Latently-curable organosilicone release coating composition
First Claim
1. A process comprising the steps:
- (a) providing a latently-curable organosilicone composition by mixing at ambient temperatures(1) an ethylenically-unsaturated polysiloxane,(2) a polyhydrosiloxane,(3) an effective amount of a metal-containing hydrosilation catalyst to facilitate the addition cure reaction of components (1) and (2), and(4) an amount of a hydrosilation inhibitor 1,4-dicarboxylic acid compound sufficient to inhibit premature gelation of the mixture of components (1), (2), and (3) at low, ambient or room temperature but insufficient in amount to prevent hydrosilation of the mixture at an elevated temperature, said hydrosilation inhibitor having the structural formula ##STR10## wherein R2 is ethynylene or cis-ethenylene;
R3 is a saturated or unsaturated organic group having 1 to 12 carbon atoms which is unsubstituted or substituted by 1 to 23 halogen atoms, and has up to 25 hydrogen atoms; and
X is --O-- or ##STR11## in which R4 is the same as defined for R3, and R3 and R4 together with the N can form a saturated azacyclic ring,(b) coating a substrate with said admixture, and(c) elevating the temperature of the resulting coated admixture when cure of said admixture is to be effected.
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Abstract
A latently-curable, organosilicone composition comprises a metal catalyzed organosilicone composition capable of undergoing hydrosilation and, as hydrosilation inhibitor, an organic monohydrogen derivative of an unsaturated aliphatic 1,4-dicarboxylic acid, i.e., maleic acid or acetylene dicarboxylic acid. The organic monohydrogen derivatives of use in this invention effectively inhibit catalyzed hydrosilation reactions at low or room temperature while allowing efficient hydrosilation reaction rates to occur at elevated temperatures. These monohydrogen derivatives perform their inhibitive function effectively at low concentration. The latently curable composition may be coated on a substrate to provide a release surface for an adjacent adhesive layer.
67 Citations
8 Claims
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1. A process comprising the steps:
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(a) providing a latently-curable organosilicone composition by mixing at ambient temperatures (1) an ethylenically-unsaturated polysiloxane, (2) a polyhydrosiloxane, (3) an effective amount of a metal-containing hydrosilation catalyst to facilitate the addition cure reaction of components (1) and (2), and (4) an amount of a hydrosilation inhibitor 1,4-dicarboxylic acid compound sufficient to inhibit premature gelation of the mixture of components (1), (2), and (3) at low, ambient or room temperature but insufficient in amount to prevent hydrosilation of the mixture at an elevated temperature, said hydrosilation inhibitor having the structural formula ##STR10## wherein R2 is ethynylene or cis-ethenylene; R3 is a saturated or unsaturated organic group having 1 to 12 carbon atoms which is unsubstituted or substituted by 1 to 23 halogen atoms, and has up to 25 hydrogen atoms; and X is --O-- or ##STR11## in which R4 is the same as defined for R3, and R3 and R4 together with the N can form a saturated azacyclic ring, (b) coating a substrate with said admixture, and (c) elevating the temperature of the resulting coated admixture when cure of said admixture is to be effected. - View Dependent Claims (2, 3)
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4. A release liner for adhesive materials comprising a substrate coated on at least one surface thereof with a cured adhesive composition comprising the following components:
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(a) an ethylenically-unsaturated polysiloxane, (b) a polyhydrosiloxane, (c) an amount of a platinum or other metal-containing hydrosilation catalyst sufficient to facilitate the reaction of components (a) and (b), and (d) an amount of an organic hydrosilation inhibitor sufficient to inhibit premature gelation of the mixture of components (a), (b), and (c) at low, ambient or room temperature but insufficient in amount to prevent hydrosilation of the mixture at an elevated temperature, said organic hydrosilation inhibitor having the structural formula ##STR12## wherein R2 is ethynylene or cis-etheynlene; R3 is a saturated or unsaturated organic group having 1 to 12 carbon atoms which is unsubstituted or substituted by 1 to 23 halogen atoms, and has up to 25 hydrogen atoms, and 0 to 5 non-peroxidic catenary oxygen atoms; and X is --O-- or ##STR13## in which R4 is the same as defined for R3, and R3 and R4 together can form an alkylene group which with the N can form a 5- or 6-atom membered saturated azacyclic ring. - View Dependent Claims (5, 6, 7, 8)
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Specification