Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys
First Claim
1. A homogeneous, ductile metal alloy having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities.
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Accused Products
Abstract
A metal alloy consisting essentially of about 4-16 atom percent manganese, 4-16 atom percent silicon, 0-16 atom percent tin, 0-20 atom percent zinc, 0-10 atom percent silver and about 0-10 atom percent indium, the balance being copper and incidental impurities. The alloy is adapted for brazing steels, cemented carbides to steels, copper and copper alloys to steels, copper to copper and copper alloys, and composite materials to steels and copper.
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Citations
21 Claims
- 1. A homogeneous, ductile metal alloy having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities.
- 8. A homogeneous ductile brazing foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities.
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13. A process for fabricating homogeneous, ductile foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent silver and about 0 to 10 atom percent indium, the balance being copper and incidental impurities, which process comprises forming a melt of the composition and quenching the melt on a rotating chill block at a rate of at least about 105 °
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- View Dependent Claims (15, 16)
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17. A process for joining together two or more metal parts which comprises:
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(a) interposing a filler metal between the metal parts to form an assembly, the filler metal having a melting point less than that of any of the parts; (b) heating the assembly to at least the melting temperature of the filler metal; and (c) cooling the assembly;
wherein the improvement comprises employing, as the filler metal, a homogeneous, ductile copper based foil having a metastable structure and a composition consisting essentially of about 4 to 16 atom percent manganese, about 4 to 16 atom percent silicon, about 0 to 16 atom percent tin, about 0 to 20 atom percent zinc, about 0 to 10 atom percent. - View Dependent Claims (18, 19, 20, 21)
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Specification