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Power chip package

  • US 4,538,170 A
  • Filed: 01/03/1983
  • Issued: 08/27/1985
  • Est. Priority Date: 01/03/1983
  • Status: Expired due to Term
First Claim
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1. A power chip package comprising:

  • a power chip having a first terminal on one side thereof and a second terminal on the opposite side thereof;

    a first dielectric substrate;

    a first sheet metal lead attached to one side of said first dielectric substrate and patterned in mirror image fashion to, and attached to, said first terminal;

    a second dielectric substrate;

    a second sheet metal lead attached to one side of said second dielectric substrate and patterned in mirror image fashion to, and attached to, said second terminal; and

    a heat transfer means in heat flow communication with said first and second dielectric substrates for transferring heat between said first and second dielectric substrates, said heat transfer means comprising a plurality of compacted folds of sheet metal interposed between said first and second dielectric substrates.

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