Multilayer hybrid integrated circuit
First Claim
1. A multilayer circuit device comprising a substrate having a metallized pattern thereon and a plurality of polymeric dielectric film layers each having a metallized circuit pattern thereon with metallized microvias interconnecting the metallized patterns of one layer with that of at least one other metallized layer thereunder, said polymeric dielectric layer being formed from a photodefinable triazine base mixture including a photosensitive acrylate moiety wherein the triazine comprises from 40-65 weight percent of the mixture.
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Abstract
A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.
71 Citations
9 Claims
- 1. A multilayer circuit device comprising a substrate having a metallized pattern thereon and a plurality of polymeric dielectric film layers each having a metallized circuit pattern thereon with metallized microvias interconnecting the metallized patterns of one layer with that of at least one other metallized layer thereunder, said polymeric dielectric layer being formed from a photodefinable triazine base mixture including a photosensitive acrylate moiety wherein the triazine comprises from 40-65 weight percent of the mixture.
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9. An electronic device having a layer thereon which layer is formed from a photodefinable triazine based mixture wherein the triazine comprises from 40-65 weight percent of the mixture.
Specification