Temperature stabilizer

• US 4,518,944 A
• Filed: 10/18/1983
• Issued: 05/21/1985
• Est. Priority Date: 10/18/1983
• Status: Expired due to Term

• Current Assignee: TRW Limited (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Original Assignee: TRW Limited (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Faris, Alan E.
• Primary Examiner(s): Leung, Philip H.
• Assistant Examiner(s): Sears, C. N.
• Application Number:
  US06/542,919
• Time in Patent Office: 581 Days
• Field of Search: 338/22 R-24, 338/25, 310/313 R, 310/346, 310/343, 310/347
• US Class Current: 338/22.00R
• CPC Class Codes: H03H 9/08 Holders with means for regulating temperature

Abstract

A device for regulating the temperature of an electronic component, such as a surface acoustic wave (SAW) component in a hybrid package, without dissipating large amounts of power. The device includes a positive-temperature-coefficient thermistor positioned in contact with the component of which the temperature is to be controlled, and an insulating body with included air spaces, positioned between the thermistor and the package, to provide a high thermal resistance between the thermistor and the package. In one preferred form of the invention, the insulating body is a length of glass tubing that has been deformed to include two flat surfaces for contacting the thermistor and the package. Another disclosed embodiment includes a second thermistor and insulator combination, to further increase the thermal resistance between the component and the package.

Claims

1. A temperature-stabilizing device for regulating the operating temperature of an electronic component that is to be mounted on a package, said device comprising:

a positive-temperature-coefficient thermistor mounted in thermal contact with the electronic component whose temperature is to be regulated; and

an insulating body mounted between said thermistor and the package, said insulating body including a length of tubing that has been deformed to provide two flat surfaces for contact with said thermistor and with the package, respectively, whereby the interior volume of said tubing increases the thermal resistance of the path between said thermistor and the package;

said tubing being of a material that produces no contaminant gases.

2. A temperature-stabilizing device as set forth in claim 1, wherein:

said tubing is of glass.

3. A temperature-stabilizing device as set forth in claim 1, wherein:

said insulating body is of a material having the properties of low thermal conductivity on the order of less than 0.1 watt/cm-degree C. and low outgassing in vacuum.

4. A temperature-stabilizing device for regulating the operating temperature of an electronic component that is to be mounted on a package, said device comprising:

a positive-temperature-coefficient thermistor mounted in thermal contact with the electronic component whose temperature is to be regulated;

an insulating body mounted between said thermistor and the package, said insulating body being of a material that produces no contaminant gases, and having included air spaces to increase the thermal resistance of the path between said thermistor and the package;

a second positive-temperature-coefficient thermistor; and

a second insulating body;

said second thermistor being positioned in contact with the first insulating body, and said second insulating body being positioned between said second thermistor and the package, to provide a second thermistor and insulator combination that is thermally in series connection with the first thermistor and insulator combination.

5. A temperature-stabilizing device as set forth in claim 4, wherein:

said first and second insulating bodies each include a length of tubing that has been deformed to provide two flat contact surfaces; and

the included air space is provided by the interior volume of the tubing.

6. A temperature-stabilizing device as set forth in claim 5, wherein:

said lengths of tubing are of glass.

7. A temperature-stabilizing device as set forth in claim 4, wherein:

said insulating bodies are of a material having the properties of low thermal conductivity on the order of less than 0.01 watt/cm-degree C. and low outgassing in vacuum.