Electrical assembly

• US 4,563,725 A
• Filed: 12/28/1983
• Issued: 01/07/1986
• Est. Priority Date: 01/06/1983
• Status: Expired due to Fees

• Current Assignee: Northumbria Circuits Limited
• Original Assignee: Welwyn Electronics Ltd. (TT Electronics PLC)
• Inventors: Kirby, Peter L.
• Primary Examiner(s): Kucia, R. R.
• Application Number:
  US06/566,459
• Time in Patent Office: 741 Days
• Field of Search: 361/398, 361/386, 361/387, 361/388, 361/389, 361/412, 361/414, 174/52 FP
• US Class Current: 361/708
• CPC Class Codes: H01L 2023/4043 heatsink to have chip
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10393 Clamping a component by an element or a set of elements
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate with electrical conductors for connecting to terminals on rigid slab-like heat-dissipating components such as circuit or component packages or carriers. A separate rigid metallic heat-sinking or spreading plate is applied, having protruding thermally conducting pillars passing through holes in the circuit board laminate to contact the components. A further rigid plate overlies the components and is clamped by clips or bolts to the plate. Compliant means such as springs of deformable and elastic rubber or plastics material is provided intermediate the further plate and the top of the components to accommodate difference in height or thickness between the components while transmitting pressure from the further plate to the top of the component to ensure contact between the components and the pillars on the heat sinking or spreading plate.

Claims

1. An electrical assembly comprising:

a multiplicity of chip carriers each containing a chip embodying a semiconductor integrated circuit, said chip being supported in a body of rigid material having a generally planar face with the chip being connected to an array of terminals on said planar face;

a circuit board of flexible material capable of undergoing movement in and out of and within the plane thereof and provided with electrical conductors on a face thereof;

soldered joints between the terminals and the electrical conductors mounting said chip carriers against one face of the circuit board without insertion of the terminals into the board and with the flexibility of said circuit board minimizing strain in said interconnections and consequential risk of said chip carriers becoming detached;

regions of said circuit board underlying said chip carriers defining holes through said circuit board;

a plate of thermally conductive material against the other face of the circuit board, said plate having heat sink pillars that project through said holes into direct contact with the undersides of said chip carriers while remaining detached from said chip carriers; and

means urging said chip carriers into thermally effective contact with said heat sink pillars, flexure and planar extension or compression of the circuit board permitting said direct contact to take place and the detachment of said chip carriers from said heat sink pillars permitting strain-releasing lateral movement of said chip carriers relative to said pillars.

2. An assembly according to claim 1 in which the means to maintain the heat sink pillars in thermally effective contact with the chip carriers comprises at least one further plate applied on top of the chip carriers and clamp means secures said further plate to said plate of thermally conductive material.

3. An assembly according to claim 2 in which the said pillars are formed integrally with the said plate of thermally conductive material.

4. An assembly according to claim 1, in which the said plate of thermally conductive material and pillars comprise a material selected from the group consisting of aluminum, copper, phosphor bronze, beryllium copper, and alloys thereof.

5. An assembly according to claim 4 in which each said further plate comprises a material selected from the group consisting of substantially rigid plastics materials, metals and metal alloys.

6. An assembly according to claim 2 in which there is provided compliant means intermediate the said further plate and the top of said chip carriers, said compliant means being adapted to accommodate any difference in height or thickness between said chip carriers while transmitting pressure of said clamp means from said further plate to said chip carriers to ensure maintenance of contact by said heat sink pillars with the said chip carriers, said pressure resulting from application of said clamp means.

7. An assembly according to claim 6 in which said compliant means comprises a material selected from the group consisting of deformable and elastic rubber and plastics materials.

8. An assembly according to claim 7, in which said rubber or plastics material comprises silicone rubber.

9. An assembly according to claim 7 in which said material is provided in the form of a pad overlying each chip carrier.

10. An assembly according to claim 7 in which said material is provided by introducing a suitably fluid composition between said further plate and said chip carriers, said composition being subsequently caused to set.

11. An assembly according to claim 6, in which said compliant means comprises a suitably elastic membrane overlying the chip carriers and co-operating with said further plate, means in said further plate defining apertures therein in regions overlying the chip carriers, said apertures being of larger area than the chip carriers, said membrane serving to apply pressure to said chip carriers, said chip carriers with said overlying membrane being accommodated in part in said further plate.

12. An assembly according to claim 6, in which said compliant means comprises coil springs provided between the further plate and the top of at least some of said chip carriers.

13. An assembly according to claim 12, in which said coil springs are provided in recesses in the further plate.

14. An assembly according to claim 12 in which said coil springs are of conical form.

15. An assembly according to claim 6, in which said compliant means comprises leaf springs provided between the further plate and the top of at least some of the chip carriers, said leaf springs being formed out of a sheet of suitable resilient material which is located in contact with the further plate.

16. An assembly according to claim 6, in which said compliant means comprises leaf springs formed integrally with the further plate, said further plate being formed from an inherently resilient material.

17. An assembly according to claim 16, in which said inherently resilient material is selected from the group consisting of a plastics material, beryllium copper and phosphor bronze.

18. An assembly according to claim 2 in which said clamp means comprises at least one spring clip adapted to be applied around said plate of thermally conductive material and said further plate.

19. An assembly according to claim 2 in which said clamp means comprises at least one threaded fastener extending between said plate of thermally conductive material and each said further plate.

20. An assembly according to claim 1 in which said circuit board is a multilayer printed circuit board comprising a planar electrically insulating flexible laminate, electrical conductor elements being arranged at at least one plane within the laminate to provide electrical connections for the chip carriers.

21. An assembly according to claim 20, in which said laminate has a thickness of not more than 0.75 millimeters.

22. An assembly according to claim 20 in which said laminate has a thickness of not more than 0.5 millimeters.

23. An assembly according to claim 20 in which said flexible laminate comprises a polyimide or polyester material.

24. An assembly according to claim 1 arranged in stacked relationship with at least one like assembly.

25. An assembly according to claim 1, in which a film of additional material of a resinous organic nature is provided intermediate said plate of thermally conductive material and said other face of said circuit board.

26. An assembly according to claim 25, in which said film of additional material has adhesive properties.