Programmable ion beam patterning system

• US 4,523,971 A
• Filed: 06/28/1984
• Issued: 06/18/1985
• Est. Priority Date: 06/28/1984
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Speidell, James L., Harper, James M. E., Cuomo, Jerome J., Kaufman, Harold R.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/626,097
• Time in Patent Office: 355 Days
• Field of Search: 156/345, 156/643, 156/646, 156/654, 204/192 E, 204/192 EC, 204/298, 427/38, 427/39, 118/728, 118/50.1, 118/620, 134/1, 219/121 PD, 219/121 PE, 219/121 PR, 219/121 PU, 313/359.1, 313/360.1, 313/361.1, 313/362.1, 313/363.1, 315/111.31, 315/111.81, 315/111.91
• US Class Current: 156/345.39
• CPC Class Codes: C23C 14/46 by ion beam produced by an external ion source
• CPC Class Codes: H01J 37/09 Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
• CPC Class Codes: H01J 37/3053 for evaporating or etching
• CPC Class Codes: H01J 37/3178 for applying thin layers on objects

Abstract

This ion beam system provides an ion beam pattern which is produced without the need for a mask. A programmable grid is used in combination with an ion beam source, where the apertures of the programmable grid can have electrical potentials associated therewith which either extract ions or impede the movement of ions through the apertures. Depending upon the electrical biasing provided to each of the apertures of the grid, different patterns of ions can be extracted through the grid. By changing the electrical bias at different locations on the programmable grid, these different patterns are produced. The patterns can be used for many applications, including patterned deposition, patterned etching, and patterned treatment of surfaces.

Claims

1. An ion beam system for producing a patterned ion beam

without the need for masks, comprising:

an ion source for producing ions,

a programmable grid having a plurality of extraction apertures therein through which said ions can selectively be extracted from said ion source to produce said patterned beam,

electrical bias means for electrically biasing individual ones of said extraction apertures for selectively extracting ions from said ion source or preventing the extraction of said ions, thereby producing said ion beam pattern,

means for selectively changing the electrical bias on individual ones of said extraction apertures in order to change said selected ion beam pattern.

2. The system of claim 1, where said ions are positively charged.

3. The system of claim 2, where said ions are negatively charged.

4. The system of claim 1, further including a screen grid located between said ion source and said programmable grid, said screen grid being biased to extract said ions through said screen grid to provide collimated ions to said programmable grid.

5. The system of claim 1, where said programmable grid is an insulating layer having said apertures therein, and said electrical bias means including a patterned conductive layer located on said insulating layer, said conductive layer producing an electrical potential at those apertures where it is desired to extract ions through said programmable grid.

6. The system of claim 1, further including a substrate onto which said patterned ion beam is incident.

7. The system of claim 1, where said electrical bias means includes a voltage source and addressing means for producing an electrical bias at selected extraction apertures of said programmable grid.

8. The system of claim 1, where said ion source includes means for producing a plasma of said ions,

said programmable grid being electrically biased at particular locations therein to extract ions from said plasma at said locations.

9. An ion beam system for producing a patterned ion beam without the need for masks, said system including:

means for creating a plasma of ions in a vacuum chamber,

a programmable grid located adjacent to said plasma of ions for extracting ions from said plasma at selected locations of said grid, said grid including a plurality of apertures through which an extracted ions pass into said vacuum chamber, and

means for controlling the extraction of ions through selected apertures in said grid, said means for controlling including means for extracting ions through selected ones of said apertures and for preventing the extraction of ions from said plasma through other selected apertures of said grid.

10. The system of claim 9, further including means for selectively addressing selected apertures in said grid for the passage of ions therethrough, and for changing the location of said selected apertures in order to produce different patterns of said ion beam.

11. The system of claim 10, where said means for extracting ions through selected apertures of said grid includes electrical bias means for producing bias voltages at those apertures of said grid through which said ions are to pass from said plasma into said vaccum chamber.

12. The system of claim 11, where said electrical bias means includes a pattern of electrical conductors located adjacent to the apertures in said grid, said conductors being individually addressed to produce an electrical potential at selected individual ones of said conductors.

13. The system of claim 12, where said ions are positively charged.

14. The system of claim 12, where said ions are negatively charged.

15. The system of claim 12, further including a substrate located within said vacuum chamber, on which said patterned ion beam is incident.

16. An ion beam system for providing patterned ion beams without the use of masks, comprising in combination:

an ion source,

a programmable grid adjacent to said source, said grid having a plurality of apertures therein through which said ions can selectively pass under control of an electrical control means,

electrical control means for controlling which of said apertures said ions will pass through, to produce a patterned ion beam, and addressing means connected to said electrical control means for changing the locations of the apertures through which said ions will pass to produce a different pattern of ions.

17. The system of claim 16, where said electrical control means includes electrical conductor means adjacent to each of said apertures for applying different electrical potentials to selected ones of said apertures, and a voltage source for producing said electrical potential.

18. In an ion beam system including a vacuum chamber,

an ion source for producing a plasma of ions, and a grid adjacent to said plasma having a plurality of apertures therein through which said ions can be extracted from said plasma, the improvement wherein said system includes electrical means for extracting ions through a selected pattern of said apertures while preventing the extraction of ions through others of said apertures and addressing means for changing the pattern of apertures through which said ions are extracted.