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Semiconductor wafer transfer apparatus and method

  • US 4,573,851 A
  • Filed: 05/18/1983
  • Issued: 03/04/1986
  • Est. Priority Date: 05/18/1983
  • Status: Expired due to Fees
First Claim
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1. A wafer transfer system for transferring semiconductor wafers between first and second wafer carriers, said system comprising in combination:

  • (a) carrier support means for receiving and supporting either of said first and second wafer carriers;

    (b) elevator means for engaging lower edge portions of wafers in the one of said first and second wafer carriers then on said carrier support means and raising the wafers into a wafer holding region located above said one of said wafer carriers, and for engaging lower edge portions of wafers in said wafer holding region and lowering them into respective sets of grooves in the one of said first and second wafer carriers then on said carrier support means;

    (c) first and second spaced groups of wafer supporting grooves in said elevator means, each wafer supporting groove of said first group being aligned with a corresponding wafer supporting groove of said second group to cooperate therewith in engaging lower edge portions of a wafer to support that wafer, wherein a first wafer supporting groove of said first group includes a first flat, vertical surface for engaging a first peripheral portion of a first face of a first wafer and a first steeply inclined surface opposed to said first flat vertical surface for supporting an edge point of said first wafer and exerting a horizontal force, due to the weight of said first wafer, that urges said first peripheral portion of said first wafer tightly against said first flat, vertical surface, and wherein a first wafer supporting groove of said second group includes a second flat, vertical surface for engaging a second peripheral portion of an opposite second face of said first wafer and a second steeply inclined surface opposed to said second flat, vertical surface for supporting another edge point of said first wafer and exerting a horizontal force, due to the weight of said first wafer, that urges said second peripheral portion of said first wafer tightly against said second flat, vertical surface, whereby said first wafer is held firmly in a precisely vertical position by said first wafer supporting grooves of said first and second groups, respectively, during upward and downward movement of said elevator means;

    (d) first retaining means, movable into said wafer holding region while a first group of wafers is being held therein and having a plurality of grooves, for retaining said wafers of said first group in said wafer holding region after said elevator means is lowered, and retractable from said wafer holding region to allow said wafers of said first group to be lowered from said wafer holding region by said elevator means, wherein said plurality of grooves of said first retaining means engage lower edges of respective wafers of said first group spaced from and adjacent to said edge portion engaged by said wafer supporting grooves; and

    (e) second retaining means, disposed on an opposite side of said wafer holding region from said first retaining means, and having a plurality of grooves that are aligned with said plurality of grooves of said first retaining means, respective, edges of said wafers of said first group coming to rest in respective ones of said plurality of grooves of said second retaining means as said elevator means is lowered.

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