Header and housing assembly for electronic circuit modules

• US 4,533,188 A
• Filed: 02/15/1983
• Issued: 08/06/1985
• Est. Priority Date: 02/15/1983
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Miniet, Jay J.
• Primary Examiner(s): Weidenfeld, Gil
• Assistant Examiner(s): Paumen, Gary F.
• Application Number:
  US06/466,465
• Time in Patent Office: 903 Days
• Field of Search: 339/17 CF, 339/275, 339/136 R, 339/136 M, 339/142
• US Class Current: 439/77
• CPC Class Codes: H01R 12/59 for flexible printed circuits, flat or ribbon cables or like structures
• CPC Class Codes: H01R 12/613 by means of interconnecting elements
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00

Abstract

An improved header and housing assembly for holding a miniaturized electronic circuit module having a plurality of leads includes a header member having a plurality of apertures arranged to accept the leads of the module. A jaw mechanism associated with each aperture captivates the leads and a protective housing encloses the module between the header member and the housing. An interconnection board which is mounted to a flexible printed circuit board engages the header and housing assembly and forms a base permitting the assembly to be mounted to the flexible circuit board.

Claims

1. A header and module assembly for holding an electronic circuit module having a sheet of substrate with at least one row of leads which project away from the module, said assembly comprising:

a header member having a plurality of apertures arranged in a row so that each aperture accepts one of said leads of the electronic circuit module;

a jaw means adjacent each aperture on said header member for receiving said leads and captivating the module to the header,

said leads dimensioned to project substantially beyond the apertures when said sheet of substrate is seated within said channel, thereby allowing a direct electrical connection to be made to the portion of the leads which extend beyond the apertures; and

a flexible printed circuit board and a rigid interconnection board mounted to said flexible circuit board, said interconnection board having a plurality of apertures disposed to align with the corresponding apertures in said header member so that said leads of the electronic circuit module are received by the apertures in said interconnection board.

2. The header and module assembly in accordance with claim 1 further comprising a protective housing dimensioned to receive said module and mounting to said header.

3. The header and module assembly in accordance with claim 1 wherein the header is manufactured from a resilient plastic material.

4. The header and module assembly in accordance with claim 1 wherein the protective housing is made of a conductive metallic material.

5. A header and module assembly in accordance with claim 2 further comprising a securing means including a plurality of slots about the periphery of said header member and a plurality of tabs located on said protective housing to be received by said slots, said tabs when bent contiguous to the bottom of said header member securing same to the protective housing.

6. The header and module assembly in accordance with claim 1 wherein said header member further includes at least one locating pin projecting beyond the bottom-most portion of the header.

7. The header and module assembly in accordance with claim 2 further comprising grounding tabs extending outwardly from the top of said protective housing.

8. The header and module assembly in accordance with claim 2 further comprising an extraction means located on the top of said protective housing for permitting said protective housing to be engaged so that the latter can be removed from said header member.