Layer system for opto-electronic displays

• US 4,532,174 A
• Filed: 06/30/1983
• Issued: 07/30/1985
• Est. Priority Date: 07/26/1982
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Schack, Peter, Freller, Helmut, Hassler, Heinrich, Schultz, Ludwig
• Primary Examiner(s): HERBERT JR, THOMAS
• Application Number:
  US06/509,805
• Time in Patent Office: 761 Days
• Field of Search: 428/469, 428/701, 428/433, 428/215
• US Class Current: 428/215
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3607 Coatings of the type glass/inorganic compound/metal
• CPC Class Codes: C03C 17/3649 made of metals other than silver
• CPC Class Codes: C03C 17/3668 the multilayer coating having electrical properties
• CPC Class Codes: C03C 2217/948 Layers comprising indium tin oxide [ITO]
• CPC Class Codes: C23C 28/00 Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: G02F 1/0102 Constructional details, not otherwise provided for in this subclass
• CPC Class Codes: Y10T 428/24967 Absolute thicknesses specified

Abstract

A simplified, easily producible, strongly adherent, solderable and corrosion resistant layer system for opto-electronic displays is produced by vapor deposition techniques. In accordance with the invention, the layer system is formed of two layers; a transparent first layer formed of a nonsolderable oxide semiconductor, such as In₂ O₃ SnO₂, and a second layer formed of a solderable, oxidation-resistant material, which is formed at least partially of a copper alloy containing an alloying additive consisting of a metal which is less noble than copper, illustratively CuMg.

Claims

1. In a layer system for opto-electronic displays of the type having a first layer formed of a transparent, not solderable oxide semiconductor material the improvement comprising a second layer formed of a solderable oxidation-resistant material formed at least partially of a copper alloy having at least one alloying additive consisting of a metal which is less noble than copper and selected from the group of magnesium, aluminum, beryllium, gallium, germanium, silicon, tin, zinc, zirconium and chromium.

2. The layer system of claim 1 wherein the first layer has a thickness between 25 to 500 nm, and said second layer has a thickness of between 200 to 1200 nm.

3. The layer system of claim 1 wherein a portion of said second layer communicating with the atmosphere consists of between one-quarter to one-third of a copper alloy;

the remainder of said second layer being essentially pure copper.

4. The layer system of claim 1 wherein second layer consists of CuMg.

5. The layer system of claim 1 wherein the first layer is In₂ O₃ SnO₂.

6. The layer system of claim 1 wherein said alloying additive is added in an amount corresponding to between 0.2 to 10 atom percent.

7. The layer system of claim 6 wherein said alloying additive is added in an amount corresponding to between 1.5 to 2 atom percent.

8. A layer system for opto-electronic displays comprising:

a first layer formed of In₂ O₃ SnO₂ ; and

a second layer formed of CuMg.