reflow soldering of the leads of the further leaded components and the further surface mounting components being carved out by infra-red heating.

9. A method of mounting electronic components on printed circuit boards, comprising;

inserting leaded components on a first side of a circuit board, the leads passing through holes in the circuit board, said first side being uppermost;

clinching the leads on a second side of the circuit board;

turning the circuit board over;

applying solder paste at the ends of the leads and on solder pads at predetermined positions on a circuit pattern on said second side through individual applicator nozzles;

positioning surface mounting components on said second side, contact positions on said components aligned with said solder pads;

reflow soldering to solder both said leads and said surface mounting components to said circuit pattern;

applying solder paste on solder pads at predetermined positions on a circuit pattern on the first side of the circuit board through individual applicator nozzles;

positioning further surface mounting components on said first side, contact positions on said further surface mounting components being aligned with the solder pads on the circuit pattern on said first side; and

reflow soldering to solder the further surface mounting components to the circuit pattern on said first side, the soldering to the circuit pattern on the first side being carried out at a lower temperature than the soldering to the circuit pattern on the second side.

10. A method as claimed in claim 9, the reflow soldering of the further surface mounting components being carried out by vapour phase resoldering.

11. A method as claimed in claim 9, the reflow soldering of the further surface mounting components being carried out by infra-red heating.