Aqueous curable molding compositions based on inorganic ingredients and process for the production of molded parts

• US 4,533,393 A
• Filed: 12/16/1983
• Issued: 08/06/1985
• Est. Priority Date: 12/16/1982
• Status: Expired due to Term

• Current Assignee: HT Troplast AG
• Original Assignee: Dynamit Nobel AG
• Inventors: Engels, Hans-Werner, Spielau, Paul, Zoche, Gunter, Neuschaeffer, Karl H.
• Primary Examiner(s): Hayes, Lorenzo B.
• Application Number:
  US06/562,222
• Time in Patent Office: 599 Days
• Field of Search: 106/38.3, 106/38.35, 106/38.9, 106/15.05, 106/18.12, 106/74, 106/84, 264/42, 252/62
• US Class Current: 106/18.12
• CPC Class Codes: C04B 12/04 Alkali metal or ammonium silicate cements ; Alkyl silicate cements; Silica sol cements; Soluble silicate cements alkali metal silicates per se, their preparation C01B33/32; ammonium silicates per se, their preparation C01C1/00
• CPC Class Codes: C04B 28/006 containing mineral polymers, e.g. geopolymers of the Davidovits type
• CPC Class Codes: Y02P 40/10 Production of cement, e.g. improving or optimising the production methods; Cement grinding

Abstract

Molded parts having high flexural strength, based on alkali silicates, can be produced by casting and/or press-molding and curing by heating from aqueous molding compositions which are prepared from an oxide mixture containing amorphous silicic acid and aluminum oxide, as well as, optionally, as an additional component, aqueous, amorphous, disperse-powdery silicic acid, dissolved SiO₂, and alkali from alkali silicate solutions, optionally alkali hydroxide or its aqueous solutions and, if desired, fillers, by means of mixing under agitation. By addition of a blowing agent inorganic foamed products can be obtained.

Claims

1. An aqueous, hardenable molding composition consisting essentially of inorganic components and water in a flowable or press-moldable distribution, said inorganic components comprising stone-forming components consisting of:

dissolved SiO₂ ;

3. A molding composition according to claim 1, wherein the aqueous solution of the at least one alkali silicate from which the dissolved SiO₂ is derived is produced entirely or partially by dissolving amorphous, disperse-powdery, aqueous silicic acid in at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide or aqueous solutions thereof.

4. A molding composition according to claim 1, wherein said composition further contains gas-forming blowing agents with a gas-forming temperature of between 20°

and 95°

C.

5. A molding composition according to claim 3, wherein said blowing agents comprise sodium perborate or pulverized aluminum.

6. A molding composition according to claim 4, wherein said composition contains 0.5-4% by weight of sodium perborate, based on the total weight of the molding composition.

7. A molding composition according to claim 4, wherein said composition contains 0.05-0.8% by weight of pulverized aluminum, based on the total weight of the molding composition.

8. A molding composition according to claim 1, wherein said composition contains from 20 to 65% by weight of water based on the total weight of the reactive stone-forming components of said composition.

9. A molding composition according to claim 1, wherein the composition contains up to 1,000 grams of inert fillers per 100 grams of the reactive stone-forming components of said composition.

10. A molding composition according to claim 1, wherein said oxide mixture contains 7-75% by weight of SiO₂ and 12-87% by weight of Al₂ O₃ ;

the Al₂ O₃ being present in a crystalline form.

12. A process for the production of molded parts from molding compositions according to claim 3, which comprises preparing a flowable composition containing 1.5-10 parts by weight of a water-free oxide mixture with contents of amorphous SiO₂ and aluminum oxide and 0.7-2.5 parts by weight of K₂ O or 0.55-1.5 parts by weight of Na₂ O per 1 part by weight of dissolved SiO₂ or equivalent amounts of the sodium oxide being used for equivalent amounts of the potassium oxide, a blowing agent, as well as optionally inert fillers;

by

(a) mixing the oxide mixture containing amorphous SiO₂ and aluminum oxide into an aqueous solution of at least one alkali silicate selected from the group consisting of sodium silicate and potassium silicate which is optionally admixed with at least one solid or dissolved alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide;

or

(b) dissolving amorphous, aqueous silicic acid in an aqueous solution of at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide to obtain an aqueous silicate solution and adding the oxide mixture;

or

(c) mixing amorphous, aqueous silicic acid with at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide or its aqueous solution, and reaction of the proportion of silicic acid to be dissolved to silicate solution, and adding the oxide mixture; and

filling the composition into a mold, foaming and curing.

13. A process according to claim 10, wherein prior to adding the other components of the molding composition, an alkali silicate solution is prepared by dissolving amorphous, aqueous silicic acid in alkali hydroxide or its solutions.

14. A process according to claim 12, wherein curing the molding composition that has been charged into a mold is effected at temperatures of 50°

to 200°

C.

16. A process according to claim 10, wherein said oxide mixture contains 7-75% by weight of SiO₂ and 12-87% by weight of Al₂ O₃ ;

the Al₂ O₃ being present in a crystalline form.

2. 3-10 parts by weight of a water-free oxide mixture containing amorphous SiO₂ and aluminum oxide per part of dissolved SiO₂ ;

0.7-2.5 parts by weight of K₂ O or 0.55-1.5 parts by weight of Na₂ O per part by weight of dissolved SiO₂ or equivalent amounts of the sodium oxide being used for equivalent amounts of the potassium oxide;

wherein K₂ O or Na₂ O, respectively, is derived from at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide, an aqueous solution thereof, or an aqueous solution of at least one alkali silicate selected from the group consisting of sodium silicate and potassium silicate, and the dissolved SiO₂ is derived from an aqueous solution of at least one alkali silicate selected from the group consisting of sodium silicate and potassium silicate;

said composition containing sufficient amounts of water up to attainment of flowability or press-moldability, respectively, and optionally amounts of inert fillers up to the limit of flowability.

11. A process for the production of molded parts from molding compositions which comprises preparing a flowable or press-moldable composition containing 1.3-10 parts by weight of a water-free oxide mixture with contents of amorphous SiO₂ and aluminum oxide and 0.7-2.5 parts by weight of K₂ O or 0.55-1.5 parts by weight of Na₂ O per 1 part by weight of dissolved SiO₂ or equivalent amounts of the sodium oxide being used for equivalent amounts of the potassium oxide, as well as optionally inert fillers, by

(a) mixing the oxide mixture containing silicon dioxide and aluminum oxide into an aqueous solution of at least one alkali silicate selected from the group consisting of sodium silicate and potassium silicate which alkali silicate solution is admixed, with at least one solid or dissolved alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide;

or

(b) dissolving amorphous, aqueous silicic acid in an aqueous solution of at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide to obtain an aqueous silicate solution thereof, and adding the oxide mixture, or

(c) mixing amorphous, aqueous silicic acid with at least one alkali hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide or its aqueous solution, and reaction of the proportion of silicic acid to be dissolved to the resulting alkali silicate solution, and adding the oxide mixture, and filling this composition into molds, venting, optionally press-molding, and curing.

17. A process according to claim 11, wherein said oxide mixture contains 7-75% by weight of SiO₂ and 12-87% by weight of Al₂ O₃ ;

the Al₂ O₃ being present in a crystalline form.

15. A process according to claim wherein initial curing is effected at 50°

-150°

C. unmolding is effected after attaining the required solidity, and thereupon final curing is effected at 80°

-200°

C.