Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts

• US 4,520,314 A
• Filed: 10/08/1982
• Issued: 05/28/1985
• Est. Priority Date: 10/30/1981
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Greschner, Johann, Kallmeyer, Michael, Asch, Karl, Kulcke, Werner
• Primary Examiner(s): Karlsen, Ernest F.
• Assistant Examiner(s): Baker, Stephen M.
• Application Number:
  US06/433,341
• Time in Patent Office: 963 Days
• Field of Search: 324/158 P, 324/158 F, 324/73 PC, 324/72.5, 324/149, 339/DIG. 3, 156/643, 156/647, 73/777, 30/DIG. 13
• US Class Current: 324/754.07
• CPC Class Codes: G01R 1/073 Multiple probes
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams

Abstract

A probe head arrangement for contacting a plurality of closely adjacent conductor lines 2 comprises a minimum of one probe head 3, where a plurality of fingers 4 together with a back 5 are made in one piece of monocrystalline silicon in semiconductor technique. A plurality of such probe heads 3 are composed to form a tester. At the beginning of each test it is determined which fingers 4 are to be, and are not to be placed onto the individual conductor lines 2 of a card 1 to be tested. Subsequently, the short and interruption tests can be implemented after the correlation of finger and probe head addresses with the conductor line addresses.

Claims

1. Apparatus for contacting and testing a plurality of exposed closely spaced electrically conductive members of very small dimensions comprising:

a monolithic comb-shaped structure consisting of a spine with a plurality of elongated teeth depending therefrom so as to provide a plurality of miniature resilient cantilever beams;

the said spine and said teeth being fabricated of silicon and the said teeth having been selectively processed so as to have a resistance substantially lower than that of similarly configured teeth of pure silicon.

solid state integrated circuitry fabricated integral with the said spine portion and connected to each of said teeth and adapted to apply, receive, and test the relativity of potentials on said teeth;

whereby when the said teeth are applied to said conductors in resilient contact therewith the integrity of the conductors may be determined.

2. The apparatus of claim 1 wherein said teeth are doped with a material chosen from those dopants which substantially reduce the resistivity of silicon.

3. The apparatus of claim 2 wherein the dopant is boron.

4. The apparatus of claim 1 wherein said teeth are coated with an electrical conductive material having a low resistivity.

5. The apparatus of claim 1 wherein said monolithic structure is fabricated of mono-crystalline silicon.

6. In a test apparatus for contacting and testing a plurality of exposed closely spaced electrically conductive members of very small dimensions, the subcombination of a probe head adapted to provide electrical contact with said electrical conductive members, comprising

a monolithic monocrystalline silicon comb-shaped structure having a spine portion and plurality of elongated teeth depending therefrom to provide a plurality of miniature resilient cantilever beams,

the said teeth having been selectively processed so as to have a substantially lower resistance than similarly configured teeth of pure silicon, and

individual electrical connections to each of said teeth for performing electrical testing of any of the electrical conducting members contacted by the said teeth when the probe head is deployed in physical contact with the electrical conductor assembly.

7. The subcombination of claim 6 wherein the said teeth are doped with a material chosen from those dopants which substantially reduce the resistivity of silicon.

8. The subcombination as defined in claim 7 wherein the dopant material is boron.

9. The subcombination of claim 7 wherein the said teeth are coated with an electrical conductive material having a low resistivity.

10. The subcombination of claim 6 wherein the said teeth have a uniform rectangular cross-section.

11. The subcombination of claim 6 wherein the said teeth have a rectangular cross-section decreasing in size from the spine to the ends thereof.