×

Heat wave shielding lamination

  • US 4,583,815 A
  • Filed: 06/30/1983
  • Issued: 04/22/1986
  • Est. Priority Date: 07/06/1982
  • Status: Expired due to Fees
First Claim
Patent Images

1. A heat wave shielding lamination comprising a visible light transparent substrate and an overlying lamination comprising two In2 O3 shield layers containing different amounts of Sn, the amount of Sn increasing with increasing proximity to the substrate, whereby the resulting heat wave shielding lamination has good transmittance for visible light and good shielding effect against rays in the infrared spectrum by virtue of the fact that the shield layers containing different amounts of Sn manifest maximum infrared absorption at different wavelengths to give high infrared ray absorptioon over a wide wavelength range.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×