Process for producing composite product having patterned metal layer
First Claim
1. The process for forming a composite product which comprises applying directly to a base a patterned layer of curable resin, curing said resin in said pattern, etching said patterned cured resin in the absence of a mask with an etchant which will permit absorption onto said patterned cured resin of a metal catalyst capable of promoting electroless metal deposition selectively but which will not chemically modify said base so as to permit absorption onto said base of a metal catalyst capable of promoting electroless metal deposition selectively, contacting said etched cured resin with a catalyst composition capable of promoting electroless metal deposition on said etched cured resin without effecting, absorption of said catalyst on said base, activating the absorbed catalyst, and electrolessly depositing a metal layer on said etched cured patterned resin selectively without effecting electroless deposition of said metal layer on the base.
3 Assignments
0 Petitions
Accused Products
Abstract
A multilayered composite product including a base, a patterned cured resin bonded to the base and an applied metal layer selectively bonded to the patterned cured resin. The product is useful as an electrical circuit.
96 Citations
29 Claims
- 1. The process for forming a composite product which comprises applying directly to a base a patterned layer of curable resin, curing said resin in said pattern, etching said patterned cured resin in the absence of a mask with an etchant which will permit absorption onto said patterned cured resin of a metal catalyst capable of promoting electroless metal deposition selectively but which will not chemically modify said base so as to permit absorption onto said base of a metal catalyst capable of promoting electroless metal deposition selectively, contacting said etched cured resin with a catalyst composition capable of promoting electroless metal deposition on said etched cured resin without effecting, absorption of said catalyst on said base, activating the absorbed catalyst, and electrolessly depositing a metal layer on said etched cured patterned resin selectively without effecting electroless deposition of said metal layer on the base.
Specification
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- Resources
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Current AssigneeI D Engineering Incorporated, Polyonics, Inc.
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Original AssigneePolyonics, Inc.
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InventorsHoover, Merwin F., Salamone, Ann B., Vandebult, Jan
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Primary Examiner(s)Newsome, John H.
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Application NumberUS06/485,328Time in Patent Office956 DaysField of Search430/315, 430/414, 430/417, 427/43.1, 427/44, 427/54.1, 427/98US Class Current427/504CPC Class CodesH01L 21/702 of thick-or thin-film circu...H05K 1/162 incorporating printed capac...H05K 1/165 incorporating printed induc...H05K 2201/09563 Metal filled via plated thr...H05K 2201/09909 Special local insulating pa...H05K 3/182 characterised by the patter...H05K 3/381 by special treatment of the...H05K 3/4661 Adding a circuit layer by d...
