Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys

• US 4,587,097 A
• Filed: 06/22/1984
• Issued: 05/06/1986
• Est. Priority Date: 06/22/1984
• Status: Expired due to Term

• Current Assignee: Metglas, Inc. (Proterial Ltd.)
• Original Assignee: Allied Corp. (Honeywell International Inc.)
• Inventors: Datta, Amitava, Rabinkin, Anatol
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US06/623,686
• Time in Patent Office: 683 Days
• Field of Search: 420/470, 420/473, 420/476, 420/477, 420/482, 420/483, 420/489, 420/490, 420/493, 148/432-434, 148/411-413, 428/606, 228/263.18, 75/251
• US Class Current: 420/473
• CPC Class Codes: B23K 35/0233 Sheets, foils B23K35/0244 takes precedence
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/302 Cu as the principal constituent
• CPC Class Codes: Y10T 428/12431 Foil or filament smaller than 6 mils

Abstract

A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.

Claims

1. A homogeneous, ductile metal alloy having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities.

2. A metal alloy composition as recited in claim 1, wherein said composition is in the form of a foil.

3. A metal alloy composition as recited in claim 1, wherein said composition is in the form of a powder.

4. A metal alloy composition as recited in claim 1, having a composition consisting essentially of about 10 to 12 atom percent manganese, about 10 to 12 atom percent silicon, about 3 to 5 atom percent tin, about 4 to 10 atom percent zinc, about 2 to 5 atom percent silver, about 1 to 5 atom percent indium and about 51 to 70 atom percent copper.

5. A metal alloy as recited in claim 1, having a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 5 atom percent silver and about 63 atom percent copper.

6. A metal alloy as recited in claim 1, having a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 3 atom percent silver, about 1 atom percent indium and about 64 atom percent copper.

7. A metal alloy as recited in claim 1, having a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 percent tin, about 4 percent zinc, about 5 atom percent indium and about 63 atom percent copper.

8. A homogeneous ductile brazing foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities.

9. A brazing foil as recited in claim 8, wherein said foil has a composition consisting essentially of about 10 to 12 atom percent manganese, about 10 to 12 atom percent silicon, about 3 to 5 atom percent tin, about 4 to 10 atom percent zinc, about 2 to 5 atom percent silver, about 1 to 5 atom percent indium and about 51 to 70 atom percent copper.

10. A brazing foil as recited in claim 8, having a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 5 atom percent silver and about 63 atom percent copper.

11. A brazing foil as recited in claim 8, having a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 3 atom percent silver, about 1 atom percent indium and about 64 atom percent copper.

12. A brazing foil as recited in claim 8, having a composition consisting essentially of about 12 atom percent manganese, about 12 percent silicon, about 4 percent tin, about 4 percent zinc, about 5 atom percent indium and about 63 atom percent copper.

14. The process of claim 12 in which the foil has a composition consisting essentially of about 10 to 12 atom percent manganese, about 10 to 12 atom percent silicon, about 3 to 5 atom percent tin, about 4 to 10 atom percent zinc, about 2 to 5 atom percent silver, about 1 to 5 atom percent indium and about 51 to 70 atom percent copper.

13. A process for fabricating homogeneous, ductile foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities, which process comprises forming a melt of the composition and quenching the melt on a rotating chill block at a rate of at least about 10⁵ °

C./sec.

15. A product produced by the process of claim 13.

16. The process of claim 13 in which the foil has a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 3 atom percent silver, about 1 atom percent indium and about 64 atom percent copper.

17. A process for joining together two or more metal parts which comprises:

(a) interposing a filler metal between the metal parts to form an assembly, the filler metal having a melting point less than that of any of the parts;

(b) heating the assembly to at least the melting temperature of the filler metal; and

(c) cooling the assembly;

wherein the improvement comprises employing, as the filler metal, a homogeneous, ductile copper based foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent.

18. The process of claim 17 in which the filler metal foil has a composition consisting essentially of about 10 to 12 atom percent manganese, about 10 to 12 atom percent silicon, about 3 to 5 atom percent tin, about 4 to 10 atom percent zinc, about 2 to 5 atom percent silver, about 1 to 5 atom percent indium and about 51 to 70 atom percent copper.

19. The process of claim 18 in which the filler metal foil has a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 5 atom percent silver and about 63 atom percent copper.

20. The process of claim 18 in which the filler metal foil has a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 3 atom percent silver, about 1 atom percent indium and about 64 atom percent copper.

21. The process of claim 18 in which the filler metal foil has a composition consisting essentially of about 12 atom percent manganese, about 12 atom percent silicon, about 4 atom percent tin, about 4 atom percent zinc, about 5 atom percent indium and about 63 atom percent copper.