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Process for manufacturing hollow multilayer printed wiring board

  • US 4,528,072 A
  • Filed: 06/29/1982
  • Issued: 07/09/1985
  • Est. Priority Date: 05/24/1979
  • Status: Expired due to Term
First Claim
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1. A process for manufacturing a hollow multilayer printed wiring board comprising the steps of:

  • preparing printed substrates made of a material comprising one of a thermally resistant organic synthetic resin sheet, an insulation treated metal sheet, and a combination of a thermally resistant organic synthetic resin sheet on an insulation-treated metal sheet, so that each said printed substrate has a signal conductor pattern on at least one surface thereof and a land conductor pattern on at least one surface thereof, and further so that each said substrate has a layer of a low melting point metal formed on said land conductor pattern;

    superposing the printed substrates one upon another so that the land conductor pattern having the low melting point metal layer of each substrate is in contact with the land conductor pattern or patterns having the low melting point metal layer of at least one adjacent substrate;

    applying pressure and heat sufficient for melt-adhering the substrates having the low melting point metal layer to the at least one adjacent substrate, so that there is a space between the signal conductor pattern and the adjacent substrate; and

    boring through holes in the substrate and the melt-adhered land conductor patterns of the superposed substrates, and forming plated conductor layers on at least the inner walls of the through holes to form plated through holes serving as an electrical connection between at least two signal conductor patterns of the superposed printed substrates.

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