Induction heated reactor system for chemical vapor deposition

• US 4,579,080 A
• Filed: 02/06/1985
• Issued: 04/01/1986
• Est. Priority Date: 12/09/1983
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Graham, Robert, Martin, John G., Benzing, Walter C.
• Primary Examiner(s): Lusignan, Michael R.
• Application Number:
  US06/698,580
• Time in Patent Office: 419 Days
• Field of Search: 118/500, 118/724, 118/725, 118/729, 118/730, 219/10.67, 219/10.99 R, 219/10.49 R, 219/10.75
• US Class Current: 118/500
• CPC Class Codes: C23C 16/4411 Cooling of the reaction chamber walls C23C16/45572 takes precedence
• CPC Class Codes: C23C 16/4588 the substrate being rotated
• CPC Class Codes: C23C 16/46 characterised by the method used for heating the substrate C23C16/48, C23C16/50 take precedence
• CPC Class Codes: C30B 25/08 Reaction chambers; Selection of materials therefor
• CPC Class Codes: C30B 25/10 Heating of the reaction chamber or the substrate
• CPC Class Codes: C30B 25/12 Substrate holders or susceptors

Abstract

A chemical vapor deposition system which includes a generally closed reaction chamber having walls formed from a dielectric material. A susceptor for carrying a plurality of semiconductor wafers is positioned within the chamber. An induction coil is positioned in the vicinity of the susceptor for carrying an alternating electric current to produce induction heating of the susceptor and thereby heating the back side of the wafers thereon. Low frequency induction heating and variations in susceptor thickness are used to produce uniformity of temperature. Boundary control arrangement between the susceptor surface and wafer surfaces are used to improve deposition uniformity. A coating is formed on wall portions of the reaction chamber facing the susceptor and wafers carried thereon for reflecting heat energy radiated from the susceptor and the wafers positioned thereon back to the susceptor and the wafers to reduce substantially the heat loss therefrom and thereby to reduce substantially the thermal gradient from front to back surfaces of the wafers.

Claims

1. In a chemical vapor deposition system, in combination:

a generally closed reaction chamber having walls formed from a dielectric material;

3. The system of claim 1, wherein said susceptor has predefined wafer positions thereon, and said regions of substantially reduced thickness of said susceptor are positioned at locations which produce a substantially uniform temperature profile across said susceptor at said predefined wafer positions.

5. The system of claim 3, wherein said dielectric material of said reactor chamber walls is substantially transparent to infrared radiation, and said reflector means comprises a heat reflecting coating formed on exterior surfaces of said wall portions of said chamber.

6. The system of claim 3, wherein said reflector means comprises a heat reflecting coating formed on interior surfaces of said wall portions of said chamber.

7. The system of claim 5, wherein said heat reflecting coating comprises a layer of heat reflecting material formed on said interior surfaces and a thin layer of transparent dielectric material formed over said layer of heat reflecting material.

8. The system of claim 3, further comprising a wall cooling system arrangement for said closed reaction chamber comprising a second generally closed chamber surrounding said reaction chamber, the interior wall surface of said second chamber being spaced a moderate distance from the exterior wall surface of said first chamber to form a channel therebetween, and means for pumping a cooling liquid through said channel to cool the walls of said reaction chamber.

9. The system of claim 1, wherein said closed reaction chamber comprises a generally cylindrical chamber disposed with its central axis in a vertical orientation;

and susceptor comprises a hollow generally cylindrical body adapted to be positioned within said cylindrical chamber with its central axis disposed in a vertical orientation;

said induction coil comprising a generally cylindrical coil having an inner diameter greater than the outer diameter of said chamber and being disposed around portions of said chamber confining said susceptor;

said susceptor body having an arrangement of straight side wall segments including a regular array of wafer carrying recesses formed on front surface regions thereof;

said straight side wall segments meeting at corner regions and each of said corner regions including one of said regions of substantially reduced wall thickness;

said reduced wall thickness at said corner regions producing a more uniform horizontal temperature profile across said side wall segments and thereby producing a more uniform temperature profile across semiconductor wafers supported thereon.

10. The system of claim 8, wherein said susceptor body comprises a central wafer carrying wall region and upper and lower wall regions of substantial length which dispose the upper and lower extremities of said central wafer carrying wall region a substantial distance from the top and bottom ends of said susceptor, said upper and lower wall regions having a wall thickness substantially less than said central wall region to produce substantially greater induction heating of said upper and lower wall regions and thereby to provide a more uniform temperature profile from top to bottom of said susceptor.

11. A system of claim 8, wherein said prearranged frequency of an alternating electric current is in the range of about 5 to 15 kilohertz and the maximum thickness of said susceptor is maintained at less than about 0.50 inches.

13. The system of claim 11, wherein said boundary control means include means defining a wall surface region projecting radially outward from said susceptor at a position spaced above a top row of said wafer carrying recesses to equalize the relative deposition of material on wafers in said top row with respect to wafers in lower rows of wafer carrying recesses on said susceptor.

15. The system of claim 13, wherein said top caps further includes a central portion defining a generally bowl shaped recess extending into the interior of said susceptor;

and said gas delivery means includes piping means for delivering reactant gases directly into said bowl shaped recess for preheating and mixing of said reactant gases prior to passing over the overhanging edge portions of said top plate.

16. The system of claim 11, further comprising means for rotating said susceptor in sequential opposite direction cycles during a layer deposition cycle;

and wherein said boundary control means includes means defining contoured wall surface regions overlapping side edges of each of said wafer carrying recesses to contour the displacement between the susceptor surface and the wafer surface at said locations and thereby to produce more uniform deposition of material from side to side on each wafer carried in said wafer carrying recesses.

17. The system of claim 15, wherein said means defining contoured wall surface regions comprises contoured outwardly projecting edge regions integrally formed on said susceptor at said regions.

18. The system of claim 11, wherein said susceptor body comprises a central wafer carrying wall region and upper and lower wall regions of substantial length which dispose upper and lower extremities of said central wafer carrying region a substantial distance from the top and bottom ends of said susceptor, said corner regions of said straight side wall segments of said susceptor and said upper and lower wall regions having a wall thickness substantially less than that of said central wall region;

said alternating current supplied to said induction coil having a prearranged frequency which produces an induction current skin depth at least about equal to the wall thickness of said central wafer carrying wall region, whereby said upper and lower wall regions and said corner regions of reduced wall thickness have substantially greater induction heating, thereby providing a more uniform temperature distribution from top to bottom and side to side of said side wall segments of said central wafer carrying wall region of said susceptor.

19. The system of claim 17, further comprising a heat reflective coating carried on side reaction chamber carried thereon for reflecting heat energy radiated from said susceptor and wafers back to said susceptor and said wafers to reduce substantially the heat loss therefrom and thereby to reduce substantially the thermal gradient from front to back surfaces of said wafers;

the combination of said uniform temperature distribution and said locally tuned boundary conditions providing highly uniform deposition of material on said wafers at deposition temperatures up to at least 1200°

C. while eliminating any substantial slip in the semiconductor wafers.

20. The system of claim 11, wherein said susceptor is carried on a support arrangement comprising a central hub and a plurality of legs extending radially outward from said hub;

each of said legs being oriented normal to an associated side wall segment of said susceptor;

each of said side wall segments having a mounting slot formed at the bottom edge thereof and adapted to mount over one of said legs to position said susceptor on said spider support arrangement with alignment of the respective central axis of said susceptor and said hub, said susceptor being thereby free to expand and contract radially on said spider support arrangement due to thermal cycling during a deposition process while maintaining alignment of said central axes.

21. The system of claim 11, wherein each of said straight side wall segments of said susceptor has a uniform width from to top to bottom, and each of said corner regions comprises a wall segment which tapers inwardly from bottom to top of said susceptor;

each of said side wall segments having an outwardly projecting region adjacent each of said corner regions and overlapping with said wafer carrying recesses to contour the displacement between the susceptor surface and the wafer surface at said locations and thereby to produce more uniform deposition of material from side to side on each of said wafers in said wafer carrying recesses.

22. The system of claim 20, wherein said susceptor body comprises a central wafer carrying wall region and upper and lower wall regions of substantial length which dispose upper and lower extremities of said central wafer carrying region a substantial distance from the top and bottom of said susceptor, said corner regions adjacent said side wall segments and said upper and lower wall regions having a wall thickness substantially less than that of said central wall region;

said alternating current supplied to said induction coil having a prearranged frequency which produces an induction current skin depth at least about equal to the wall thickness of said central wafer carrying wall region, whereby said upper and lower wall regions and said corner regions of reduced wall thickness have substantially greater induction heating, thereby providing a more uniform temperature distribution from top to bottom and side to side across the side wall segments of said central wafer carrying wall region of said susceptor.

2. a susceptor for carrying a plurality of semiconductor wafers, said susceptor being adapted to be positioned within said chamber and being formed from an electrically conductive material adapted to be heated by induction;

an induction coil positioned in the vicinity of said susceptor for carrying an alternating electric current to produce induction heating of said susceptor and thereby heating said wafers thereon;

means supplying said induction coil with alternating electric current at a prearranged frequency to induce heating currents throughout a region of said susceptor having a skin depth directly related to said prearranged frequency;

said susceptor being formed to have a general thickness less than or equal to said skin depth, and having regions of substantially reduced thickness at prearranged locations relative to wafer positions on said susceptor to produce greater induced heating at said prearranged locations and thereby to alter the temperature of said susceptor at said regions.

4. The system of claim 2, further comprising reflector means facing said susceptor and wafers carried thereon for reflecting heat energy radiated from said susceptor and said wafers back to said susceptor and said wafers to reduce substantially the heat loss therefrom and thereby to reduce substantially the thermal gradient front front to back surfaces of said wafers;

the combination of said uniform temperature profile of said susceptor at said predefined wafer positions and said reduced thermal gradient in said wafers providing substantially slip-free heating conditions for said wafers and substantially uniform deposition rates on said wafers during a deposition process carried out in said system.

12. In a chemical vapor deposition system, in combination:

a generally cylindrical reaction chamber having walls formed from a dielectric material and being disposed with its central axis in a vertical orientation;

a susceptor formed from an electrically conductive material adapted to be heated by induction, said susceptor comprising a hollow body having a generally truncated pyramidal configuration and adapted to be positioned within said reaction chamber with its central axis disposed in a vertical orientation, said body having an arrangement of substantially straight side wall segments meeting at corner regions and including an array of wafer carrying recesses formed on front surface regions thereof in multiple rows such that said wafers face the cylindrical side walls of said reaction chamber;

a heating system for heating said susceptor by induction and comprising a coil having a generally cylindrical configuration disposed over said second chamber and having a height greater than the height of said susceptor, and power supply means for supplying an alternating current to said coil for induction heating of said susceptor;

gas delivery means for delivering reactant gases to said reaction chamber in a region above said susceptor and for withdrawing reactant gases from said reaction chamber below said susceptor; and

boundary control means carried on said susceptor at prearranged locations relative to said wafer carrying recesses to locally alter the boundary conditions between said reactant gases and the surfaces of said susceptor and wafers carried thereon and thereby to provide more uniform deposition of material on said wafers.

14. The system of claim 12, wherein said means defining said projecting wall surface region comprises a top cap carried on the top edge of said susceptor and having marginal edge regions overhanging the adjacent front wall surfaces of said susceptor.