Photo-optic transducing head assembly

• US 4,587,421 A
• Filed: 04/19/1984
• Issued: 05/06/1986
• Est. Priority Date: 04/19/1984
• Status: Expired due to Term

• Current Assignee: HEI Incorporated Victoria MN 55386 A Corporation of
• Original Assignee: HEI, Inc.
• Inventors: Robertson, David K.
• Primary Examiner(s): McIntosh, John P.
• Application Number:
  US06/601,921
• Time in Patent Office: 747 Days
• Field of Search: 250/239, 250/227, 250/221, 250/222.1
• US Class Current: 250/239
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

A photo-optic transducer assembly comprising a frame constructed to surround the peripheral edges of a ceramic hybrid circuit card such that a radiation source and a radiation responsive element coupled to said hybrid circuit card are appropriately aligned with a photo-optic light pipe assembly, also supported by said frame, the light pipe element leading to a location where sensing is to occur. The hybrid circuit card contains active and passive components (including one or more integrated circuit chips) on it for processing signals indicative of conditions being irradiated by a source of radiant energy.

Claims

1. A photoelectric transducer assembly for detecting shifts in radiant energy at a working face thereof comprising, in combination:

(a) a generally rectangular printed circuit card means having active and passive electrical components, including radiant energy source means and a radiant energy responsive means disposed thereon at spaced apart locations along a common side edge of said card;

(b) a rectangular frame member having four mutually perpendicular sidewalls defining a central opening, one of said sidewalls having spaced apart radiant energy transmissive windows;

(c) said printed circuit card means being supported within said central opening of said frame member with said radiant energy source means and said radiant energy responsive means on said common side edge of said card means being in separate alignment with said spaced apart radiant energy transmissive windows; and

(d) a bifurcated radiant energy transmissive guide means secured to said frame member, the branches of said bifurcated guide means being in alignment with said spaced apart radiant energy transmissive windows;

said guide means including a stem portion leading to said working face of said transducer assembly.

2. A photoelectric transducer assembly as in claim 1 wherein said printed circuit card means comprises:

(a) a ceramic substrate having a pattern of conductors on one or more surfaces thereof; and

(b) said active electrical components including at least one integrated circuit chip member connected to said pattern of conductors.

3. The photoelectric transducer assembly as in claim 1 wherein said printed circuit card means includes:

(a) a plurality of terminal pins affixed thereto and extending outwardly from a side edge thereof and passing through openings formed in one of said sidewalls of said frame member when said printed circuit card means is supported within said central opening.

4. The photoelectric transducer assembly as in claim 1 wherein said radiant energy transmissive guide means comprises:

(a) a bifurcated bundle of fiber optic rods embedded in an opaque block.

5. The photoelectric transducer assembly as in claim 4 wherein said opaque block is affixed to said frame member.

6. The photoelectric transducer assembly as in claim 1 wherein said radiant energy transmissive guide means comprises:

(a) a molded, bifurcated light-pipe embedded in an opaque block.

7. The photoelectric transducer assembly as in claim 4 or 6 wherein said opaque block is separable from said frame member.

8. The photoelectric transducer assembly as in claim 1 and further including:

(a) barrier means on said frame member for preventing transmission of radiant energy from said source means to said responsive means except through said guide means.

9. The photoelectric transducer assembly as in claim 1 wherein two of said sidewalls of said rectangular frame member each include an extension projecting normally to said one of said sidewalls for receiving said guide means therebetween.

10. A photoelectric transducing head assembly comprising, in combination:

(a) a hybrid electronic circuit disposed on a ceramic substrate, said circuit including active and passive components, including a light-emitting diode and a photo-transistor disposed at spaced apart locations proximate a side edge of said substrate, said components being interconnected by a pattern of printed conductors on said substrate;

(b) a plurality of regularly spaced terminal pins connected at one end to said pattern of printed conductors on said substrate and extending from another side edge of said substrate; and

(c) a generally rectangular frame member having four sidewalls defining a central opening for receiving said ceramic substrate therein, said frame member having a plurality of regularly spaced notches along one sidewall for receiving said plurality of terminal pins when said ceramic substrate is fitted into said frame, another sidewall of said frame member including light transmissive paths therethrough in alignment with said spaced apart locations.

11. The photoelectric transducing head of claim 10 and further including a light transmissive light-pipe having a common stem portion and two bifurcated arms, said arms individually joined to said spaced apart light transmissive paths in said another of said sidewalls.

12. The photoelectric transducing head of claim 11 wherein said light-pipe is embedded in a block of opaque material.

13. The photoelectric transducing head of claim 12 wherein said block of opaque material is integrally formed on said another of said side walls ofsaid frame member.

14. The photoelectric transducing head of claim 12 wherein said block of opaque material is separable from said frame member.