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Placement of components on circuit substrates

  • US 4,577,276 A
  • Filed: 09/12/1983
  • Issued: 03/18/1986
  • Est. Priority Date: 09/12/1983
  • Status: Expired due to Term
First Claim
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1. An integrated circuit fabricated in accordance with a design procedure comprising the steps of(a) determining a plurality of modules of integrated circuit components from which said integrated circuit can be fabricated,(b) successively partitioning said plurality of modules into successively smaller subsets of modules maximally connected within subsets and minimally connected between subsets in accordance with a known partitioning algorithm,(c) successively dividing the area of a substrate into subareas proportional to the areas of the polycells in said subsets,(d) placing said modules on said substrate in accordance with the subarea location to which said modules are assigned, and(e) propagating connections to terminal external to each of said subareas to the periphery of the respective subareas prior to said partitioning step.

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