Registration and assembly of integrated circuit packages

• US 4,565,314 A
• Filed: 09/09/1983
• Issued: 01/21/1986
• Est. Priority Date: 09/09/1983
• Status: Expired due to Term

• Current Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Original Assignee: AT&T, Inc.
• Inventors: Scholz, Harry R.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/530,743
• Time in Patent Office: 865 Days
• Field of Search: 357/80, 357/85, 228/180 A, 29/834, 361/400
• US Class Current: 228/180.21
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81141 Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2201/10234 Metallic balls
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 2203/167 : Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49133 : with component orienting

Abstract

The so-called blind assembly operation involving precise registration between the blind side of chip carriers or similar macro scale subassemblies and a metallized (patterned) support member requires improvements to reduce packaging costs. The proposal is to form indents aligned in both mating surfaces and place an aligning ball in the lower indent. The upper surface is positioned approximately and manipulated in x and y directions until the alignment ball recesses into both indents.

Claims

1. Method for aligning planar structures face-to-face comprising:

placing a first planar structure face down over a second face-up planar structure so the structures are situated face-to-face and moving one or both structures in one or more directions lying in the plane of the face until a desired alignment between the respective faces is achieved the invention comprising forming an indented region in the face of the first planar structure, forming an indented region in the face of the second planar structure, disposing an aligning ball in one of the indented regions, moving one or both structures until the aligning ball is recessed in both aforementioned indented regions, the invention characterized in that;

a. the alignment ball has a diameter chosen so that when the aligning ball is recessed in both indented regions a separation exists between the planar surfaces,

b. the alignment ball is formed of solder and the solder is melted to bring the separated surfaces together, and

c. at least one of the indented regions is composed of a material that is not wetted by the molten material of the aligning ball.

2. The method of claim 1 in which the material of said indented region is ceramic.