Method of producing a semiconductor device

• US 4,558,510 A
• Filed: 03/23/1984
• Issued: 12/17/1985
• Est. Priority Date: 03/31/1983
• Status: Expired due to Term

• Current Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
• Original Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
• Inventors: Tani, Keizo, Ogasawara, Masahiro
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Auyang, Hunter L.
• Application Number:
  US06/592,596
• Time in Patent Office: 634 Days
• Field of Search: 29/588, 357/72, 357/80, 264/272.17
• US Class Current: 438/127
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 7/005 arrangements of circuit components without supporting structure

Abstract

There is provided a method of producing a semiconductor device comprising a protecting silicone gel layer which covers a semiconductor chip and bonding wires for taking electrodes out of this chip, and a resin layer which has a smaller thermal expansion coefficient than that of this silicone gel layer at least part of which contacts the silicone gel layer. This method comprises the steps of: thermally expanding the silicone gel layer until it reaches the product environmental guarantee temperature which comes before the cure acceleration reaction in the resin layer; and completely curing the resin layer while maintaining the volume of the silicone gel layer at the same time, thereby fixedly adhering it with the other parts.

Claims

1. A method of producing a resin-sealed semiconductor device including a semiconductor chip, electrodes connected to said semiconductor chip, and terminals mounted on said electrodes and projecting up from said electrodes, said method comprising the steps of:

covering said semiconductor chip and said electrodes with a layer of silicone gel without contacting said terminals with said silicone gel;

heating said silicone gel layer to a holding temperature to thermally expand said silicone gel layer;

covering said silicone gel layer with a layer of resin having a coefficient of thermal expansion less than that of said silicone gel while maintaining said silicone gel thermally expanded at said holding temperature, said resin contacting said terminals projecting up from said silicone gel layer; and

heating said resin to a curing temperature higher than said holding temperature to cure said resin.

2. The method according to claim 1, wherein said holding temperature is equal to or higher than the product guarantee temperature of said semiconductor device.

3. The method according to claim 1, wherein said curing temperature is about 130°

C.

4. The method according to claim 1, further comprising the step of preheating said resin to a temperature of about 70°

-80°

C. before said resin covering step.

5. The method according to claim 1, wherein said electrodes are connected to said semiconductor chip by bonding wires and said silicone gel covering step includes covering said bonding wires with said silicone gel.

6. A method of sealing a semiconductor device having at least one projecting element bonded to and projecting up from said semiconductor device, comprising the steps of:

surrounding said semiconductor device with a casing;

filling a first portion of said casing with a heat-expandable and heat-curable gel, said gel covering said semiconductor device without contacting said projecting element, and said projecting element projecting up through said gel;

heating said gel to thermally expand and cure said gel in an expanded state;

filling a second portion of said casing with a heat-curable resin while maintaining said gel in said expanded state, said resin covering said gel and surrounding and contacting said projecting element, said projecting element projecting up through said resin; and

heating said resin to a temperature sufficient to cure said resin while maintaining said gel in said expanded state.

7. The method according to claim 6, wherein said projecting element is bonded to said semiconductor device with a bonding agent flowable at a flow temperature, and said heating steps are carried out at temperatures less than said flow temperature.

8. The method according to claim 6, wherein said gel has a higher coefficient of thermal expansion than said resin.