Method and apparatus for testing of electrical interconnection networks

• US 4,565,966 A
• Filed: 03/07/1983
• Issued: 01/21/1986
• Est. Priority Date: 03/07/1983
• Status: Expired due to Term

• Current Assignee: Kollmorgen Corporation (Regal Rexnord Corp.)
• Original Assignee: Kollmorgen Technologies Corporation
• Inventors: Morino, Ronald, Keogh, Raymond J., Burr, James B., Crowell, Jonathan C., Burr, Robert P., Christophersen, James C.
• Primary Examiner(s): Krawczewicz, Stanley T.
• Assistant Examiner(s): Harvey, Jack B.
• Application Number:
  US06/473,590
• Time in Patent Office: 1,051 Days
• Field of Search: 324/158 P, 324/158 F, 324/73 R, 324/73 PC, 324/73 AT, 324/51, 324/52, 364/482
• US Class Current: 324/519
• CPC Class Codes: G01R 31/088 Aspects of digital computing
• CPC Class Codes: G01R 31/2805 Bare printed circuit boards
• CPC Class Codes: G01R 31/312 by capacitive methods

Abstract

A method and apparatus for testing circuit boards using two or a small number of probes for making resistive and radio frequency impedance measurements e.g. capacitive measurements. The combination of resistive and impedance measurements substantially reduces the number of tests required to verify the integrity of a circuit board. The impedance or capacitive "norm" values used in testing the circuit boards can be obtained by operating the system in a learning mode. Analysis of the data provides not only fault detection but also can indicate approximate fault location.

Claims

1. A method for testing rigid or flexible electrical interconnection network boards including at least two networks including terminal points and interconnecting conductors, said method comprising the steps of:

establishing an electrically conductive reference means in a predetermined electrical and geometrical position with respect to the surface containing the interconnecting conductors of the networks, and separated therefrom by a dielectric;

making measurements from terminal points of the interconnection board being tested including

at least one impedance measurement from a terminal point of each network to said reference means, and

at least a measurement of the end-to-end resistance of each network;

with either the impedance or the resistance measurement(s) being made first;

comparing said measured impedance and resistance values with the respective pre-established values for an interconnection board with no electrical faults;

and indicating faults when either

(a) said impedance measurement value is above said respective established value by more than a predetermined amount;

(b) said impedance measurement value is below said respective established value by more than a predetermined amount; and

/or

(c) said resistance measurement value departs from said respective predetermined value.

2. The method of claim 1, wherein the conductive reference means is a conductive reference plane substantially parallel to the plane of the interconnecting conductors of said networks.

3. The method of claim 1 or 2 including testing each segment of each network for its resistance value and each network for its impedance value.

4. The method of claims 1 or 2 including measuring the capacitive value of each network from each of its terminal points and the resistance value between the end terminal points of said network.

5. The method of claim 1 or 2 including measuring the impedance value for each network from one terminal point, and the resistance value from each terminal point to the end point of said network.

6. The method according to claim 1 wherein said pre-established impedance values of a board free of defects are determined by a learning sequence wherein said established value is the means of measured values on a plurality of interconnection boards of the respective kind which are within one standard deviation of each other.

7. The method of claim 6 wherein said established values of impedance are obtained by:

obtaining a data set of impedance values for a terminal point on a sample lot of interconnection boards; and

calculating the mean value and standard deviation for the initial data set for the terminal point; and

discarding the values lying outside the standard deviation range; and

then calculating said pre-established value as equal to the mean value of the remaining measurements.

8. The method in accordance with claim 1 said impedance measurement is a capacitance measurement.

9. Apparatus for testing rigid or flexible electrical interconnection network boards including at least two networks and a plurality of terminal points interconnected by electrical conductors to form a predetermined pattern, comprising

at least two independently movable probes for contacting selective terminal points of the said interconnection board being tested;

positioning means associated with at least one of said probes for positioning the same to contact selected terminal points on the interconnection board;

conductive reference means spaced from said conductor network of the interconnection board by a dielectric;

impedance measuring means connected to at least one of said probes to measure impedance between the probe connected thereto and said reference means;

resistance measuring means connected to said probes to measure electrical resistance between said probes; and

control means for moving said probes and for activating said measuring means to obtain;

(a) at least one impedance measurement from a terminal point of each network to said reference means; and

(b) at least a measurement of the end-to-end resistance of each network.

10. The apparatus of claim 9 wherein said electrically conductive reference means is a conductive plane arranged substantially parallel to the plane of the interconnecting conductors of the networks of the said interconnection board.

11. The apparatus of claim 9 or 10 wherein said conductive reference means is a means separate from the interconnection board to be tested.

12. The apparatus of claim 9 or 10 wherein said conductive reference means is an interior conductive means located within the interconnection board being tested.

13. The apparatus in accordance with claim 10 wherein said control means for moving said probes and for activating said measuring means is operable to obtain at least one impedance measurement for each terminal point of the interconnection board being tested.

14. The apparatus in accordance with claim 10 wherein said control means for moving said measuring probes is operable to obtain at least one resistance measurement from each terminal point of the interconnection board being tested.

15. The apparatus in accordance with claim 10 wherein the impedance measuring means are capacitance measuring means.

16. A method of testing interconnection boards including at least two networks including terminal points and interconnecting conductors comprising the steps of:

establishing a conductive reference means in a predetermined electrical and geometrical position with respect to the surface containing the interconnecting conductors of the networks, and separated therefrom by a dielectric;

making at least one impedance measurement from a terminal point of each network and to said reference means for a plurality of interconnection boards in a sample lot;

determining the mean impedance value for each measured terminal point;

discarding measured impedance values which deviate from said average impedance values by more than a predetermined amount and determining the average impedance values for the remaining measurements to derive a respective reference value;

similarly measuring impedance values for other like interconnection boards and

rejecting as circuit faults any measurements higher than said reference value by more than a predetermined amount, and

rejecting as circuit faults any measurements lower than said respective reference value by more than a predetermined amount.

17. The method according to claim 16 wherein measured impedance values are discarded which deviate by more than one standard deviation from said mean values.

18. The method according to claims 16 or 17 wherein the said impedance value is a capacitance value and measured between each terminal point and said reference means.

19. The method according to claim 18 wherein at least one capacitive measurement is made from a terminal point of each network of the interconnection board being tested.

20. The method according to claim 16 wherein said conductive reference means is an internal conductive layer of the interconnection board being tested.

21. The method according to claim 16 wherein said conductive reference means is a conductive plane exterior to the interconnection board being tested.

22. A method for testing interconnection boards including terminal points and interconnecting conductor networks and for indicating locations of faults therein comprising the steps of:

establishing a conductive reference plane

parallel to the plane of the terminal points and interconnecting conductor networks, and

separated therefrom by a dielectric;

measuring the capacitance between a particular terminal point and said reference plane;

comparing said measured capacitance value with the known correct value for an interconnection board with no faults present;

indicating an open circuit fault if said measured capacitance value is less than said known correct value by a predetermined amount; and

determining the fault location for any such open circuit fault relative to said measuring point in accordance with the magnitude of deviation from said known correct value.

23. The method according to claim 22 wherein said known correct value is determined by

making similar measurements on a sample plurality of like interconnection boards,

determining the mean and standard deviation of said measurements,

discarding measured values more than one standard deviation from said mean and determining the average value of the remaining measurements as said known correct value.

24. The method according to claim 22 further including at least one capacitive measurement from a terminal point of each network of the interconnection board being tested.

25. The method according to claim 24 further including a capacitive measurement at each terminal point of the interconnection board being tested.

26. The method according to claim 22 wherein said conductive reference plane is an interior conductive layer of the interconnection board being tested.

27. The method according to claim 22 where said conductive reference plane is a conductive plate outside the interconnection board being tested.

28. A method for testing interconnection boards including terminal points and interconnecting conductor networks comprising the steps of:

establishing a conductive reference plane

parallel to the plane of the terminal points and interconnecting conductor networks and

separated thereform by a dielectric;

measuring the capacitance between at least one terminal point of each network and said reference plane;

comparing said measured capacitance value with the known correct value for interconnection boards with no faults therein;

indicating as a short circuit fault for any measured capacitance which is higher than the respective known correct value by more than a predetermined amount; and

indicating as shorted together any networks showing similar high values.

29. The method according to claim 28 wherein said known correct value is determined by

making similar measurements on a sample plurality of like interconnection boards,

determining the mean and standard deviation of said measurements,

discarding measured values more than one standard deviation from said mean and determining the average value of the remaining measurements as said known correct value.

30. The method according to claim 28 further including at least one capacitive measurement from a terminal point of each network of the interconnection board being tested.

31. The method according to claim 30 further including a capacitive measurement at each terminal point of the interconnection board being tested.

32. The method according to claim 28 wherein said conductive reference plane is an interior conductive layer of the interconnection board being tested.

33. The method according to claim 28 where said conductive reference plane is a conductive plate outside the interconnection board being tested.