Plasma reactor having slotted manifold

• US 4,590,042 A
• Filed: 12/24/1984
• Issued: 05/20/1986
• Est. Priority Date: 12/24/1984
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Tegal Corp. (Rennova Health, Inc.)
• Inventors: Drage, David J.
• Primary Examiner(s): Terapane, John F.
• Assistant Examiner(s): Wolffe, Susan
• Application Number:
  US06/685,650
• Time in Patent Office: 512 Days
• Field of Search: 422/186.05, 422/186.06, 422/186.29, 156/345, 204/298, 204/192 E
• US Class Current: 422/186.06
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

A plasma reactor apparatus is disclosed in which plates having channels are used to redistribute gas uniformly over the surface of a wafer being processed in the reactor. Slot means adjacent the plates provide a final baffle to prevent jetstreams in the gas from impinging directly on the wafer.

Claims

1. A plasma reactor comprising:

a gas manifold plate having a first slot for supplying gas and a second slot for exhausting gas;

a distribution plate having a plurality of gas supply slots and a plurality of gas exhaust slots,

said plates being in contact with each other with the slots of one plate not being parallel to the slots in the other plate.

2. The apparatus as set forth in claim 1 wherein said plates each have first and second major surfaces, said slots are formed in the first major surface of each plate, and the first major surface of said gas manifold plate faces the second major surface of said distribution plate.

3. The apparatus as set forth in claim 2 wherein the slots of one plate are orthogonal to the slots of the other plate.

4. The apparatus as set forth in claim 3 wherein said distribution plate comprises a plurality of bores from one major surface to the other for interconnecting respective slots of the plates.

5. The apparatus as set forth in claim 2 wherein said distribution plate comprises slot means attached to the first major surface thereof.

6. The apparatus as set forth in claim 5 wherein said slot means at least partially overlies the slots in said distribution plate for re-directing the flow of gas from said distribution plate.

7. The apparatus as set forth in claim 6 wherein said slot means comprises the same number of slots as there are slots in said distribution plate.

8. The apparatus as set forth in claim 7 wherein the slots in said slot means are narrower than the slots in said distribution plate.

9. The apparatus as set forth in claim 2 wherein the slots in said distribution plate comprises interleaved supply and exhaust channels.

10. The apparatus as set forth in claim 1 wherein there are an odd number of slots in said distribution plate and the number of exhaust slots exceeds the number of gas supply slots.

11. A plasma reactor comprising:

a gas manifold plate having first and second major surfaces and a slot formed in said first major surface for supplying gas to a plurality of locations across said first major surface;

a distribution plate having first and second major and a plurality of bores extending through said plate from one major surface to the other;

said plates being in contact with each said bores with said locations; and

slot means on said distribution plate for deflecting the gas streams from said bores.

12. The apparatus as set forth in claim 11 wherein said slot means comprises:

a plurality of slots located in offset relationship the bores in said distribution plate.

13. The apparatus as set forth in claim 12 wherein said plurality of slots in said slot means comprises straight line segments.