Chemical etching of a semiconductive wafer by undercutting an etch stopped layer

• US 4,597,003 A
• Filed: 12/01/1983
• Issued: 06/24/1986
• Est. Priority Date: 12/01/1983
• Status: Expired due to Fees

• Current Assignee: Barry Block, Harry E. Aine
• Original Assignee: Barry Block, Harry E. Aine
• Inventors: Block, Barry, Aine, Harry E.
• Primary Examiner(s): Kimlin, Edward
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US06/556,832
• Time in Patent Office: 936 Days
• Field of Search: 156/345, 156/628, 156/644, 156/647, 156/648, 156/649, 156/650, 156/651, 156/654, 156/657, 156/659.1, 156/662, 156/655, 148/1.5, 29/580, 29/584, 29/586, 29/594, 29/595, 29/610 SG, 338/2, 338/4, 338/42, 338/47, 73/510, 73/517 R, 73/514, 73/726, 73/754, 357/26, 357/55, 204/129.65, 204/129.1, 204/325
• US Class Current: 428/450
• CPC Class Codes: H01L 21/30608 Anisotropic liquid etching H01L21/3063 takes precedence
• CPC Class Codes: H01L 21/3081 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/3086 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: Y10T 29/49103 Strain gauge making

Abstract

Three dimensional single crystalline structures, such as folded cantilever beams supported from a frame and supporting a central structure free to move relative to the frame, are fabricated by anisotropically etching through openings in etch stop layers on opposite sides of the substrate wafer. The openings are patterned and aligned so that the etch stop layers are undercut to define etch stop portions interconnected by unetched substrate material.

Claims

1. In a method for making three-dimensional structures by chemical etching of a semiconductive wafer, the steps of:

providing a pair of etch stopped layers on opposite major faces of a semiconductive wafer of semiconductive material;

introducing an etchant through openings in both of said etch stopped layers;

etching the substrate semiconductor through said openings in both etch stopped layers to undercut substantial portions of both of said etch stopped layers;

terminating the etch of substrate material so as to leave undercut structure in both of said etch stopped layers interconnected by interconnecting substrate semiconductive material whereby a three-dimensional structure is made; and

patterning the openings of said etch stopped layers to define a frame structure and cantilever beam portions of said etch stopped layers on both sides of said wafer, said cantilever beam portions being undercut by said etchant when the etch is terminated, one end of the undercut cantilever beam portions being supported from the frame structure and the other ends being supported from said interconnecting substrate material which is free to move relative to said frame structure by bending of the undercut cantilever beam portions.

2. The method of claim 1 wherein said substrate material and said etch stopped layers are of single crystalline semiconductive material.

3. The method of claim 2 wherein said etch stopped layers of single crystalline material are of opposite conductivity type to that of said substrate semiconductive material, whereby rectifying junctions are formed at the interface of said etch stopped layers with said substrate semiconductive material.

4. The method of claim 2 wherein said etch stopped layers of single crystalline material are doped with an impurity current carrier dopant to a sufficient concentration so as to cause said layers to exhibit the etch stopped characteristic to the etchant introduced through the openings in said etch stopped layers.

5. The method of claim 2 wherein the step of etching the substrate material includes etching said substrate material completely through the thickness of the substrate portion of the wafer.

6. The method of claim 3 including the step of applying an etch stop potential to said layers relative to the potential of said substrate material to cause said layers to exhibit the etch stop characteristic for the etchant introduced through the openings in said layers.

7. The method of claim 2 wherein said major faces of said wafer constitute the (100) crystal faces of the single crystalline diamond cubic type substrate semiconductive material.

8. The product made by method of claim 1.

9. The product made by the method of claim 2.

10. The method of claim 1 wherein the openings in both of said etch stopped layers are patterned so that the cantilever beam portions are folded back onto themselves in the plane of the respective etch stopped layers, and the free ends of said folded cantilever beam portions on opposite sides of said wafer are interconnected by substrate material free to move relative to said frame structure by bending of said cantilever beam portions.