Solventless, polyimide-modified epoxy composition
First Claim
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1. A polyimide-modified epoxy adhesive composition which comprises:
- (a) an epoxy resin;
(b) a soluble polyimide resin; and
(c) a reactive monoepoxy diluent to dissolve the soluble polyimide resin into the epoxy resin, the soluble polyimide resin comprising from about 0.01% to about 20% by weight of epoxy, polyimide and diluent.
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Abstract
Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). If desired, conductive adhesives of this type can be formed by blending the composition with a conductive filler component.
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Citations
9 Claims
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1. A polyimide-modified epoxy adhesive composition which comprises:
- (a) an epoxy resin;
(b) a soluble polyimide resin; and
(c) a reactive monoepoxy diluent to dissolve the soluble polyimide resin into the epoxy resin, the soluble polyimide resin comprising from about 0.01% to about 20% by weight of epoxy, polyimide and diluent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- (a) an epoxy resin;
Specification