Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits
First Claim
1. An essentially isotropic metallizable polymeric substrate, comprising a fibrous organic polymer matrix bonded together with a cured imido prepolymer and including particulate filler material distributed therethrough, said substrate having low moisture absorption ranging from 0.03 to 0.5% and a coefficient of thermal expansion, at a temperature ranging from -65°
- C. to 125°
C., which ranges from 3 to 8×
10-6 cm/cm/°
C.
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Accused Products
Abstract
Essentially isotropic metallizable polymeric substrates having very low coefficients of thermal expansion are well adopted for printed circuits, are facilely prepared by papermaking technique and hot pressing, and are comprised of a fibrous polymer matrix, advantageously an aramide non-woven batt, bonded together with a cured imido prepolymer, and include particulate filler material, advantageously electrically insulating metal oxide particles, distributed therethrough.
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Citations
19 Claims
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1. An essentially isotropic metallizable polymeric substrate, comprising a fibrous organic polymer matrix bonded together with a cured imido prepolymer and including particulate filler material distributed therethrough, said substrate having low moisture absorption ranging from 0.03 to 0.5% and a coefficient of thermal expansion, at a temperature ranging from -65°
- C. to 125°
C., which ranges from 3 to 8×
10-6 cm/cm/°
C. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
- C. to 125°
Specification