Method for encapsulating semiconductor devices

• US 4,554,126 A
• Filed: 07/01/1983
• Issued: 11/19/1985
• Est. Priority Date: 07/03/1982
• Status: Expired due to Term

• Current Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
• Original Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
• Inventors: Sera, Michitoshi
• Primary Examiner(s): Lowe, James
• Application Number:
  US06/510,226
• Time in Patent Office: 872 Days
• Field of Search: 264/272.17, 264/115, 264/328.17, 264/331.12, 264/331.15, 264/328.5, 29/588, 528/502
• US Class Current: 264/272.17
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A high-density resin tablet and a method for encapsulating semiconductor devices using the same, by which molded products free from voids may be obtained. The high-density resin tablet of the present invention may be obtained by compressing a thermosetting resin such as an epoxy resin at a pressure of 4 ton/cm² or more, and has a compressibility of 95% or more. The tablet of the present invention may be used in the same manner as the conventional tablets in multitablet molding and transfer molding method.

Claims

1. A method for resin encapsulation of a semiconductor device, comprising the steps of:

providing a lower mold die having a flat portion and a cavity;

providing an upper mold die having a flat portion and a cavity corresponding to the flat portion and the cavity of the lower mold die respectively;

fixing the semiconductor device between the cavities of the upper and lower mold dies;

plasticizing a high-density tablet of a thermosetting resin having a compressibility of not less than 95%;

injecting the plasticized resin into a space defined between the cavities of the upper and lower mold dies to cover the semiconductor device; and

curing the injected resin.

2. A method for resin encapsulation of a semiconductor device, comprising the steps of:

providing a lower mold die having a channel, a first cavity communicating with one end of the channel, and a pot communicating with the other end of the channel;

providing an upper mold die having a second cavity at a position corresponding to a position of the first cavity and also having a through hole at a position corresponding to a position of the pot;

placing a lead frame around an outer periphery of the semiconductor device on an edge of the first cavity of the lower mold die;

fixing the semiconductor device in a space defined between the cavities of the upper and lower mold dies when the upper mold die is placed on the lower mold die;

inserting a high-density tablet made of a thermosetting resin and having a compressibility of not less than 95% into the pot through the through hole;

heating and plasticizing the tablet;

pressing the plasticized thermosetting resin in the pot by means of a plunger through the through hole, thereby injecting the plasticized thermosetting resin into the space defined between the first and second cavities in which the semiconductor device is fixed; and

heating and curing the thermosetting resin injected into the space.

3. The method according to claim 2, wherein heating for plasticizing the tablet and heating for curing the thermosetting resin are performed by preheating the upper and lower mold dies.

4. A method for resin encapsulation of a semiconductor device comprising the steps of:

providing a lower mold die having a plurality of pots, a plurality of cavities each communicating with each pot through a channel;

providing an upper mold die having a plurality of through holes and cavities corresponding to the pots and cavities of the lower mold die;

placing a lead frame around an outer periphery of the semiconductor device on an edge of each of the cavities of the lower mold die;

fixing the semiconductor device in each space defined between the cavities of the upper and lower mold dies when the upper mold die is placed on the lower mold die;

inserting a high-density tablet made of a thermosetting resin and having a compressibility of not less than 95% into each pot through each through hole;

heating and plasticizing the tablet;

pressing the plasticized thermosetting resin in each pot by means of a plunger through each through hole, thereby injecting the plasticized thermosetting resin into each space defined between the cavities of the upper and the lower mold dies, in which the semiconductor device is fixed; and

heating and curing the thermosetting resin injected into each space.