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Multilayer hybrid integrated circuit

  • US 4,554,229 A
  • Filed: 04/06/1984
  • Issued: 11/19/1985
  • Est. Priority Date: 04/06/1984
  • Status: Expired due to Term
First Claim
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1. A multilayer circuit device comprising a substrate having a metallized pattern thereon and a plurality of polymeric dielectric film layers each having a metallized circuit pattern thereon with metallized microvias interconnecting the metallized patterns of one layer with that of at least one other metallized layer thereunder, said polymeric dielectric layer being formed from a photodefinable triazine base mixture including a photosensitive acrylate moiety wherein the triazine comprises from 40-65 weight percent of the mixture.

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