Method and apparatus for batch solder bumping of chip carriers

• US 4,558,812 A
• Filed: 11/07/1984
• Issued: 12/17/1985
• Est. Priority Date: 11/07/1984
• Status: Expired due to Term

• Current Assignee: AT&T Teleholdings Incorporated (AT&T, Inc.)
• Original Assignee: AT&T Teleholdings Incorporated (AT&T, Inc.)
• Inventors: Bailey, Alred S., Fisher, John R. Jr.
• Primary Examiner(s): Lin, Kuang Y.
• Application Number:
  US06/668,973
• Time in Patent Office: 405 Days
• Field of Search: 228/180.1, 228/180.2, 228/123, 228/6.2, 228/47, 228/49.1, 228/212, 228/221, 228/178, 228/179
• US Class Current: 228/180.1
• CPC Class Codes: B23K 3/06 Solder feeding devices; Solder melting pans
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: H01L 21/67011 Apparatus for manufacture or treatment processes H01L21/30, H01L21/46; for production or after-treatment of single crystals or homogeneous polycrystalline material C30B35/00
• CPC Class Codes: H01L 21/67138 Apparatus for wiring semiconductor or solid state device
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0338 Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component affixing a prefabricated conductor pattern H05K3/20
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 3/3478 Applying solder preforms; Transferring prefabricated solder patterns

Abstract

Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39).

Claims

1. A method of forming solder bumps on contact pads of chip carriers, the method comprising the steps of:

dispensing a plurality of chip carriers into an array of cavities of a planar holder;

applying a vacuum to hold said carriers in said cavities;

positioning the holder, with the chip carriers held therein, proximate to a plate having a plurality of arrays of dimples therein, each dimple containing a solder preform;

releasing the vacuum to place the pads in contact with the solder preforms; and

heating the preforms to form a solder bump on each pad.

2. The method as set forth in claim 1 which comprises the additional step of:

interposing a locating template, having a plurality of tapered openings therein between the holder and the plate, to guide the chip carriers from the holder onto the arrays of solder preform filled dimples.

3. The method as set forth in claim 2, comprising the further steps of:

inverting the dimple plate with the locating plate thereon;

placing the locating template on a substantially planar surface;

dislodging the chip carriers from the dimple plate into the openings of the locating template;

sliding the locating template towards an edge of the planar surface where a plurality of hollow sticks is located; and

continued sliding of the locating template to cause the chip carriers to fall, from the openings therein, into the hollow sticks.

4. The method as set forth in claim 1, wherein:

the planar holder is rotatably connected to the plate.

5. The method as set forth in claim 1, wherein:

dispensing is accomplished by sliding chip carriers along inclined channels which move across the surface of the planar holder to place a chip carrier on the surface of the plate; and

pushing the chip carrier into a cavity.

6. A soldering apparatus for forming solder bumps on contact pads of chip carriers, comprising:

a plate having a plurality of arrays of dimples, each sized to receive a solder preform therein;

a planar holder having an array of cavities therein and rotatably connected to the plate;

means for dispensing a plurality of chip carriers in the cavities;

a vacuum means for holding the chip carriers in the cavities; and

means for releasing the vacuum to place the pads in contact with the solder preforms prior to heating the preforms to form a solder bump on each pad.

7. The apparatus set forth in claim 6, further comprising:

a locating plate, having a plurality of tapered openings, positioned between the holder and the plate to guide chip carriers from the holder onto the arrays of solder preform filled dimples.

8. The apparatus as set forth in claim 6, wherein the dispensing means is comprised of:

a body portion, having at least one inclined channel along which at least one chip carrier can slide, movable along the surface of the planar holder; and

a push bar located at an end of each channel to push a chip carrier, dispensed from the channel, along the the surface of the holder and into a cavity.