Heat sink for semi-conductor devices having terminals projecting from a heat sink transfer face

• US 4,517,585 A
• Filed: 08/13/1982
• Issued: 05/14/1985
• Est. Priority Date: 08/13/1982
• Status: Expired due to Fees

• Current Assignee: Lucas Chloride EV Systems Limited
• Original Assignee: Lucas Chloride EV Systems Limited
• Inventors: Ridout, Paul S., Birks, Colin
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Clark, Sheila V.
• Application Number:
  US06/407,874
• Time in Patent Office: 1,005 Days
• Field of Search: 357/81, 357/65, 357/68, 357/80, 174/16 HS
• US Class Current: 257/712
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink has an integral island portion on which there is a mounting face for heat transfer contact with the sole plate of a semi-conductor device case. Clearance bores are provided in the heat sink to receive the terminal pins of the semi-conductor device. Grooves in the face provide passages under the sole plate for wires connected to the terminal pins. Alternatively, cross passages in the island portion may be employed.

Claims

1. A heat sink for a semi-conductor device of the type which have terminal pins projecting from a heat transfer face of the semi-conductor device case;

the heat sink having a thickness greater than the length of the terminal pins and having an integral mounting face against which the heat transfer face of the semi-conductor device case is to be mounted, such mounting face being formed with clearance bores to receive the pins and also with grooves extending along the mounting face to permit wires connected to the pins to lie on the same side of the heat sink as the semi-conductor device case.

2. A heat sink as claimed in claim 1 in which the mounting face is formed on a relatively thick part of the heat sink having at least one edge, at least one of said grooves extending to the edge of said thick part.

3. A heat sink as claimed in claim 2 in which the relatively thick part is an island portion of the heat sink and may be designed to accommodate one, two or more semi-conductor devices.

6. A heat sink as claimed in claim 1, wherein said clearance bores comprise blined bores.

4. A heat sink for a semi-conductor device of the type having terminal pins projecting from a heat transfer face of the semi-conductor device case;

the heat sink having an integral mounting face against which the heat transfer face of the semi-conductor device case is to be mounted, such mounting face being formed with clearance bores to receive the pins, the heat sink being formed with cross passages communicating with the clearance bores respectively and with the same side of the heat sink as the semi-conductor device, whereby wires can be arranged to connect the pins of the semi-conductor device to a circuit on the same side of the heat sink as the semi-conductor device.

5. A heat sink as claimed in claim 4 in which the mounting face is formed on a relatively thick island portion of the heat sink, said island portion having an edge into which said cross passages extend.

7. A heat sink as claimed in claim 4, wherein said clearance bores comprise blind bores.