Chip resistor

• US 4,529,960 A
• Filed: 05/29/1984
• Issued: 07/16/1985
• Est. Priority Date: 05/26/1983
• Status: Expired due to Term

• Current Assignee: KOA Kabushikikaisha
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Kawana, Kofu, Uchida, Katsutoshi, Izumida, Hisashi, Suda, Masaru
• Primary Examiner(s): Mayewsky, Volodymyr Y.
• Application Number:
  US06/614,950
• Time in Patent Office: 413 Days
• Field of Search: 338/211, 338/212, 338/308, 338/309, 338/315, 338/314, 338/320, 338/323, 338/327, 338/328, 338/329, 338/330, 338/332, 219/522, 219/541, 219/543, 29/619, 29/620, 428/209, 428/607, 427/89, 156/656
• US Class Current: 338/309
• CPC Class Codes: H01C 17/006 adapted for manufacturing resistor chips
• CPC Class Codes: H01C 17/281 by thick film techniques

Abstract

A chip resistor provided with a thin-film resistor has lateral electrodes formed at both sides of the substrate of the chip resistor. The lateral electrodes are formed by printing and firing conductive paste of a silver resin, not by thin-film technology. Electrode layers are formed on the lateral electrodes and on the thin-film electrode by plating. The chip resistor is thus constructed so as to be readily connectable to a motherboard by dip soldering or reflow soldering.

Claims

1. A chip resistor comprising:

a substantially rectangular insulating substrate,

a thin-film resistor formed on one side of the substrate,

thin-film electrodes at both ends of the thin-film resistor,

lateral electrodes of a silver resin which are connected to the thin-film electrodes and are formed by printing and firing so as to cover the side portions of the substrate, and

electrodes formed on the lateral electrodes by plating.

2. A chip resistor as set forth in claim 1, wherein the thin-film resistor is entirely coated with an overcoat of a resin.