Solid state multiprobe testing apparatus
First Claim
1. A testing socket for electrical testing of devices, each having a substantially planar surface with an array of conductive pads disposed thereon comprising:
- (a) a holder for holding a said device in a fixed position;
(b) a probe for contacting said device pads, said probe including a substantially planar semiconductor substrate with electrically conductive semiconductor projections integral with said substrate and disposed in an array corresponding to a mirror image of said array of pads; and
(c) circuit means connected to said projections for testing of said device when said probe projections contact said pads.
0 Assignments
0 Petitions
Accused Products
Abstract
A high density multiprobe including a multiprobe on a semiconductor substrate with contact pads selectively positioned in relation to the contacts of a device to be tested. Each of the selectively positioned contacts on the multiprobe semiconductor substrate include an elevated conductive surface that makes physical and electrical contact with the contacts of the device to be tested. In addition, the elevated conductive surfaces on the multiprobe are conductively connected to interface terminals on the semiconductor substrate to allow test signals to be input and output from the multiprobe device during testing. The multiprobe semiconductor substrate is also capable of containing onboard circuitry including buffers and logic circuitry for processing the test signals to be sent to and received from the device under test. A multiprobe testing device is also disclosed that includes the multiprobe semiconductor substrate with elevated contacts to allow for the testing of a semiconductor device.
-
Citations
39 Claims
-
1. A testing socket for electrical testing of devices, each having a substantially planar surface with an array of conductive pads disposed thereon comprising:
-
(a) a holder for holding a said device in a fixed position; (b) a probe for contacting said device pads, said probe including a substantially planar semiconductor substrate with electrically conductive semiconductor projections integral with said substrate and disposed in an array corresponding to a mirror image of said array of pads; and (c) circuit means connected to said projections for testing of said device when said probe projections contact said pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 14, 15, 16, 17, 31)
-
-
12. A probe for electrical contact to an array of pads comprising:
-
(a) a substantially planar semiconductor substrate; and (b) electrically conductive semiconductor projections integral with said substrate and disposed on a surface of said substrate, said projections being arrayed in correspondence with said array of pads. - View Dependent Claims (13, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 32, 33, 34, 35, 36, 37, 38, 39)
-
Specification