Data processing card system and method of forming same
First Claim
1. A data processing card system, comprising:
- (a) means for mounting at least one circuit chip device, said circuit chip mounting means including first flexible carrier means comprising an electrically insulating tape layer member having at least one aperture formed therethrough for registry with predetermined electrically active areas of said chip device and a plurality of electrically conductive lead members secured to said insulating tape member and extending within said aperture for coupling to said active areas of said chip device;
(b) substrate carrier means formed of a substantially rigid, electrically insulated and thermally conductive member composition located adjacent said circuit chip device mounting means, said substrate carrier means having at least a first predetermined electrical lead pattern formed thereon, said first electrical lead pattern being electrically coupled to predetermined contact areas of said circuit chip device; and
,(c) means for substantially isolating said combined substrate carrier means and said circuit chip device mounting means from an external environment.
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0 Petitions
Accused Products
Abstract
A data processing card system (10) which is mounted within the general geometrical contoured dimensions of a card-like housing (46). The data processing card system (10) includes a plurality of circuit chip devices (14) mounted to a flexible film carrier member (16). The flexible film carrier member (16) is electrically and mechanically coupled to a substrate carrier member (30). The substrate carrier member (30) includes an electrical pattern (40) at least formed on a first surface (34) thereof for electrical coupling to predetermined input leads of the circuit chip devices (14). The combination of the flexible film carrier member (16) and the substrate carrier member (30) are sandwiched between a pair of upper and lower plastic layers (42 and 44) in a substantially hermetic sealing type environment. An edge face (38) of the substrate carrier member (30) provides for a heat dissipation surface area as well as an area wherein electrical connecting pin members (36) are extended to the edge of face (38) for coupling with external devices. The data processing card system (10) is portable and may be carried by the user for insert into external terminal devices for actuation of the data processing card system (10).
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Citations
60 Claims
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1. A data processing card system, comprising:
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(a) means for mounting at least one circuit chip device, said circuit chip mounting means including first flexible carrier means comprising an electrically insulating tape layer member having at least one aperture formed therethrough for registry with predetermined electrically active areas of said chip device and a plurality of electrically conductive lead members secured to said insulating tape member and extending within said aperture for coupling to said active areas of said chip device; (b) substrate carrier means formed of a substantially rigid, electrically insulated and thermally conductive member composition located adjacent said circuit chip device mounting means, said substrate carrier means having at least a first predetermined electrical lead pattern formed thereon, said first electrical lead pattern being electrically coupled to predetermined contact areas of said circuit chip device; and
,(c) means for substantially isolating said combined substrate carrier means and said circuit chip device mounting means from an external environment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 30, 31)
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- 13. The data processing card system as recited in claim 13 where said substrate carrier means includes a substantially planar substrate member having an upper surface and a lower surface.
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32. A method of forming a data processing card system including the steps of:
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(a) securing at least one circuit chip device to at least a first flexible carrier member; (b) forming a first predetermined electrical lead pattern on an upper surface of a substantially rigid, electrically insulative, and thermally conductive substrate carrier member; and
,(c) electrically coupling said circuit chip device to said first electrical lead pattern formed on said substrate carrier member. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60)
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Specification