Porcelain tape for producing porcelainized metal substrates

• US 4,556,598 A
• Filed: 06/16/1983
• Issued: 12/03/1985
• Est. Priority Date: 06/16/1983
• Status: Expired due to Fees

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Bloom, Terry R., Nespor, John F.
• Primary Examiner(s): Kratz, Peter
• Assistant Examiner(s): Heitbrink, Timothy W.
• Application Number:
  US06/504,990
• Time in Patent Office: 901 Days
• Field of Search: 156/89, 501/14, 428/209, 428/433
• US Class Current: 428/209
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A flexible porcelain tape (10) is manufactured for application to a metal substrate (50) to produce a porcelainized metal substrate (60, 90, 92). The porcelain tape (10) provides an insulative layer (102) upon which can be applied electrical circuits (110) comprising conductive paths (112) and resistors (116), either before or after the porcelain tape (10) is fired. The porcelain tape comprises glass frit (12) blended with a vehicle (11), with volatile gases removed to effect a predetermined viscosity. The mixture (14) is applied evenly to a flexible plastic carrier (16) and dried. The tape (10) may be rolled up and stored until needed, whereupon the flexible carrier (16) is peeled away either before or after the porcelain mixture layer (18) is cut to desired size and configuration. Single or multiple layers of the mixture layer (18) can be disposed upon a metal substrate (50), the combination laminated, and then fired. The resulting single or multiple layer porcelainized metal substrate (60, 90, 92 ) provides an insulated aluminum, steel, or other metal substrate for supporting electrical circuits thereon.

Claims

1. A porcelainized metal substrate, comprising an insulative glass layer bonded to said metal substrate, said insulative glass layer and metal substrate comprising the conjoint product of a mixture of glass frit and vehicle dried on flexible carrier tape, the mixture removed from said carrier tape, and adhered to said metal substrate by heated pressing, said metal substrate and insulative glass layer being the conjoint reaction product of firing said mixture and substrate to melt and bond said mixture to said substrate subsequently to said pressing.

2. The porcelainized metal substrate in accordance with claim 1, wherein the metal substrate comprises an aluminum substrate and said firing occurs at approximately 520°

C.

3. The porcelainized metal substrate in accordance with claim 1, wherein said metal substrate comprises a steel substrate and said firing occurs at approximately 790°

C.

4. The porcelainized metal substrate in accordance with claim 1, further comprising another mixture layer wherein said insulative glass layer and substrate comprise the conjoint reaction product of at least two layers of mixture removed from said carrier means and disposed one upon the other, heat pressed with said metal substrate, and the mixture layers and metal substrate subsequently fired.

6. The porcelainized metal substrate with electrical circuit in accordance with claim 3, wherein said insulative glass layer comprises the product of at least two layers of mixture adhered to the metal substrate by heated pressing.

7. The porcelainized metal substrate with electrical circuit in accordance with claim 3, wherein said insulative glass layer comprises the product of at least two layers of mixture adhered to the metal substrate by heated pressing.

5. A procelainized metal substrate supporting an electrical circuit thereon, comprising an insulative glass layer bonded to said metal substrate, said insulative glass layer and metal substrate comprising the conjoint product of a mixture of glass frit and vehicle dried on flexible carrier tape, the mixture removed from said carrier tape and adhered to said metal substrate by heated pressing, said electrical circuit being the product of disposing conductive and resistive patterns on said mixture layer subsequently to said heated pressing, and said metal substrate, insulative glass layer, and electrical circuit being the conjoint reaction product of firing said mixture, substrate, and electrical circuit to melt and bond said mixture to said substrate subsequently to said pressing.

8. A procelainized metal substrate supporting an electrical circuit thereon, comprising an insulative glass layer bonded to said metal substrate, said insulative glass layer and metal substrate comprising the conjoint product of a mixture of glass frit and vehicle dried on flexible carrier tape, the mixture removed from said carrier tape and adhered to said metal substrate by heated pressing, and said electrical circuit being the product of disposing conductive and resistive patterns on said porcelain subsequently to said firing.