Solventless, polyimide-modified epoxy composition

• US 4,557,860 A
• Filed: 07/06/1984
• Issued: 12/10/1985
• Est. Priority Date: 07/06/1984
• Status: Expired due to Fees

• Current Assignee: National Starch And Chemical Corporation (Ingredion Incorporated)
• Original Assignee: Stauffer Chemical Company (Nouryon BV)
• Inventors: Kim, Ki-Soo, DiSalvo, Anthony L.
• Primary Examiner(s): Jacobs, Lewis T.
• Application Number:
  US06/628,541
• Time in Patent Office: 522 Days
• Field of Search: 523/400, 523/412, 523/413, 523/414, 525/423, 525/43 D, 252/514, 252/512, 252/513
• US Class Current: 252/512
• CPC Class Codes: C08G 59/145 Compounds containing one epoxy group
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: H01B 1/20 Conductive material dispersed in non-conductive organic material organic macromolecular compounds or compositions C08
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). If desired, conductive adhesives of this type can be formed by blending the composition with a conductive filler component.

Claims

1. A polyimide-modified epoxy adhesive composition which comprises:

(a) an epoxy resin;

(b) a soluble polyimide resin; and

(c) a reactive monoepoxy diluent to dissolve the soluble polyimide resin into the epoxy resin, the soluble polyimide resin comprising from about 0.01% to about 20% by weight of epoxy, polyimide and diluent.

2. A composition as claimed in claim 1 wherein the epoxy resin comprises from about 5% to about 90%, by weight of the composition.

3. A composition as claimed in claim 1 wherein the reactive monoepoxy diluent comprises from about 5% to about 60% by weight of the composition.

4. A composition as claimed in any of claims 1, 2 or 3 which further comprises a hardener for the epoxy resin.

5. A composition as claimed in any of claims 1, 2 or 3 which further comprises from about 0.5% to about 80%, by weight of a hardener for the epoxy resin, based on the weight of hardener and adhesive.

6. A composition as claimed in any of claims 1, 2 or 3 which further comprises a conductive filler.

7. A composition as claimed in any of claims 1, 2 or 3 which further comprises from about 50% to about 75%, by weight of the entire composition, of conductive filler.

8. A composition as claimed in any of claims 1, 2 or 3 which further comprises a hardener for the epoxy resin and a conductive filler.

9. A composition as claimed in any of claims 1, 2 or 3 which further comprises from about 50% to about 75%, by weight of the entire composition, of conductive filler with the hardener comprising from about 0.5% to about 80% by weight of the weight of hardener and adhesive.