Electrical component encapsulation package

• US 4,594,644 A
• Filed: 10/22/1984
• Issued: 06/10/1986
• Est. Priority Date: 10/22/1984
• Status: Expired due to Fees

• Current Assignee: Electronic Instrument & Specialty Corporation
• Original Assignee: Electronic Instrument & Specialty Corporation
• Inventors: Painter, Robert A.
• Primary Examiner(s): Tolin, G. P.
• Application Number:
  US06/663,353
• Time in Patent Office: 596 Days
• Field of Search: 174/525, 174/52 PE, 335/202, 335/278, 361/380, 361/392, 361/395, 361/399, 361/417, 361/419, 361/429, 361/400, 336/96, 338/256, 338/7, 338/275, 338/269, 338/270, 338/253
• US Class Current: 361/807
• CPC Class Codes: H01H 50/023 Details concerning sealing, e.g. sealing casing with resin
• CPC Class Codes: H05K 5/0095 hermetically-sealed

Abstract

An electrical component encapsulation package including a cover; a base including a peripheral frame with a large central hole; and support means for mounting the electrical component above and spaced from the frame for providing an open space between the frame and component for introduction and flow of encapsulating material, and to insure integrity of the electrical connections.

Claims

1. An electrical component encapsulation package comprising:

a cover;

a base including a peripheral frame removable engaging said cover and having a large central hole and a channel which includes a first surface removably engaging the bottom edge surface of said cover and a second surface removably engaging the inside surface of said cover for centering and sealing the cover;

an electrical component; and

non-conductive support means integral with said electrical component and connected to said frame and mounting said component above and spaced from said frame and providing an open space between the frame and component which is filled by encapsulating material.

2. The package of claim 1 in which electrical connection pins are mounted on said frame.

3. The package of claim 1 in which said support means include a raised section of said frame.

4. The package of claim 1 in which said frame includes a raised section which extends about said frame and forms a shoulder for centering and sealing said cover.

5. An electrical component encapsulation package comprising:

a cover;

a base including a peripheral frame removably engaging said cover and having a large central hole and a channel which includes a first surface removably engaging the bottom edge surface of said cover and a second surface removably engaging the inside surface of said cover for centering and sealing the cover;

an electrical component; and

nonconductive support means integral with said frame and connected to said component and mounting said component above and spaced from said frame and providing an open space between the frame and the component which is filled by encapsulating material.

6. The package of claim 5 in which electrical connection pins are mounted on said frame.

7. The package of claim 5 in which said support means include a raised section of said frame.

8. The package of claim 5 in which said frame includes a raised section which extends about said frame and forms a shoulder for centering and sealing said cover.