Multiplexed-access scan testable integrated circuit

• US 4,602,210 A
• Filed: 12/28/1984
• Issued: 07/22/1986
• Est. Priority Date: 12/28/1984
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: General Electric Company
• Inventors: Shen, John P., Fasang, Patrick P.
• Primary Examiner(s): Karlsen, Ernest F.
• Application Number:
  US06/687,357
• Time in Patent Office: 571 Days
• Field of Search: 324/73 R, 324/73 AT, 324/158 R, 307/440, 307/445, 371/15, 371/16, 371/25
• US Class Current: 714/731
• CPC Class Codes: G01R 31/318572 Input/Output interfaces

Abstract

A testable integrated circuit contains additional circuitry which defines--when operable in a test mode--a plurality of scan paths in each of which are connected in series a plurality of bistable elements (specifically, special scan path flip-flops) isolated from the integrated circuit combinational circuits. The input and output ends of these scan paths are connected by multi-level demultiplexer and multiplexer arrangements with the input and output pins, respectively, of the integrated circuit. The last level demultiplexer and the last level multiplexer include first groups of connections with the input and output ends of the scan paths, respectively, and second groups of connections with the input and output ends of the mission logic. The demultiplexers, the multiplexers and the scan path flip-flops are operable between mission and test modes upon the application of a mode control signal thereto. When the circuit is in the test mode, a test signal applied to the inputs of the scan paths is monitored at the output ends of the paths to indicate the correctness of operation of the SPFF'"'"'s in each path. Composite test vectors are then applied for testing the combinational circuits via the SPFF'"'"'s and primary inputs to the said combinational circuits.

Claims

1. A testable digital integrated circuit chip having input and output pins, respectively, comprising

(a) a plurality of bistable circuit elements;

(b) a plurality of combinational circuit elements;

(c) first means operable in a mission mode for connecting said bistable and combinational circuit elements to define mission logic means having input and output ends;

(d) second means operable in a test mode for connecting groups of said bistable elements in series to define a plurality of serial scan paths isolated from said combinational circuit elements, each of said scan paths having input and output ends;

(e) first level demultiplexer means having outputs connected with the input ends of said serial scan paths, respectively, said first demultiplexer means having input means;

(f) second level demultiplexer means having first outputs connected with said first demultiplexer input means, respectively, and second outputs connected with the input end of said mission logic functions, respectively, said second demultiplexer means having input means connected with the chip input pins;

(g) first level multiplexer means having a plurality of inputs connected with the output ends of said scan paths, respectively, said first multiplexer means having output means;

(h) second level multiplexer means having first inputs connected with the first multiplexer output means, respectively, and a second set of inputs connected with the output ends of said mission logic functions, respectively, said second multiplexer means having output means connected with the chip output pins;

(i) mode control means for operating said demultiplexing and multiplexing means to switch said integrated circuit between said mission and test modes;

(j) means for applying a test signal to said input pins when said integrated circuit is in the test mode; and

(k) means for monitoring the resultant test signal appearing at the integrated circuit output pins.

2. Apparatus as defined in claim 1, wherein each of said bistable elements includes flip-flop multiplexer means operable by said mode control means to switch said bistable element between mission and test operating modes, whereby each bistable element constitutes a scan path flip-flop.

3. Apparatus as defined in claim 2, and further including clock means for applying clock signals to said scan path flip-flops when the integrated circuit is in the test and mission modes.

4. Apparatus as defined in claim 3, wherein each of said scan path flip-flops includes series-connected master and slave latch means.

5. Apparatus as defined in claim 4, wherein said clock means comprises a two-phase clock for clocking said master and slave latches, respectively.

6. Apparatus as defined in claim 5, wherein said test signal applying means is operable to initially apply a binary test pattern to the input of each of said scan paths, said scan path being clocked a number of times corresponding with the number of scan path flip-flops contained in the scan path, plus the number of bits of said binary test pattern.

7. Apparatus as defined in claim 6, wherein said test signal applying means is subsequently operable to apply to the scan path inputs a composite vector signal a first part of which is operable to condition the combinational circuits via the scan path flip-flops, and a second part of which is operable to test the combinational circuits.

8. The method of testing the bistable and combinational circuit elements of an integrated circuit chip normally connected to define an operational function mission logic, each bistable element comprising a scan path flip-flop operable between mission and test modes, which comprises the steps of

(a) connecting groups of the scan path flip-flops in a test mode to define a plurality of scan paths isolated from the combinational elements;

(b) alternately connecting said scan paths and said mission logic between the input and output pins of the integrated circuit by multi-level multiplexer means operable between test and mission modes, respectively;

(c) applying a control signal to place said scan path flip-flops and said multiplexer means in the test mode;

(d) applying a binary test pattern signal to the inputs of said scan paths via the input pins of the integrated circuit;

(e) clocking each scan path a number of times corresponding to the number of scan path flip-flops contained in the scan path, plus the number of bits in said binary test pattern; and

(f) monitoring the output of each scan path via the integrated circuit output pins, thereby to determine the correct operation of the bistable elements of the scan paths, respectively.

9. The method as defined in claim 8, and further including the steps of

(g) subsequently applying to the inputs of the scan paths when the integrated circuit is in the test mode composite vectors containing a first part operable to condition the combinational circuits via the scan path flip-flops, and a second part for testing the combinational circuits;

(h) applying a control signal to place the integrated circuit in the mission mode;

(i) clocking the integrated circuit once to capture into the scan path flip-flops the conditions of the combinational circuits;

(j) applying a control signal to place the integrated circuit in the test mode;

(k) clocking the circuit a number of times corresponding to the number of scan path flip-flops in each scan path; and

(l) monitoring the outputs to determine the operating conditions of the combinational circuits.