Semiconductor wafer transfer apparatus and method

• US 4,573,851 A
• Filed: 05/18/1983
• Issued: 03/04/1986
• Est. Priority Date: 05/18/1983
• Status: Expired due to Fees

• Current Assignee: Microglass Incorporated
• Original Assignee: Microglass Incorporated
• Inventors: Butler, Robert M.
• Primary Examiner(s): Valenza, Joseph E.
• Assistant Examiner(s): Bucci, David A.
• Application Number:
  US06/495,642
• Time in Patent Office: 1,021 Days
• Field of Search: 414/404, 414/417, 414/786, 414/754, 414/287, 211/41, 211/126, 118/500, 118/728, 206/448, 206/454, 156/613, 432/258, 432/259, 269/296, 269/903, 198/649
• US Class Current: 414/404
• CPC Class Codes: H01L 21/67313 Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
• CPC Class Codes: H01L 21/67326 Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers
• CPC Class Codes: Y10S 206/832 Semiconductor wafer boat
• CPC Class Codes: Y10S 414/138 Wafers positioned vertically within cassette

Abstract

An apparatus for transferring wafers between carriers with different wafer spacings and different wafer capacities includes an elevator with two sets of wafer supporting grooves that extend through a carrier to lift wafers from it to a temporary holding region whereat the first and second groups of wafers can be selectively retained by means of first and second movable retainers and first and second retainer blocks. Each wafer supporting groove includes a steeply inclined surface that contacts one point of an edge of a wafer, urging a peripheral portion of the opposite face against a flat opposite vertical wall of the groove. The steeply inclined surface of another wafer supporting groove contacting the same wafer urges a peripheral portion of the opposite wafer face against a flat vertical wall of the second groove. The first and second retainers each contain V-grooves that are aligned with V-grooves of a corresponding one of the retainer blocks to support alternate wafers in the holding region. The retainers and retainer blocks are laterally shiftable to align the V-grooves of either the first retainer or the second retainer with the odd numbered wafer support grooves.

Claims

1. A wafer transfer system for transferring semiconductor wafers between first and second wafer carriers, said system comprising in combination:

(a) carrier support means for receiving and supporting either of said first and second wafer carriers;

(b) elevator means for engaging lower edge portions of wafers in the one of said first and second wafer carriers then on said carrier support means and raising the wafers into a wafer holding region located above said one of said wafer carriers, and for engaging lower edge portions of wafers in said wafer holding region and lowering them into respective sets of grooves in the one of said first and second wafer carriers then on said carrier support means;

(c) first and second spaced groups of wafer supporting grooves in said elevator means, each wafer supporting groove of said first group being aligned with a corresponding wafer supporting groove of said second group to cooperate therewith in engaging lower edge portions of a wafer to support that wafer, wherein a first wafer supporting groove of said first group includes a first flat, vertical surface for engaging a first peripheral portion of a first face of a first wafer and a first steeply inclined surface opposed to said first flat vertical surface for supporting an edge point of said first wafer and exerting a horizontal force, due to the weight of said first wafer, that urges said first peripheral portion of said first wafer tightly against said first flat, vertical surface, and wherein a first wafer supporting groove of said second group includes a second flat, vertical surface for engaging a second peripheral portion of an opposite second face of said first wafer and a second steeply inclined surface opposed to said second flat, vertical surface for supporting another edge point of said first wafer and exerting a horizontal force, due to the weight of said first wafer, that urges said second peripheral portion of said first wafer tightly against said second flat, vertical surface, whereby said first wafer is held firmly in a precisely vertical position by said first wafer supporting grooves of said first and second groups, respectively, during upward and downward movement of said elevator means;

(d) first retaining means, movable into said wafer holding region while a first group of wafers is being held therein and having a plurality of grooves, for retaining said wafers of said first group in said wafer holding region after said elevator means is lowered, and retractable from said wafer holding region to allow said wafers of said first group to be lowered from said wafer holding region by said elevator means, wherein said plurality of grooves of said first retaining means engage lower edges of respective wafers of said first group spaced from and adjacent to said edge portion engaged by said wafer supporting grooves; and

(e) second retaining means, disposed on an opposite side of said wafer holding region from said first retaining means, and having a plurality of grooves that are aligned with said plurality of grooves of said first retaining means, respective, edges of said wafers of said first group coming to rest in respective ones of said plurality of grooves of said second retaining means as said elevator means is lowered.

2. The wafer transport system of claim 1 wherein said elevator means engages only the lower edge portions of said wafers, and wherein said first retaining means includes a plurality of slots located between successive ones of said grooves of said first retaining means to allow a second group of wafers to be raised by said elevator means into said wafer holding region while said first group of wafers is retained therein by said first retaining means.

3. The wafer transport system of claim 2 further including third retaining means, movable into said wafer holding region from a side thereof opposite to said first retaining means while said second group of wafers is being held therein and having a plurality of grooves and a plurality of slots located between successive ones of those grooves, for retaining said wafers of said second group in said wafer holding region after said elevator means is lowered, said third retaining means being retractable from said wafer holding region to allow said wafers of said second group to be lowered from said wafer holding region by said elevator means, said slots of said third retaining means allowing said first plurality of wafers to be raised into or lowered out of said wafer holding region while said second group of wafers is being retained in said wafer holding region by said second retaining means.

4. The wafer transfer system of claim 3 including fourth retaining means, disposed on an opposite side of said wafer holding region from said third retaining means and having a plurality of grooves that are respectively aligned with said plurality of grooves of said third retaining means, said wafers of said second group rolling about the respective grooves of said third retaining means until their side edges come to rest respective corresponding grooves of said fourth retaining means.

5. The wafer transfer system of claim 4 wherein the center-to-center spacing between said wafer supporting grooves of said first and second groups of grooves in said elevator means half the center-to-center spacing of said grooves of said first, second, third and fourth retaining means, and wherein said grooves of said first and second retaining means initially are respectively aligned with successive odd-numbered ones of said wafer supporting grooves of said first and second groups, and wherein said grooves of said third and fourth retaining means initially are aligned with successive even-numbered ones said wafer supporting grooves of said first and second groups.

6. The wafer transfer system of claim 5 including shifting means for shifting said first, second, third, and fourth retaining means to selectively align said odd numbered wafer supporting grooves of said first and second groups with said grooves of said first and second retaining means or said grooves of said third and fourth retaining means, whereby said first group of wafers can be raised into said wafer holding region by means of one set of alternate ones of said wafer supporting grooves and retained therein by means of said first and second retaining means and, after said shifting of said second group of wafers, can be raised into said wafer holding region by means of said one set of wafer supporting grooves and retained there, with said first group of wafers, by means of said third and fourth retaining means.

7. The wafer transfer apparatus of claim 6 wherein said grooves of said first, second, third, and fourth retaining means are substantially V-shaped.

8. The wafer transfer apparatus of claim 6 wherein said first retaining means is located below said fourth retaining means and said third retaining means is located below said second retaining means.

9. The wafer transfer apparatus of claim 7 wherein said first carrier is a 25 wafer plastic carrier with a center-to-center wafer groove spacing of 3/16 of an inch and said second carrier is a 50 wafer quartz diffusion boat with a center-to-center wafer groove spacing of 3/32 of an inch.

10. A method of transferring semiconductor wafers from a first carrier to a second carrier, said method comprising the steps of:

(a) lifting a first group of semiconductor wafers out of said first carrier and into a wafer holding region by means of an elevator that is extendable upward through an open center region of said first carrier, and simultaneously supporting said wafers of said first group in precise spaced parallel relationship to each other by engaging a lower edge of a first face of each of said wafers with a respective steeply inclined surface so that the weight of each wafer causes a lower peripheral flat portion of an opposite second face of that wafer to be forced against a respective opposed rigid flat vertical groove wall to prevent each of said wafers from tilting away from the respective inclined surfaces and by also simultaneously engaging a lower edge of the second face of each of said wafers with a respective steeply inclined surface so that the weight of each wafer causes a lower peripheral flat portion of the first face of that wafer to be forced against a respective rigid flat vertical groove wall to prevent each of said wafers from tilting;

(b) inserting a first retainer into said wafer holding region to engage edges of the wafers of said first group to retain said wafers of said first group in said wafer holding region when said elevator is lowered;

(c) lowering said elevator from said wafer holding region and through said open center region of said first carrier;

(d) removing said first carrier from a position over a region into which said elevator is lowered;

(e) placing said second carrier over said region into which said elevator is lowered;

(f) raising said elevator up through an open center region of said second carrier into said wafer holding region to lift said wafers of said first group;

(g) withdrawing said first retainer from said wafer holding region; and

(h) lowering said elevator from said wafer holding region and through said open center region of said carrier to deposit said first group of wafers in said second carrier.

11. The method of claim 10 including, after step (d), placing a third carrier with a second group of wafers therein over said elevator, lifting said second group of semiconductor wafers out of said third carrier into said wafer holding region by means of said elevator, and extending a second retainer into said wafer holding region to engage edges of the wafers of said second group to retain said wafers of said second group in said wafer holding region when said elevator is lowered.

12. The method of claim 11 wherein said first retainer has a plurality of deep slots which allow passage therethrough of wafers of said second group and said second retainer has a plurality of deep slots which allow passage therethrough of wafers of said first group.

13. The method of claim 10 including the step of shifting the position of said wafers of said first group in said wafer holding region by a distance equal to half of the center-to-center spacing of the wafers of said first group for lifting said second group of wafers into said wafer holding region so that wafers of said second group are alternately spaced with wafers of said first group in said wafer holding region.

14. The method of claim 10 wherein step (a) includes simultaneously lifting a second group of wafers out of said first carrier into said wafer holding region and wherein step (b) includes extending a second retainer into said wafer holding region to engage the edges of the wafers of said second group to retain said wafers of said second group in said wafer holding region when said elevator is lowered, wherein said wafers of said first group are positioned in said wafer holding region alternately with wafers of said second group, said method including, after step (h), removing said second carrier from the position over said region into which said elevator is lowered and placing a third carrier over said region into which said elevator is lowered, raising said elevator up through an open center region of said third carrier into said wafer holding region to engage said wafers of said second group, withdrawing said second retainer from said wafer holding region, and lowering said elevator from said wafer holding region and through said open center region of said third carrier to deposit said second group of wafers in said third carrier.

15. The method of claim 14 including shifting said group of wafers in said wafer holding region through a distance equal to the center to center spacing between wafers of said first and second groups when said wafers of said first and second group are all in said wafer holding region before raising said elevator to engage said wafers of said second group subsequently to step (h).