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Solventless, polyimide-modified epoxy composition

  • US 4,557,860 A
  • Filed: 07/06/1984
  • Issued: 12/10/1985
  • Est. Priority Date: 07/06/1984
  • Status: Expired due to Fees
First Claim
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1. A polyimide-modified epoxy adhesive composition which comprises:

  • (a) an epoxy resin;

    (b) a soluble polyimide resin; and

    (c) a reactive monoepoxy diluent to dissolve the soluble polyimide resin into the epoxy resin, the soluble polyimide resin comprising from about 0.01% to about 20% by weight of epoxy, polyimide and diluent.

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