System for measuring electrical resistance and temperature during manufacture of thin, conductive films deposited on substrates by means of evaporation or sputter deposition

• US 4,543,576 A
• Filed: 05/25/1982
• Issued: 09/24/1985
• Est. Priority Date: 06/12/1981
• Status: Expired due to Term

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Mayer, Norbert, Hieber, Konrad
• Primary Examiner(s): Groody, James J.
• Application Number:
  US06/381,898
• Time in Patent Office: 1,218 Days
• Field of Search: 340/870.17, 340/870.19, 340/870.22, 427/8, 427/10, 374/185, 29/574, 29/612, 338/22 SD, 204/192 R, 204/298
• US Class Current: 340/870.17
• CPC Class Codes: C23C 14/54 Controlling or regulating the coating process
• CPC Class Codes: G01K 13/00 Thermometers specially adapted for specific purposes
• CPC Class Codes: G01R 27/02 Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant by measuring phase angle only G01R25/00
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/302 Contactless testing G01R31/66 takes precedence
• CPC Class Codes: H01C 17/22 adapted for trimming

Abstract

A system for measuring electrical resistance and temperature during the manufacture of thin, conductive films deposited on substrates by means of evaporation or sputter-deposition. A deposition unit with an evacuatable load lock chamber and a rotating substrate holder are employed as the deposition system. The specific electrical resistance of the film is measured according to the principle of the two-point or four-point measuring methods at a reference substrate with specific sample geometry and with low-resistance contacts. The substrate temperature is measured by means of resistance thermometers. With the invention, the transmission of the measured data occurs contact-free by means of electro-magnetic radiation, preferably by means of a telemetric pulse code modulation method.

Claims

1. A system for measuring electrical resistance and temperature during the manufacture of a thin, conductive film deposited on a substrate by means of evaporation or sputter-deposition, comprising:

an evacuated processing unit for deposition of the conductive film and having an evacuatable load lock chamber;

a movable substrate holder;

a reference substrate;

deposited film geometry defining means;

means for measuring an electrical resistance of the deposited film on the reference substrate according to a two-point or four-point measuring method, said means for measuring including low-resistance contacts and resistance thermometer means for measuring substrate temperature; and

transmitting means for producing and transmitting measured data, obtained in conjunction with the measuring means in a contact-free manner, to an exterior of the processing unit by electro-magnetic radiation; and

said means for transmitting being attached as an independent unit to the movable substrate holder.

2. A system according to claim 1 wherein the transmitting means comprises a telemetric system utilizing pulse code modulation (PCM).

3. A system according to claim 1 wherein the transmitting means comprises

(a) a resistance measurement device containing a constant current source which applies a constant current to the resistance to be measured and a device to measure the generated voltage drop across the resistance to be measured;

(b) a converter formed of a PCM modulator means which cyclically senses individual measuring locations and converts analog measured voltages into digital signals;

(c) a transmitter which, together with the resistance measurement device, the converter, as well as a power supply is situated directly adjacent the movable substrate holder;

(d) a reception antenna attached in insulated fashion to an inside of the processing unit; and

(e) a receiver positioned outside the processing unit and which decodes received signals.

4. A system according to claim 3 wherein the power supply is coupled to the resistance measurement device, the converter, and transmitter via a wiper contact and is located exterior to the processing unit.

5. A system according to claim 1 wherein the transmitting means includes a high frequency transmitter and a reception antenna introduced into the processing unit through an insulated electrical vacuum feedthrough.

6. A system according to claim 1 wherein the transmitting means comprises an infrared system formed of an infrared transmitter and a sensor sensitive to infrared radiation as a reception antenna.

7. A system according to claim 1 wherein the transmitting means includes a receiver coupled to a process control computer means for acceptance of digital data of measured resistance and temperature.

8. A system according to claim 1 wherein the transmitting means comprises a resistance measurement device, a converter, a transmitter, and a power supply all constructed in miniaturized format and thermally insulated.

9. A system according to claim 1 wherein the transmitting means is encapsulated in vacuum-tight fashion.

10. A system according to claim 1 wherein the substrate holder is designed as a double pallet, one of the pallets containing the reference substrate and the other pallet spaced from the first pallet by spacer pieces having the transmitting means mounted thereon on a side facing the first pallet.

11. A system according to claim 1 wherein the reference substrate is fixed on the substrate holder by spring loaded measuring contacts.

12. A system according to claim 1 wherein the resistance thermometer means are disposed directly below the reference substrate.

13. A system according to claim 1 wherein a plurality of reference substrates and a plurality of temperature locations are connected to the transmitting means.

14. A system according to claim 1 wherein electrical filter means are provided for elimination of high frequency interference occurring during sputter-deposition of the conductive films.

15. A system according to claim 1 wherein the transmitting means includes an amplifier connected to amplify analog measured voltages from a resistance measurement device in the transmitting means.

16. A system according to claim 1 wherein a power supply for the transmitting means comprises batteries.

17. A system for measuring electrical resistance during manufacture of thin, conductive films deposited on a substrate by means of evaporation of sputter-deposition in an evacuated processing unit, comprising:

a movable substrate holder;

a reference substrate on the holder;

electrode means for measuring an electrical resistance of a deposited film on the reference substrate; and

transmitting means physically connected to the movable substrate and electrically connected to the electrodes for making resistance measurements and transmitting the measurements to an exterior of the processing unit by electromagnetic radiation.

18. A system according to claim 17 wherein the movable substrate holder comprises first and second spaced apart pallets, the first pallet having the reference substrate thereon on to which the film is evaporated or sputter-deposited and the other pallet has the transmitting means mounted thereon.

19. The system of claim 18 wherein the electrodes comprise spring loaded contacts extending between the two pallets.