Process of manufacturing ceramic circuit board

• US 4,551,357 A
• Filed: 10/16/1984
• Issued: 11/05/1985
• Est. Priority Date: 05/25/1984
• Status: Expired due to Term

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Takeuchi, Yukihisa
• Primary Examiner(s): Newsome, John H.
• Application Number:
  US06/661,470
• Time in Patent Office: 385 Days
• Field of Search: 427/96, 427/376.3, 427/376.6
• US Class Current: 427/97.5
• CPC Class Codes: B22F 2998/00 Supplementary information concerning processes or compositions relating to powder metallurgy
• CPC Class Codes: B22F 3/1021 Removal of binder or filler removal of binder from ceramics C04B35/638
• CPC Class Codes: B22F 7/06 of composite workpieces or articles from parts, e.g. to form tipped tools B22F7/002 takes precedence
• CPC Class Codes: C04B 35/634 Polymers C04B35/636 takes precedence
• CPC Class Codes: C04B 35/63408 Polyalkenes
• CPC Class Codes: C04B 35/63416 Polyvinylalcohols [PVA]; Polyvinylacetates
• CPC Class Codes: C04B 35/63424 Polyacrylates; Polymethacrylates
• CPC Class Codes: C04B 35/63432 Polystyrenes
• CPC Class Codes: C04B 35/638 Removal thereof
• CPC Class Codes: C04B 41/009 characterised by the material treated
• CPC Class Codes: C04B 41/4505 characterised by the method of application
• CPC Class Codes: C04B 41/4578 Coating or impregnating of green ceramics or unset concrete
• CPC Class Codes: C04B 41/48 Macromolecular compounds
• CPC Class Codes: C04B 41/51 Metallising , e.g. infiltration of sintered ceramic preforms with molten metal covering materials with metals in general C23C; ceramic compositions containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides, other than as macroscopic reinforcing agents C22C; infiltration of preforms containing free metal, e.g. cermets C22C
• CPC Class Codes: C04B 41/5144 with a composition mainly composed of one or more of the metals of the iron group
• CPC Class Codes: C04B 41/5188 organic
• CPC Class Codes: C04B 41/52 Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
• CPC Class Codes: C04B 41/53 involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete C04B41/0036 - C04B41/0054 take precedence
• CPC Class Codes: C23C 24/00 Coating starting from inorganic powder spraying of the coating material in molten state C23C4/00; solid state diffusion C23C8/00 - C23C12/00
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2203/1126 : Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
• CPC Class Codes: H05K 3/1291 : Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets

Abstract

A process of manufacturing a ceramic circuit board, wherein at least dielectric ceramics and a conductor paste of base metal are co-fired, comprising the steps of preparing the conductor paste containing an organic material which is thermally decomposed at a temperature higher than a decomposition point of an organic binder contained in the dielectric ceramics, and forming a circuit pattern of the conductor paste containing the organic material. Alternatively, the process comprises the steps of forming the circuit pattern of the conductor paste and covering the formed circuit pattern with the organic material. The process further comprises the steps of thermally decomposing the organic binder in an oxidizing atmosphere at a temperature lower than the decomposition point of the organic material, and thermally decomposing the organic material in an atmosphere having a partial oxygen pressure lower than that of the oxidizing atmosphere.

Claims

1. A process for manufacturing a ceramic circuit board, wherein at least dielectric ceramics and a conductor paste of base metal are co-fired, comprising the steps of:

preparing said conductor paste of base metal containing an organic material which is thermally decomposed at a temperature higher than a decomposition point of an organic binder contained in said dielectric ceramics;

forming a circuit pattern of said conductor paste containing said organic material;

thermally decomposing said organic binder in an oxidizing atmosphere at a temperature lower than said decomposition point of said organic material; and

thermally decomposing said organic material in an atmosphere having a partial oxygen pressure lower than that of said oxidizing atmosphere.

2. A process as claimed in claim 1, wherein said conductor paste of base metal comprises copper and/or nickel as a major component or major components thereof.

3. A process as claimed in claim 1, wherein said organic binder contained in said dielectric ceramics comprises at least one of organic binders selected from the group consisting of acrylic resins, methacrylic resins, and acrylate-methacrylate copolyer resins, and said organic material contained in said conductor paste comprises at least one of organic materials selected from the group consisting of polystyrene resins, polyethylene resins and ethylene-vinyl acetate copolymers.

4. A process as claimed in claim 2, wherein said organic binder contained in said dielectric ceramics comprises at least one of organic binders selected from the group consisting of acrylic resins, methacrylic resins, and acrylate-methacrylate copolymer resins, and said organic material contained in said conductor paste comprises at least one of organic materials selected from the group consisting of polystyrene resins, polyethylene resins and ethylene-vinyl acetate copolymers.

5. A process as claimed in claim 1, wherein said circuit pattern is printed on a green sheet of said dielectric ceramics, with said conductor paste containing said organic material.

6. A process as claimed in claim 5, wherein said circuit pattern is printed on a plurality of green sheets of said dielectric ceramics, and the green sheets with the printed circuit patterns are laminated to form an unfired laminated sheet structure which is subsequently co-fired into said ceramic circuit board.

7. A process as claimed in claim 1, wherein a dielectric paste is prepared from said dielectric ceramics, and said dielectric paste and said conductor paste are used to print at least one dielectric layer in a predetermined pattern, and at least one conductor layer in the form of said circuit pattern, respectively, said at least one dielectric layer and said at least one conductor layer being alternately superposed one on another to form an unfired printed laminate structure.

8. A process as claimed in claim 1, said dielectric ceramics include at least one insulating glass selected from the group consisting of silicate glass, and crystallizable glass which is crystallized through heat treatment thereof.

9. A process as claimed in claim 8, wherein said silicate glass includes at least one of Al₂ O₃, B₂ O₃, MgO, PbO, BaO, ZnO, Li₂ O, CaO and ZrO₂.

10. A process as claimed in claim 8, wherein said crystallizable glass is selected from the group consisting of:

glass composition consisting essentially of SiO₂, Al₂ O₃, CaO, ZnO and TiO₂ ;

glass composition consisting essentially of SiO₂, MgO, BaO, B₂ O₃ and ZnO;

glass composition consisting essentially of SiO₂, Al₂ O₃, PbO and CaO;

glass composition consisting essentially of SiO₂, Al₂ O₃, CaO, B₂ O₃ and MgO; and

glass composition consisting essentially of SiO₂, B₂ O₃, PbO and CaO.

11. A process as claimed in claim 1, wherein said organic material is contained in said conductor paste in an amount of 1-30% by weight.

12. A process as claimed in claim 11, wherein said organic material is contained in said conductor paste in an amount of 2-7% by weight.

13. A process as claimed in claim 1, wherein said organic material is applied in the form of a solution to prepare the conductor paste containing the organic material.

14. A process as claimed in claim 1, wherein said dielectric ceramics includes at least one inorganic peroxide.

15. A process as claimed in claim 14, wherein said peroxide is strontium peroxide.

16. A process of manufacturing a ceramic circuit board, werein at least dielectric ceramics and a conductor paste of base metal are co-fired, comprising the steps of:

forming a circuit pattern of said conductor paste of base metal;

covering the formed circuit pattern with an organic material which is thermally decomposed at a temperature higher than a decomposition point of an organic binder contained in said dielectric ceramics;

thermally decomposing said organic binder in an oxidizing atmosphere at a temperature lower than said decomposition point of said organic material; and

thermally decomposing said organic material in an atmosphere having a partial oxygen pressure lower than that of said oxidizing atmosphere.

17. A process as claimed in claim 16, wherein said organic material is applied in the form of a solution to cover said circuit pattern.

18. A process as claimed in claim 16, wherein said conductor paste of base metal comprises copper and/or nickel as a major component or major components thereof.

19. A process as claimed in claim 16, wherein said organic binder contained in said dielectric ceramics comprises at least one of organic binders selected from the group consisting of acrylic resins, methacrylic resins, and acrylate-methacrylate copolymer resins, and said organic material contained in said conductor paste comprises at least one of organic materials selected from the group consisting of polystyrene resins, polyethylene resins and ethylene-vinyl acetate copolymers.

20. A process as claimed in claim 17, wherein said organic binder contained in said dielectric ceramics comprises at least one of organic binders selected from the group consisting of acrylic resins, methacrylic resins, and acrylate-methacrylate copolyer resins, and said organic material contained in said conductor paste comprises at least one of organic materials selected from the group consisting of polystyrene resins, polyethylene resins and ethylene-vinyl acetate copolymers.

21. A process as claimed in claim 16, wherein said circuit pattern is printed on a green sheet of said dielectric ceramics, with said conductor paste containing said organic material.

22. A process as claimed in claim 21, wherein said circuit pattern is printed on a plurality of green sheets, and the green sheets with the printed circuit patterns are laminated to form an unfired laminated sheet structure which is subsequently co-fired into said ceramic circuit board.

23. A process as claimed in claim 16, wherein a dielectric paste is prepared from said dielectric ceramics, and said dielectric paste and said conductor paste are used to print at least one dielectric layer in a predetermined pattern, and at least one conductor layer in the form of said circuit pattern, respectively, said at least one dielectric layer and said at least one conductor layer being alternately superposed one on another to form an unfired printed laminate structure.

24. A process as claimed in claim 16, said dielectric ceramics include at least one insulating glass selected from the group consisting of silicate glass, and crystallizable glass which is crystallized through heat treatment thereof.

25. A process as claimed in claim 24, wherein said silicate glass includes at least one of Al₂ O₃, B₂ O₃, MgO, PbO, BaO, ZnO, Li₂ O, CaO and ZrO₂.

26. A process as claimed in claim 24, wherein said crystallizable glass is selected from the group consisting of:

glass composition consisting essentially of SiO₂, Al₂ O₃, CaO, ZnO and TiO₂ ;

glass composition consisting essentially of SiO₂, MgO, BaO, B₂ O₃ and ZnO;

glass composition consisting essentially of SiO₂, Al₂ O₃, PbO and CaO;

glass composition consisting essentially of SiO₂, Al₂ O₃, CaO, B₂ O₃ and MgO; and

glass composition consisting essentially of SiO₂, B₂ O₃, PbO and CaO.

27. A process as claimed in claim 16, wherein said organic material is contained in said solution in an amount of 1-30% by weight.

28. A process as claimed in claim 27, wherein said organic material is contained in said solution in an amount of 2-7% by weight.

29. A process as claimed in claim 16, wherein said dielectric ceramics includes at least one inorganic peroxide.

30. A process as claimed in claim 27, wherein said peroxide is strontium peroxide.