Process of manufacturing candy bars containing wafers and wafer bars manufactured thereby

• US 4,545,997 A
• Filed: 09/11/1984
• Issued: 10/08/1985
• Est. Priority Date: 03/21/1983
• Status: Expired due to Term

• Current Assignee: Derry, Inc.
• Original Assignee: Hershey Foods Corporation (The Hershey Company)
• Inventors: Wong, Carl Y., Mihalik, John A., Khan, Mir N.
• Primary Examiner(s): HUNTER, JEANETTE M
• Application Number:
  US06/649,166
• Time in Patent Office: 392 Days
• Field of Search: 426/275, 426/283, 426/274, 426/94, 426/103, 426/303, 426/306, 426/660
• US Class Current: 426/94
• CPC Class Codes: A21C 15/02 Apparatus for shaping or moulding baked wafers; Making multi-layer wafer sheets
• CPC Class Codes: A21D 13/36 Filled wafers
• CPC Class Codes: A21D 13/80 Pastry not otherwise provided for elsewhere, e.g. cakes, biscuits or cookies
• CPC Class Codes: A23G 3/2007 Manufacture of filled articles, composite articles, multi-layered articles
• CPC Class Codes: A23G 3/2023 the material being shaped at least partially in a mould, in the hollows of a surface, a drum, an endless band or by drop-by-drop casting or dispensing of the materials on a surface or an article being completed
• CPC Class Codes: A23G 3/34 Sweetmeats, confectionery or marzipan; Processes for the preparation thereof
• CPC Class Codes: A23G 3/54 Composite products, e.g. layered, coated, filled

Abstract

A process is disclosed for producing a chocolate coated creamed wafer candy bar, wherein the coating layer does not crack or delaminate during normal storage. Wafer sheets are first baked and their moisture content is substantially increased. A layer of cream having a moisture content less than that of the wafer sheets is applied to the wafer sheets and smaller units of creamed wafers are formed and coated with a paste to produce a candy bar.

Claims

1. A process for producing a chocolate enrobed creamed wafer candy bar comprising the steps of:

a. producing sheets of baked wafers;

b. cooling said sheets;

c. passing said cooled sheets through an in-line maturing tunnel in which the conditions are maintained at a temperature and dew point such that the moisture content of said sheets is increased to about 3.5 to about 6.0%;

d. maintaining a controlled environment room in which the temperature is held in the range from about 65°

F. to about 80°

F. and the relative humidity is held at or below about 30%;

e. passing said sheets out of said tunnel and into said controlled environment room;

f. forming a cream having a moisture content less than about 3.5% and less than the moisture content of said wafers;

g. applying a cream to said wafer sheets while inside said room and forming stacks of said coated wafer sheets while inside said room;

h. cutting said stacks into candy-size units; and

i. applying a chocolate coating to said candy-size units to produce a chocolate creamed wafer candy bar which is resistant to delamination of the chocolate coating.

2. A process for producing a candy bar as in claim 1 wherein said maturing step includes passing said cooled sheets through an in-line maturing tunnel and then immediately passing the wafer sheets into the controlled environment room.

3. A process for producing a candy bar as in claim 2 wherein said process includes the steps of:

a. applying a layer of cream to said sheets after said sheets emerge from said in-line tunnel and enter said controlled environment room;

b. forming stacks of wafer sheet layers and cream while within said controlled environment room;

c. cooling said stacks of wafer sheet and cream layers while within said controlled environment room;

d. cutting said stacks of wafer sheets and cream layers into smaller units of wafer and cream layers while within said room; and

e. enrobing said smaller units with a chocolate paste immediately after they have been cut.

5. A candy bar produced in accordance with the process of claim 1 characterized by resistance to delamination.

4. A process for producing a chocolate enrobed creamed wafer candy bar comprising the steps of:

a. producing sheets of baked wafers;

b. cooling said sheets;

c. maintaining a controlled environment room in which the temperature is in the range from about 65°

F. to about 80°

F. and the relative humidity is maintained at or below about 30%;

d. passing said cooled sheets into and through an inline maturing tunnel and immediately into said controlled environment room, said maturing tunnel being maintained at a temperature higher than that of said room under conditions whereby the moisture content of said sheets is increased to about 3.5% to about 6.0%;

e. coating said wafer sheets with a cream having a moisture content less than that of the wafers, and forming stacks comprising layers of wafer and cream while in said controlled environment room;

f. cooling said stacks of wafer and cream layers while in said room;

g. cutting said stacks into substantially smaller units while in said room;

h. enrobing said smaller units with a chocolate paste;

i. cooling said enrobed units in a cooling tunnel located outside of said room; and

j. packaging said enrobed units to preserve the inherent qualities of taste, smell, texture, shape and freshness.

6. A candy bar produced in accordance with the process of claim 4 characterized by resistance to delamination.

7. A process for producing a wafer for use in a candy bar comprising the steps of:

a. making a wafer mixture by mixing predetermined amounts of sugar, water, sodium bicarbonate, soft wheat flour, refined palm kernal oil and lecithin for approximately four minutes;

b. baking said wafer mixture into wafer sheets of a predetermined size in an oven at a temperature between about 325°

F. and about 350°

F. for approximately two minutes;

c. cooling said sheets for approximately five minutes;

d. maintaining a controlled environment room in which the temperature is maintained in the range from about 65°

F. to about 80°

F. and the relative humidity is maintained at or below about 30%;

e. passing said cooled wafer sheets into and through an in-line maturing tunnel and into said room for further processing, said maturing tunnel being maintained at a second temperature lower than that of said room; and

f. applying a cream layer to said wafer sheets wherein the moisture content of the cream is less than that of the wafers and wherein the water vapor partial pressure of the cream is less than the water vapor partial pressure of the wafers.

8. A wafer produced in accordance with the process of claim 7 characterized by resistance to delamination.

9. A process for producing a coated, creamed wafer candy bar in which the coating is protected from delamination, said creamed wafer bar including at least one layer of cream interspersed between at least two wafer layers comprising the steps of:

forming a layer of cream between at least two wafer layers wherein the moisture content of the wafer layers exceeds that of the cream layer and then coating the cream-wafer combination to form a coated candy bar.

10. The process of claim 9 further including the steps of forming a wafer sheet, increasing the moisture content of said sheet and applying a cream coating to said sheet wherein the moisture content of the cream is less than that of the wafer sheet.

11. The process of claim 9 wherein the water vapor partial pressure of the cream is less than the water vapor partial pressure of the wafer.

12. The process of claim 9 wherein the wafer sheet and the cream are in an environment at the time the cream is applied to the wafer in which the relative humidity is 30% or less.

13. A coated creamed-wafer candy bar produced by the process of claim 9.