Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits

• US 4,541,894 A
• Filed: 05/29/1984
• Issued: 09/17/1985
• Est. Priority Date: 05/27/1983
• Status: Expired due to Term

• Current Assignee: Huntsman Advanced Materials Americas, Inc.
• Original Assignee: Rhone-Poulenc SA (Sanofi )
• Inventors: Cassat, Robert
• Primary Examiner(s): Bell, James J.
• Application Number:
  US06/614,760
• Time in Patent Office: 476 Days
• Field of Search: 162/181.9, 162/146, 162/138, 162/157.3, 162/168.2, 162/168.7, 162/181.9, 162/124, 162/125, 162/128, 428/901, 428/283, 428/290, 428/329, 428/474, 428/323
• US Class Current: 162/138
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0236 Plating catalyst as filler in insulating material
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 2203/125 Inorganic compounds, e.g. silver salt
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/2982 Particulate matter [e.g., sphere, flake, etc.]
• CPC Class Codes: Y10T 442/656 Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]

Abstract

Essentially isotropic metallizable polymeric substrates having very low coefficients of thermal expansion are well adopted for printed circuits, are facilely prepared by papermaking technique and hot pressing, and are comprised of a fibrous polymer matrix, advantageously an aramide non-woven batt, bonded together with a cured imido prepolymer, and include particulate filler material, advantageously electrically insulating metal oxide particles, distributed therethrough.

Claims

1. An essentially isotropic metallizable polymeric substrate, comprising a fibrous organic polymer matrix bonded together with a cured imido prepolymer and including particulate filler material distributed therethrough, said substrate having low moisture absorption ranging from 0.03 to 0.5% and a coefficient of thermal expansion, at a temperature ranging from -65°

C. to 125°

C., which ranges from 3 to 8×

10^-6 cm/cm/°

C.

2. The metallizable substrate as defined by claim 1, said polymer matrix comprising an aramide non-woven batt.

3. The metallizable substrate as defined by claim 1, said binder comprising a polyimide prepolymer reaction product of an unsaturated dicarboxylic acid N,N'"'"'-bis-imide with a primary polyamine.

4. The metallizable substrate as defined by claim 1, said binder comprising a polyimide prepolymer reaction product of an unsaturated dicarboxylic acid N,N'"'"'-bis-imide with a primary polyamine and an adjuvant comonomer which comprises a monoimide, an ethylenically unsaturated comonomer copolymerizable therewith, an unsaturated polyester or an hydroxylated organosilicon compound.

5. The metallizable substrate as defined by claim 1, said filler material comprising electrically insulating metal oxide particles.

6. The metallizable substrate as defined by claim 5, said metal oxide particles having particle sizes ranging from 0.1 to 5 microns.

7. The metallizable substrate as defined by claim 5, said metal oxide particles comprising cuprous oxide.

8. The metallizable substrate as defined by claim 1, said polymer matrix comprising fibers up to about 25 mm in length.

9. The metallizable substrate as defined by claim 1, comprising from 20 to 60% by weight of fibrous polymer matrix, from 20 to 70% by weight of binder polymer, and from 10 to 60% by weight of filler.

10. The metallizable substrate as defined by claim 1, said polymer matrix further comprising a minor amount of inorganic fibers.

11. The metallizable substrate as defined by claim 5, said filler material comprising up to 40% by weight thereof, of an inert filler.

12. The metallizable substrate as defined by claim 1, further comprising a metallic overlayer on at least one of the face surfaces thereof.

13. The metallizable substrate as defined by claim 1, further comprising a metallic circuit pattern on at least one of the face surfaces thereof.

14. The metallizable substrate as defined by claim 5, said metal oxide particles being exposed on at least one of the face surfaces thereof.

15. The metallizable substrate as defined by claim 14, said metal oxide particles having been reduced to free metallic state.

16. The metallizable substrate as defined by claim 15, further comprising an electrolytically deposited metallic overlayer on at least one of the face surfaces thereof.

17. A process for the preparation of the metallizable substrate as defined by claim 1, comprising formulating a papermaking slurry of said matrix fibers, an imido prepolymer and said filler, depositing a coherent web therefrom, drying said web, and thence hot pressing, to compact and cure same, at a temperature ranging from 70°

C. to 250°

C. under a pressure of from 10 to 300 bars.

18. The process as defined by claim 17, said imido prepolymer being formulated in powder form.

19. The product of the process as defined by claim 17.