Semiconductor package with internal heat exchanger

• US 4,559,580 A
• Filed: 11/04/1983
• Issued: 12/17/1985
• Est. Priority Date: 11/04/1983
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Sundstrand Corporation (Rtx Corporation)
• Inventors: Lutfy, Gary J.
• Primary Examiner(s): Moose, Jr., Harry E.
• Assistant Examiner(s): Thompson, Gregory D.
• Application Number:
  US06/549,208
• Time in Patent Office: 774 Days
• Field of Search: 165/80 B, 165/80 D, 165/104.33, 174/15 R, 174/15 HP, 357/82, 357/76, 361/381-388, 361/395, 361/415, 62/418
• US Class Current: 361/689
• CPC Class Codes: F28F 2210/02 with particular branching, e.g. fractal conduit arrangements
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/074 Stacked arrangements of non-apertured devices
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

An internally cooled semiconductor package including a wafer-like semiconductor body with at least two electrical elements, one at a relatively flat surface of the body. A wall of high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conductive relation therewith and in electrical contact with the same. A fluid flow heat exchanger is on the other side of the wall in heat exchange relation therewith and along with the wall and other components serves to encapsulate the semiconductor.

Claims

1. A semiconductor package with internal heat exchanger comprising:

a wafer-like semiconductor body having at least two electrical elements;

one at a relatively flat surface of said body;

a wall of high electrical and heat conductive material, said wall having one side in substantial abutment with said flat surface of said body to be in heat conductive relation therewith and in electrical contact with said one of said elements;

a fluid flow heat exchanger on the other side of said wall in heat exchange relation therewith; and

means including said wall and encapsulating said body,

there being two said walls in spaced relation, each forming a fluid boundry of said heat exchanger, and there being two said bodies, each in substantial abutment with a respective wall, and a pair of electrically conductive means sandwiching each said body against the respective wall and forming part of said encapsulating means;

said heat exchanger being comprised of a series of plates sandwiched by said walls, said series including a central distribution plate and alternating apertured and baffle plates on each side thereof.

2. The semiconductor package of claim 1 wherein said encapsulating means further comprise a pair of electrically insulating rings, each surrounding the periphery of an associated one of said bodies and interposed between the associated electrically conductive means and walls to define encapsulating spaces for said bodies.

3. The semiconductor package of claim 1 wherein the apertures in each said apertured plates are staggered with respect to the apertures in the adjacent apertured plates.

4. The semiconductor package of claim 1 wherein each of said plates include aligned solid portions separating flow paths therethrough and said portions are in abutment with each other, and said plates are of a thermally conductive material to facilitate heat transfer from said walls to the interior of said heat exchanger.